EClamp2465T Datasheet

EClamp2465T
Low Capacitance
ESD/EMI Protection for SIM Card
PRELIMINARY
PROTECTION PRODUCTS - EMIClampTM
Description
Features
The EClampTM2465T is a combination EMI filter and line
termination device with integrated TVS diodes for use on
SIM Card interfaces on cellular phones and other portable electronics. This state-of-the-art device utilizes
solid-state silicon-avalanche technology for superior
clamping performance and DC electrical characteristics.
‹ Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
‹ ESD protection to IEC 61000-4-2 (ESD) Level 4,
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The device consists of three circuits that include series
impedance matching resistors for proper termination of
the SIM card interface. Termination resistor value of
100 Ohms is included on the Reset and Data lines and
47 Ohms on the CLK line. TVS diodes are also included
on each line for ESD protection in excess of ±15kV (air
discharge) and ±8kV (contact discharge) per IEC 610004-2, level 4. An additional TVS diode connection is
included for protection of the voltage (Vcc) bus.
±15kV (air), ±8kV (contact)
TVS working voltage: 5V
Termination Resistors: 100 Ohms & 47 Ohms
Capacitance: 10pF (Typical at VR = 0V)
Protection and filtering for four lines
Solid-state technology
Mechanical Characteristics
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The EClamp2465T is in a 8-pin, RoHS/WEEE compliant,
SLP1713P8T package. It measures 1.7 x 1.3 mm with
a nominal height of only 0.4mm. The leads are spaced
at a pitch of 0.4mm and are finished with lead-free
NiPdAu. The small package makes it ideal for use in
portable electronics such as cell phones and digital still
cameras.
SLP1713P8T 8-pin package
RoHS/WEEE Compliant
Nominal Dimensions: 1.7 x 1.3 x 0.40 mm
Lead Pitch: 0.4mm
Lead finish: NiPdAu
Marking: Marking Code + Date Code
Packaging: Tape and Reel
Applications
‹ SIM Card
‹ Cell Phone
‹ PDAs and Smartphones
Package Configuration
Pin Configuration
1.70
1 2
Data to Connector
1
8
CLK to Connector
1.30
CLK to IC
Gnd
Reset to IC
Reset to Connector
NC
Data to IC
4
5
0.40 BSC
Vcc to Connector
0.40
Pin Identification and Configuration
(Top Side View)
Revision 09/24/2008
8 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1
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EClamp2465T
PRELIMINARY
PROTECTION PRODUCTS
Pin Identification and Configuration
Pin
Symbol
Identification
1
Data
Data Input (SIM Connector Side)
2
CLK
Clock Input (SIM Connector Side)
3
Reset
Reset Input (SIM Connector Side)
4
NC
N o Connect
5
Vcc
Power Supply ESD Protection
(SIM Connector Side)
6
Reset
Reset Output (IC Side)
7
CLK
Clock input (IC Side)
8
Data
Data Output (IC Side)
Center
tab
GN D
Ground connection
8
7
6
5
3
4
Gnd
1
2
Pin Configuration (Top View)
Schematics & Component Values
Vcc (Pin 5)
100 Ω
Data to IC
Data to Connector
(Pin 1)
47 Ω
(Pin 8)
CLK to IC
CLK to Connector
(Pin 7)
(Pin 2)
100 Ω
Reset to IC
Reset to Connector
(Pin 6)
(Pin 3)
GND TAB
© 2008 Semtech Corp.
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EClamp2465T
PRELIMINARY
PROTECTION PRODUCTS
Maximum Ratings
R ating
Symbol
Value
Units
VESD
+/- 18
+/- 10
kV
Junction Temp erature
TJ
125
o
Op erating Temp erature
Top
-40 to +85
o
Storage Temp erature
TSTG
-55 to +150
o
ESD p er IEC 61000-4-2 (Air)1
ESD p er IEC 61000-4-2 (Contact)
C
C
C
Electrical Characteristics (T=25oC)
P ar am et er
S y m b ol
Con d i t i on s
Mi n i mu m
Ty p i c a l
M ax i m u m
Units
5
V
10
V
0.5
μA
T VS Reverse Stand-Off Voltage
VRWM
T VS Reverse Breakdown Voltage
V BR
It = 1mA
IR
VRWM = 5.0V
Reset Series Resistors
RRST
Each Line
85
100
115
Ohms
Clk Series Resistors
R
CLK
Each Line
40
47
55
Ohms
Data Series Resistors
RDATA
Each Line
85
100
115
Ohms
Cin
Inp ut to Gnd,
Each Line
VR = 0V, f = 1MHz
8
10
12
pF
T VS Reverse Leakage Current
Total Cap acitance
6
8
Note: 1) ESD input at Pins 1, 2, 3, 5
© 2008 Semtech Corp.
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EClamp2465T
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21 (Pin 2 to 7)
CH1 S21
LOG
Typical Insertion Loss S21 (Pin 1 to 8 and Pin 3 to 6)
CH1 S21
6 dB / REF 0 dB
LOG
6 dB / REF 0 dB
1: -8.7516 dB
506.218 MHz
1: -6.33460 dB
537.824 MHz
0 dB
-6 dB
1
2
-12 dB
0 dB
2: -11.352 dB
800 MHz
3: -9.1592 dB
900 MHz
-6 dB
3: -12.208 dB
900 MHz
1
-12 dB
3
4: -14.622 dB
1.8 GHz
4
-18 dB
2: -8.4201 dB
800 MHz
4: -17.795 dB
1.8 GHz
2
3
-18 dB
5
4
5: -18.026 dB
2.7 GHz
-24 dB
5: -20.591 dB
2.5 GHz
-24 dB
-30 dB
-30 dB
-36 dB
-36 dB
-42 dB
-42 dB
-48 dB
4
1
MHz
10
MHz
100
MHz
-48 dB
3
1
GHz GHz
STOP 3000. 000000 MHz
START.030 MHz
1
MHz
10
MHz
100
MHz
START. 030 MHz
ESD Clamping (+8kV Contact)
3
1
GHz GHz
STOP 3000. 000000 MHz
ESD Clamping (-8kV Contact)
Note: Data is taken with a 10x attenuator
Note: Data is taken with a 10x attenuator
Normalized Capacitance vs. Reverse Voltage
1.1
1
0.9
C J(VR) / CJ(VR=0)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
f = 1 MHz
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Reverse Voltage - VR (V)
© 2008 Semtech Corp.
