EClamp2357NQ Datasheet

EClamp2357NQ
EMI Filter and ESD Protection
for Secure Digital Card Interfaces
PROTECTION PRODUCTS - EMIClamp®
Description
Features
®
The EClamp 2357NQ is a low pass filter array with integrated TVS diodes. It is designed to suppress unwanted
EMI/RFI signals and provide electrostatic discharge
(ESD) protection in portable electronic equipment. They
have been optimized for protection of touch screen displays, secure digital (SD) card interfaces, and color LCD
panels in cellular phones and other portable electronics.
u EMI/RFI filter with integrated ESD protection
u ESD protection to IEC 61000-4-2 (ESD) Level4,
±15kV (air), ±8kV (contact)
u Filter performance: >30dB attenuation at 1.8GHz
u TVS working voltage: 5V
u Resistor: 100Ω +/− 15%
u Component Capacitance: 10pF (VR = 0V)
u EMI & ESD protection for six lines
u Dedicated ESD protection for four lines
u Solid-state technology
u AEC-Q100 Grade 1 Qualified.
The device consists of six pi filter circuits comprised of
TVS diodes for ESD protection, and a resistor capacitor network for EMI/RFI filtering. A series resistor value
of 100Ω and a component capacitance value of 10pF
are used to achieve 20dB minimum attenuation from
1.0GHz to 3GHz. The device also includes 4 discrete
TVS diodes for dedicated ESD protection. All of the TVS
diodes provide effective suppression of ESD voltages
in excess of ±15kV (air discharge) and ±8kV (contact
discharge) per IEC 61000-4-2, level 4.
The EClamp2357NQ is qualified to AEC-Q100 Grade 1
for Automotive use.
Mechanical Characteristics
u
u
u
u
u
16 pin QFN
RoHS/WEEE Compliant
Nominal Dimensions: 3.0 x 3.0 x 1.0 mm
Lead Pitch: 0.5mm
Lead Finish: Matte Tin
u Marking: Marking Code
u Packaging: Tape and Reel per EIA 481
Applications
u
u
u
u
u
u
Package Dimensions
Touch Screen Display Interfaces
Secure Digital (SD) Memory Card Interfaces
Multimedia Card Interfaces (MCI)
Color LCD Panel Protection
Cell Phone Handsets and Accessories
Automotive Applications.
Schematic & Pin Configuration
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16 Pin QFN (Top Side View)
Nominal Dimensions (in mm)
Revision 6/24/2013
&9 .5 5
1
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EClamp2357NQ
PROTECTION PRODUCTS
Absolute Maximum Ratings
Rating
Symbol
Value
Units
VESD
±20
±12
kV
Junction Temperature
TJ
125
O
Operating Temperature
TOP
-40 to +125
O
Storage Temperature
TSTG
-55 to +150
O
ESD per IEC61000-4-2 (Air)
ESD per IEC61000-4-2 (Contact)
C
C
C
Electrical Characteristics (T=25OC unless otherwise specified)
Parameter
Symbol
Conditions
Min.
TVS Reverse Stand-Off Voltage
VRWM
TVS Reverse Breakdown Voltage
VBR
It =1mA
T = -40 to +125OC
TVS Reverse Leakage Current
IR
VRWM = 3.3V
T = -40 to +125OC
Total Series Resistance
R
Each Line
T = -40 to +125OC
Total Capacitance
CIN
Input to Gnd
Each Line
f = 1MHz
VR = 0V
2
85
Max.
Units
5
V
10
V
0.5
µA
100
115
Ω
20
22
8
pF
VR = 2.5V
 2013 Semtech Corporation.
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Typ.
12
15
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EClamp2357NQ
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21 (Each Filter)
Analog Crosstalk (Each Line)
0
0
TA = 25OC
-20
TA = 25OC
Filter Input to Output
-40
Crosstalk - CT (dB)
Insertion Loss -IL (dB)
-10
-20
-30
-60
-80
-40
-100
AR_ILvF
CTvF
-50
10
100
1000
Frequency (MHz)
-120
10000
10
1000
10000
Frequency (MHz)
ESD Clamping (+8kV Contact)
ESD Clamping (-8kV Contact)
150
50
TA = 25OC
Corrected for 40dB attenuation.
Measured with 50Ω, 40dB attenuator;
50Ω Scope Input Impedance.
0
Clamping Voltage - VC (V)
100
Clamping Voltage - VC (V)
100
50
0
-50
TA = 25OC
Corrected for 40dB attenuation.
Measured with 50Ω, 40dB attenuator;
50Ω Scope Input Impedance.
