EClamp2454P Datasheet

EClamp2456P
ESD/EMI Protection
for Color LCD Interfaces
PRELIMINARY
PROTECTION PRODUCTS - EMIClampTM
Description
Features
The EClampTM2456P is a (L-C) low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics.
They have been optimized for protection of color
LCD and camera lines in cellular phones and other
portable electronics.
‹ Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
‹ ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
‹ Filter performance: 40dB minimum attenuation at
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The device consists of six identical circuits comprised
of TVS diodes for ESD protection, and a 5-pole inductor - capacitor network for EMI/RFI filtering. A typical
inductor value of 28nH and a capacitor value of 12pF
are used to achieve 40dB minimum attenuation at
800MHz. The TVS diodes provide effective suppression
of ESD voltages in excess of ±15kV (air discharge) and
±8kV (contact discharge) per IEC 61000-4-2, level 4.
800MHz to 2.7GHz
TVS working voltage: 5V
Inductor: 28nH (Typical)
Capacitance: 12pF (Typical at VR = 2.5V)
Protection and filtering for six lines
Solid-state technology
Mechanical Characteristics
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The EClamp2456P is in a 12-pin, RoHS/WEEE compliant, SLP3016P12 package. It measures 3.0 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small package makes it ideal for use in portable electronics such
as cell phones, digital still cameras, and PDAs.
SLP3016P12 12-pin package
RoHS/WEEE Compliant
Nominal Dimensions: 3.0 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead finish: NiPd
Marking: Marking Code
Packaging: Tape and Reel per EIA 481
Applications
‹ Color LCD Protection
‹ Cell Phone CCD Camera Lines
‹ Clamshell Cell Phones
Package Configuration
Circuit Diagram (Each Line)
3.00
1 2
L1
L2
IN
1.60
OUT
C1
C2
C3
0.50 BSC
GND
0.58
12 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
Device Schematic (6X)
Revision 03/29/2006
1
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EClamp2456P
PRELIMINARY
PROTECTION PRODUCTS
Maximum Ratings
R ating
Symbol
Value
Units
VESD
+/- 20
+/- 15
kV
Junction Temp erature
TJ
125
o
Op erating Temp erature
Top
-40 to +85
o
Storage Temp erature
TSTG
-55 to +150
o
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
C
C
C
Electrical Characteristics (T=25oC)
P ar am et er
S y m b ol
Con d i t i on s
T VS Reverse Stand-Off Voltage
VRWM
T VS Reverse Breakdown Voltage
V BR
It = 1mA
IR
VRWM = 3.3V
T VS Reverse Leakage Current
DC Resistance
RDC
Filter Cut-Off Frequency
fc
Inductance
L
Mi n i mu m
6
ZSource = ZLoad = 50 Ohms
Ty p i c a l
8
M ax i m u m
Units
5
V
10
V
0.1
µA
33
Ohms
155
MHz
28
nH
56
nH
L1 + L2
Each Line
Capacitance
C1 , C2 , C3
VR = 2.5V, f = 1MHz
10
12
15
pF
Total Capacitance
C1 + C2 +
C3
Input to Gnd,
Each Line
VR = 2.5V, f = 1MHz
30
36
45
pF
Total Series Inductance
 2006 Semtech Corp.
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EClamp2456P
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21 (Each Line)
CH1 S21
LOG
Analog Crosstalk (Each Line)
6 dB / REF 0 dB
CH1 S21
1: -5.3134 dB
156 MHz
0 dB
-6 dB
LOG
20 dB /REF 0 dB
2: -41.559 dB
800 MHz
1
3: -41.327 dB
1.8 GHz
-12 dB
-18 dB
4: -40.105 dB
2.7 GHz
-24 dB
-30 dB
-36 dB
4
-42 dB
2
3
-48 dB
-54 dB
1
MHz
100
MHz
10
MHz
1
3
GHz GHz
START . 030 MHz
STOP 3000. 000000 MHz
STOP 3000. 000000 MHz
START. 030 MHz
ESD Clamping (+8kV Contact)
ESD Clamping (-8kV Contact)
Note: Data is taken with a 10x attenuator
Note: Data is taken with a 10x attenuator
Capacitance vs. Reverse Voltage
(Normalized to 2.5 volts)
2
CJ(VR) / CJ(VR=0)
1.5
1
0.5
f = 1 MHz
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Reverse Voltage - VR (V)
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EClamp2456P
PRELIMINARY
PROTECTION PRODUCTS
Device Connection
The EClamp2456P is comprised of six identical circuits
each consisting of a low pass filter for EMI/RFI suppression and dual TVS diodes for ESD protection. The
device is in a 12-pin SLP package. Electrical connection is made to the 12 pins located at the bottom of
the device. A center tab serves as the ground connection. The device has a flow through design for easy
layout. Pin connections are noted in Figure 1. All path
lengths should be kept as short as possible to minimize
the effects of parasitic inductance in the board traces.
Recommendations for the ground connection are given
below.
Figure 1 - Pin Identification and Configuration
(Top Side View)
In 1
In 2
In 3
In 4
In 5
In 6
Ground Connection Recommendation
Parasitic inductance present in the board layout will
affect the filtering performance of the device. As
frequency increases, the effect of the inductance
becomes more dominant. This effect is given by
Equation 1.