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EClamp2465T
PRELIMINARY
PROTECTION PRODUCTS
Device Connection
Figure 1 - Pin Identification and Configuration
(Top Side View)
The EClamp2465T designed with ease of layout in
mind. The package has flow through design which
allows the designer to route the signals straight in and
out between the SIM port connector and the SIM
controller. The device is in a 8-pin SLP package.
Electrical connection is made to the 8 pins located at
the bottom of the device. A center tab serves as the
ground connection. Pin connections are noted in
Figure 1. Note that the ESD protection diodes are
located at pins 1 - 3 for the data and clock lines. This
means the device is directional. Therefore, Pins 1 - 3
must be routed to the SIM connector while pins 6 - 8
are routed to the protected IC. Pin 5 is routed to the
Vcc pin of the SIM connector. Typical layout examples
are shown in Figure 3. All path lengths should be kept
as short as possible to minimize the effects of parasitic
inductance in the board traces. The center tab should
be connected directly to the ground plane. Multiple
micro-vias are recommended in the device ground pad
as shown in Figure 2. Multiple vias in the device
ground pad will result in a lower inductive ground loop,
increasing the ESD effectiveness of the device.
Data to Connector
1
8
CLK to Connector
CLK to IC
Gnd
Reset to IC
Reset to Connector
NC
Data to IC
4
5
Vcc to Connector
Figure 2 - Recommended Layout Using Ground Vias
Figure 3 - SIM Protection Layout Examples
© 2008 Semtech Corp.
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EClamp2465T
PRELIMINARY
PROTECTION PRODUCTS
Applications Information - Spice Model
Vcc (Pin 5)
100 Ω
Data to IC
Data to Connector
(Pin 1)
47 Ω
(Pin 8)
CLK to IC
CLK to Connector
(Pin 7)
(Pin 2)
100 Ω
Reset to IC
Reset to Connector
(Pin 6)
(Pin 3)
GND TAB
EClamp2465T Spice Model
Note: All TVS shown in the circuit use D1 Parameters
Table 1 - EClamp2465T Spice Parameters
© 2008 Semtech Corp.
Parameter
Unit
D1 (T VS)
IS
Amp
2E-15
BV
Volt
7.5
VJ
Volt
0.775
RS
Ohm
1.05
IB V
Amp
1E-3
CJO
Farad
9E-12
TT
sec
2.541E-9
M
--
0.246
N
--
1.1
EG
eV
1.11
6
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EClamp2465T
PRELIMINARY
PROTECTION PRODUCTS
Outline Drawing - SLP1713P8T
A
D
B
DIM
PIN 1
INDICATOR
(LASER MARK)
E
A
SEATING
PLANE
aaa C
A2
C
A1
A
A1
A2
b
D
D1
E
E1
e
L
N
aaa
bbb
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.015 .016 .017
.000 .001 .002
(.005)
.006 .008 .010
.065 .067 .070
.047 .051 .055
.049 .051 .054
.008 .012 .016
.016 BSC
.008 .010 .012
8
.003
.004
0.37 0.40 0.43
0.00 0.02 0.05
(0.13)
0.15 0.20 0.25
1.65 1.70 1.78
1.20 1.30 1.40
1.25 1.30 1.38
0.20 0.30 0.40
0.40 BSC
0.20 0.25 0.30
8
0.08
0.10
D1
2
1
LxN
E/2
E1
N
bxN
e/2
bbb
C A B
e
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP1713P8T
P
X
Z
G
DIM
C
G
H
K
P
X
Y
Z
H (C)
Y
DIMENSIONS
INCHES
MILLIMETERS
(.050)
(1.27)
.027
0.69
.012
0.30
.055
1.40
.016
0.40
.008
0.20
.023
0.58
.073
1.85
K
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
© 2008 Semtech Corp.
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EClamp2465T
PRELIMINARY
PROTECTION PRODUCTS
Marking
Ordering Information
2465T
PIN 1
INDICATOR
XXXX
Part Number
Qty per
Reel
R eel Size
EClamp 2465T.TCT
3000
7 Inch
This is a lead-free RoHS/WEEE Compliant Device
EMIClamp and EClamp are marks of Semtech Corporation
XXXX = Date Code
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0
1.51 +/-0.10 mm
B0
K0
1.91 +/-0.10 mm
0.66 +/-0.10 mm
Tape
Width
B, (Max)
D
D1
8 mm
4.2 mm
(.165)
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
0.8 mm
±0.05
(.031)
E
1.750±.10
mm
(.069±.004)
F
K
(MAX)
P
P0
P2
T(MAX)
W
3.5±0.05
mm
(.138±.002)
2.4 mm
(.094)
4.0±0.1
mm
(.157±.004)
4.0±0.1
mm
(.157±.004)
2.0±0.05mm
(.079±.002)
0.4 mm
(.016)
8.0 mm
+ 0.3 mm
- 0.1 mm
(.312±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2008 Semtech Corp.
8
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