-100
AR_ESD_+8
AR_ESD_-8
-50
-150
-20
0
20
40
Time (ns)
60
80
100
-20
Capacitance vs. Temperature
0
20
40
Time (ns)
60
80
100
Series Resistance vs. Temperature
105
25
Test Current = 1mA
104
No Filter VR = 0V
Series Resistance - RS (Ω)
Junction Capacitance - CJ (pF)
20
No Filter VR = 2.5V
Filter VR = 0V
15
Filter VR = 2.5V
10
103
102
101
5
AR_RSvT
AR_CAPvT
100
0
-50
0
 2013 Semtech Corporation.
50
Temperature (OC)
100
-50
150
3
0
50
Temperature (OC)
100
150
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EClamp2357NQ
PROTECTION PRODUCTS
Typical Characteristics (Continued)
Breakdown Voltage vs. Temperature
Capacitance vs. Reverse Voltage
25
8.0
IBR = 1mA
Pin to GND
IAny
BR = 1mA
Pin 6, 8, 13 or 15 to GND
20
15
7.6
Capacitance - CJ(pf)
Breakdown Voltage - VBR (V)
7.8
TA = 25OC
f = 1 MHz
7.4
7.2
Filter Pins
Non Filter Pins
10
5
AR_CAPvV
AR_VBR_1
7.0
0
-50
0
50
Temperature (OC)
100
150
0.0
TLP Charcteristics Positive
1.0
1.5
Reverse Voltage - VR(V)
2.0
2.5
TLP Charcteristics Positive
30
0
TA = 25OC
TLP Parameters:
tp = 100ns; tr = 200ps
RDYN = 0.466Ω
Best Fit 4A to 16A
25
TA = 25OC
TLP Parameters:
tp = 100ns; tr = 200ps
RDYN = 0.248Ω
Best Fit 4A to 16A
-5
-10
TLP Current (A)
20
TLP Current (A)
0.5
15
10
-15
-20
-25
5
AR_TLP+
AR_TLP-
-30
0
0
5
10
15
TLP Voltage (V)
20
-12
25
-10
-8
-6
TLP Voltage (V)
-4
-2
0
Leakage Current vs. Temperature
Leakage Current - IR (nA)
40
30
VR = 3.3V
Pin to
6, 8,
GND
13 or 15 to GND
Filter Pins are
1, 2, 3 ,4, 5, 7, 9, 10,
11, 12, 14 and 16
Non-Filter Pins are:
6, 8, 13 and 15.
20
Non-Filter Pins
Filter Pins
10
AR_IRvT
0
-50
0
 2013 Semtech Corporation.
50
Temperature (OC)
100
150
4
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EClamp2357NQ
PROTECTION PRODUCTS
Applications Information
Device Connection
Pin Identification and Configuration (Top Side View)
The EClamp2357NQ is comprised of six circuits each
consisting of a low pass filter for EMI/RFI suppression
and dual TVS diodes for ESD protection. It also includes
4 lines of TVS diodes for ESD protection of power lines
or high speed I/O lines. The device is housed in a 16-pin
Quad Flat No-Lead (QFN) package. Electrical connection is made via 16 pins located at the bottom of the
device. A center tab serves as the ground connection.
Pin connections are noted in the table to the right. The
device is designed for easy PCB routing as shown in the
application examples. All path lengths should be kept
as short as possible to minimize the effects of parasitic
inductance in the board traces.
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Matte Tin Lead Finish
Pin
Identification
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish is
composed of 100% tin solder with large grains. Since
the solder volume on the leads is small compared to the
solder paste volume that is placed on the land pattern of
the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices
are compatible with both lead-free and SnPb assembly
techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can
cause degradation of the solder joint.
3, 4, 5, 7, 9, 10
Input EMI/ESD Protected Lines
1, 2, 11, 12, 14, 16
Output EMI/ESD Protected Lines
6, 8, 13, 15
Input/Output ESD Protected Lines
Center Tab
Ground
Pin Configuration and Schematic
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EClamp2357NQ
PROTECTION PRODUCTS
Applications Information
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EClamp2357NQ
PROTECTION PRODUCTS
Outline Drawing - 16L QFN
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EClamp2357NQ
PROTECTION PRODUCTS
Marking
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Qty per Reel
Reel Size
EClamp2357NQTCT
3000
7 Inch
Note:
EClamp and EMIClamp are registered marks of Semtech
Corporation.
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Notes:
1) YYWW = Date Code
2) Pin 1 indicated by “Mouse Bite” on the ground pad
Tape and Reel Specification
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Tape Specifications
Device Orientation in Tape
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
 2013 Semtech Corporation.
8
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