Equation 1: The Impedance of an Inductor at
Frequency XLF
XLF(L, f ) = 2 * π * f * L
Out 1
Out 2
Out 3
Out 4
Out 5
Out 6
12
GND
6
7
Pin
Identification
1-6
Inp ut Lines
7 - 12
Outp ut Lines
Center Tab
Ground
Figure 2 - Inductance of Rectangular Wire Loops
Where:
L= Inductance (H)
f = Frequency (Hz)
Ground
Via 1
Ground
Via 2
d
Via connections to the ground plane form rectangular
wire loops or ground loop inductance as shown in
Figure 2. Ground loop inductance can be reduced by
using multiple vias to make the connection to the
ground plane. Bringing the ground plane closer to the
signal layer (preferably the next layer) also reduces
ground loop inductance. Multiple vias in the device
ground pad will result in a lower inductive ground loop
over two exterior vias. Vias with a diameter d are
separated by a distance y run between layers separated by a distance x. The inductance of the loop path
is given by Equation 2. Thus, decreasing distance x
and y will reduce the loop inductance and result in
better high frequency filter characteristics.
 2006 Semtech Corp.
1
Signal Layer
x
Ground Layer
Layer
y
Equation 2: Inductance of Rectangular Wire Loop
[
LRECT(d, x , y) = 10.16 *10 −9 * x * ln
[ ] + y * ln[ ]]
2*y
d
2*x
d
Where:
d = Diameter of the wire (in)
x = Length of wire loop (in)
y = Breath of wire loop (in)
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EClamp2456P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Figure 4 - Filter Characteristics Using Recommended
Layout with Internal Vias
Figure 3 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches
(0.20 mm) while the two external vias have a diameter
of 0.010 inches (0.250mm). The internal vias are
spaced approximately evenly from the center of the
pad. The designer may choose to use more vias with a
smaller diameter (such as 0.005 inches or 0.125mm)
since changing the diameter of the via will result in
little change in inductance (i.e. the log function in
Equation 2 in highly insensitive to parameter d) .
Figure 4 shows a typical insertion loss (S21) plot for
the device using Semtech’s filter evaluation board with
50 Ohm traces and the recommended via configuration.
CH1 S21
LOG
6 dB / REF 0 dB
1: -5.3134 dB
156 MHz
0 dB
-6 dB
2: -41.559 dB
800 MHz
1
3: -41.327 dB
1.8 GHz
-12 dB
-18 dB
4: -40.105 dB
2.7 GHz
-24 dB
-30 dB
-36 dB
4
-42 dB
2
3
-48 dB
-54 dB
Figure 3 - Recommended Layout Using Ground Vias
1
MHz
START. 030 MHz
 2006 Semtech Corp.
5
10
MHz
100
MHz
3
1
GHz GHz
STOP 3000. 000000 MHz
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EClamp2456P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information - Spice Model
EClamp2456P Spice Model & Parameters
Line In
0.7nH
0.7nH
L
Line Out
56nH
EClamp2456P Spice Model
Table 1 - EClamp2456P Spice Parameters
 2006 Semtech Corp.
Parameter
Unit
D1 (T VS)
D2 (T VS)
IS
Amp
4.09E-15
4.09E-15
BV
Volt
7.44
7.44
VJ
Volt
0.744
0.744
RS
Ohm
0.584
0.584
IB V
Amp
1E-3
1E-3
CJO
Farad
31E-12
31E-12
TT
sec
2.541E-9
2.541E-9
M
--
0.23
0.23
N
--
1.1
1.1
EG
eV
1.11
1.11
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EClamp2456P
PRELIMINARY
PROTECTION PRODUCTS
Outline Drawing - SLP3016P12
A
B
D
DIM
E
PIN 1
INDICATOR
(LASER MARK)
A
SEATING
PLANE
aaa C
A1
A2
C
D1
1
A
A1
A2
b
D
D1
E
E1
e
L
N
aaa
bbb
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.020 .023 .026
.000 .001 .002
(.006)
.007 .010 .012
.114 .118 .122
.083 .087 .091
.059 .063 .067
.010 .016 .020
.020 BSC
.011 .013 .015
12
.003
.004
0.50 0.58 0.65
0.00 .003 0.05
(0.15)
0.20 0.25 0.30
2.90 3.00 3.10
2.10 2.20 2.30
1.50 1.60 1.70
0.25 0.40 0.50
0.50 BSC
0.28 0.33 0.38
12
0.08
0.10
2
LxN
E/2
E1
N
bxN
e
bbb
C A B
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP3016P12
P
X
Z
F
G
Y
(C)
DIM
B
C
F
G
P
X
Y
Z
DIMENSIONS
INCHES
MILLIMETERS
.091
2.30
.060
1.52
.018
0.45
.035
0.89
.020
0.50
.012
0.30
.025
0.63
.085
2.15
B
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET
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EClamp2456P
PRELIMINARY
PROTECTION PRODUCTS
Marking
Ordering Information
2456P
PIN 1
INDICATOR
(LASER MARK)
YW
Part Number
Qty per
Reel
Reel Size
EClamp2456P.TCT
3000
7 Inch
This is a lead-free RoHS/WEEE Compliant Device
EMIClamp and EClamp are marks of Semtech Corporation
YW = Date Code (Y=Year, W=Week)
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0
1.78 +/-0.05 mm
B0
K0
3.18 +/-0.05 mm
0.76 +/-0.05 mm
Tape
Width
B, (Max)
D
D1
8 mm
4.2 mm
(.165)
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
0.8 mm
±0.05
(.031)
E
1.750±.10
mm
(.069±.004)
F
K
(MAX)
P
P0
P2
T(MAX)
W
3.5±0.05
mm
(.138±.002)
2.4 mm
(.094)
4.0±0.1
mm
(.157±.004)
4.0±0.1
mm
(.157±.004)
2.0±0.05mm
(.079±.002)
0.4 mm
(.016)
8.0 mm
+ 0.3 mm
- 0.1 mm
(.312±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
 2006 Semtech Corp.
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