R423 - Reliability Data

Reliability Data Report
Product Family R423
LT1490A / LT1491A / LT1678 / LT1679 /
LT1716 / LT1880 / LT1990 / LT1991 /
LT1996 / LT6010 / LT6011 / LT6012 /
LT6013 / LT6014 / LT6106 / LT6107
Reliability Data Report
Report Number: R423
Report generated on: Tue Apr 16 14:44:37 PDT 2013
OPERATING LIFE TEST
PACKAGE TYPE
QFN/DFN
PLASTIC DIP
SOIC/SOT/MSOP
Totals
SAMPLE SIZE
154
308
1970
2,432
OLDEST DATE
NEWEST DATE
K DEVICE HRS
1
CODE
CODE
(+125°C)
0318
9952
9950
-
0421
9952
1202
-
154
308
1890
2,352
No. of FAILURES
2,3
0
0
0
0
HIGHLY ACCELERATED STRESS TEST AT +131 DEG C / 85% RH
PACKAGE TYPE
SOIC/SOT/MSOP
Totals
SAMPLE SIZE
112
112
OLDEST DATE
NEWEST DATE
K DEVICE HRS
No. of FAILURES
4
CODE
CODE
(+85°C)
0727
-
0727
-
215
215
0
0
K DEVICE HRS
No. of FAILURES
PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C
PACKAGE TYPE
SAMPLE SIZE
QFN/DFN
SSOP/TSSOP
PLASTIC DIP
SOIC/SOT/MSOP
Totals
3284
100
300
11142
14,826
OLDEST DATE
NEWEST DATE
CODE
CODE
0231
0331
0007
9950
-
1010
0331
0310
1120
-
728
33
22
1064
1,847
0
0
0
0
0
OLDEST DATE
NEWEST DATE
K DEVICE
No. of FAILURES
CODE
CODE
CYCLES
0231
0331
0013
0310
-
1110
0331
1120
0732
-
1797
50
2728
35
4,610
0
0
0
0
0
OLDEST DATE
NEWEST DATE
K DEVICE
No. of FAILURES
CODE
CODE
CYCLES
0231
0331
0115
0732
-
1110
0331
1120
0732
-
1728
50
1979
5
3,762
TEMP CYCLE FROM -65 TO 150 DEG C
PACKAGE TYPE
SAMPLE SIZE
QFN/DFN
SSOP/TSSOP
SOIC/SOT/MSOP
PLASTIC DIP
Totals
3687
50
8233
150
12,120
THERMAL SHOCK FROM -65 TO 150 DEG C
PACKAGE TYPE
SAMPLE SIZE
QFN/DFN
SSOP/TSSOP
SOIC/SOT/MSOP
PLASTIC DIP
Totals
2398
50
6821
50
9,319
(1) Assumes Activation Energy = 1.0 Electron Volts
(2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =0.78 FITS
(3) Mean Time Between Failure in Years = 146461.61
(4) Assumes 20X Acceleration from 85 °C to +131 °C
Note 1: 1 FIT = 1 Failure in One Billion Hours.
Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL 3/4 Preconditioning
0
0
0
0
0
Reliability Data Report
Report Number: R423
Report generated on: Tue Apr 16 14:44:37 PDT 2013
HIGH TEMPERATURE BAKE AT 175 DEG C
PACKAGE TYPE
SAMPLE SIZE
SOIC/SOT/MSOP
Totals
150
150
OLDEST DATE
NEWEST DATE
K DEVICE HRS
No. of FAILURES
CODE
CODE
1019
-
1019
-
150
150
0
0
OLDEST DATE
NEWEST DATE
K DEVICE HRS
No. of FAILURES
CODE
CODE
0819
-
1019
-
213
213
0
0
HIGH TEMPERATURE BAKE AT 150 DEG C
PACKAGE TYPE
SAMPLE SIZE
SOIC/SOT/MSOP
Totals
213
213