EClamp2374KQ EClampTM ESD/EMI Protection for Color LCD PROTECTION PRODUCTS Description Features The EClamp2374KQ is a low pass filter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection for Automotive grade electronics. • Bidirectional EMI/RFI filter with integrated TVS for ESD protection • Transient Protection to: IEC 61000-4-2 (ESD) ±15kV (Air), ±8kV (Contact) ISO-10605 (ESD) ±30kV (Air), ±30kV (Contact) IEC 61000-4-4 (EFT) 4kV (5/50ns) • Qualified to AEC-Q100, Grade 1 • Resistor: 100Ω ±15% • Protection and filtering for four lines • Filter performance: 30dB minimum attenuation 1.8GHz to 2.5GHz • TVS Working Voltage: 5V • Solid-state silicon-avalanche technology The device consists of four identical channels comprised of TVS diodes for ESD protection, and a resistor-capacitor network optimized for EMI/RFI filtering. A series resitor value of 100Ω and a capacitance value of 10pF are used to achieve 30dB minimum attenuation from 1.8GHz to 2.5GHz. The TVS diodes provide effective suppression of ESD voltages in excess of ±15kV (air discharge) and ±8kV (contact discharge) per IEC61000-4-2, level 4. The EClamp2374KQ is packaged in an 8-pin, SLP1713P8 package. The package dimensions measure 1.7 x 1.3 x 0.5mm. The leads are spaced at a pitch of 0.4mm and are finished with a lead-free NiPdAu. Mechanical Characteristics • • • • • • • SLP1713P8 package Pb-Free, Halogen Free, RoHS/WEEE compliant Nominal Dimensions: 1.7 x 1.3 x 0.50 mm Lead Pitch: 0.4mm Lead Finish: NiPdAu Marking: Marking code Packaging: Tape and Reel Applications • • • • Circuit Diagram (Each Line) Automotive Color LCD Automotive Infotainment Color LCD Protection CCD Camera Lines Package Configuration 1.70 1 2 100 Ohms 1.30 10pF 10pF 0.40 BSC 0.50 GND Nominal Dimension in mm Device Schematic (4X) EClamp2374KQ Final Datasheet Revision date Rev 2 1/18/2016 www.semtech.com 1 of 9 Semtech Absolute Maximum Ratings Rating Symbol Value Units ESD per IEC 61000-4-2 (Contact)(1) ESD per IEC 61000-4-2 (Air)(1) VESD ±17 ±12 kV ESD per ISO-10605 (Contact)(2) ESD per ISO-10605 (Air)(2) VESD ±17 ±12 kV Junction Temperature TJ 125 O Operating Temperature TJ -40 to +125 O Storage Temperature TSTG -55 to +150 O C C C Electrical Characteristics (T=25OC unless otherwise specified) EClamp2374KQ Parameter Symbol Conditions Reverse Stand-Off Voltage Min. Typ. VRWM Reverse Breakdown Voltage VBR It = 1mA, -40OC to 125OC Max. Units 5 V 10 V 0.50 μA 0.006 1 μA 85 100 115 Ohms 6 8 T = 25 C O Reverse Leakage Current IR VRWM = 5V Total Series Resistance R Each line Total Capacitance Cin Input to Gnd, Each line VR = 0V, f=1MHz T = 25OC 16 20 24 pF Cin Input to Gnd, Each line VR = 2.5V, f=1MHz T = 25OC 9 11 13 pF Total Capacitance T = 125 C O Notes: (1): ESD Gun return path to Ground Reference Plane (GRP) (2): ESD Gun return path to Horizontal Coupling Plane (HCP); Test conditions: a)150pF/330pF, 330W b) 150pF/330pF, 2kW (3):Tested using a constant current source (4): Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and V TLP averaging window: t1 = 70ns to t2 = 90ns. (5): Dynamic resistance calculated from ITLP = 4A to ITLP = 16A EClamp2374KQ Final Datasheet Revision date Rev 2 1/18/2016 www.semtech.com 2 of 9 Semtech Typical Characteristics Analog Crosstalk (Each Line) Typical Insertion Loss S21 (Each Line) 0 0 -10 -10 CrossTalk (dB) Insertion Loss (dB) -20 -20 -30 -30 -40 -50 -40 -60 -50 -70 0 1 2 3 Frequency (GHz) 4 5 0 1 Capacitance vs. Reverse Voltage 5 15 14 18 13 16 12 14 Capacitance (pF) Capacitance(pF) 4 Capacitance vs. Temperature 20 12 10 8 6 4 11 10 9 8 7 f = 1 MHz 2 0 2 3 Frequency (GHz) f = 1 MHz VR = 5V 6 0 1 2 3 Reversed Voltage (V) 4 5 5 -75 Series Resistance vs. Temperature -50 -25 0 25 50 75 Temperature (C°) 100 125 150 175 Reverse Breakdown Voltage vs. temperature 9.0 105 VBR @ 1mA 8.5 104 Vbr (V) Resistance (Ω) 8.0 103 102 7.5 7.0 101 100 6.5 -50 EClamp2374KQ Final Datasheet Revision date 0 Rev 2 1/18/2016 50 Temperature (°C) 100 150 6.0 -50 www.semtech.com 0 50 Temperature (°C) 100 150 3 of 9 Semtech Typical Characteristics ESD Clamping (-8kV Contact per IEC 61000-4-2) ESD Clamping (8kV Contact per IEC 61000-4-2) 10 8 7 0 -2 6 Clamping Voltege (V) Clamping Voltage (V) 2 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. 9 5 4 3 2 -4 -6 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. -8 1 0 -10 0 10 20 30 40 Time (ns) 50 60 70 ESD Clamping (+8kV Contact per ISO-10605 330pF, 330W) 25 10 5 0 10 20 EClamp2374KQ Final Datasheet Revision date 10 Rev 2 1/18/2016 30 Time (ns) 50 70 50 60 70 80 0 -2 -4 -6 -8 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 10dB attenuator. ESD gun return path connected to board ground -10 -10 30 40 Time (ns) 2 Clamping Voltage (V) Clamping Voltage (V) 15 -10 ESD Clamping (-8kV Contact per ISO-10605 330pF, 330W) Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 10dB attenuator. ESD gun return path connected to board ground 20 0 -10 80 -12 www.semtech.com -10 0 10 20 30 40 Time (ns) 50 60 70 80 4 of 9 Semtech Application Information Figure 1: Pin Identification and Configuration (Top Side View) Device Connection The EClamp2374KQ is comprised of four identical circuits each consisting of a low pass filter for EMI/RFI suppression and dual TVS diodes for ESD protection. The device is in a 8-pin SLP package. Electrical connection is made to the 8 pins located at the bottom of the device. A center tab serves as the ground connection. The devices has a flow through design for easy layout. Pin connection are noted in Figure 1. All path lengths should be kept a short as possible to minimize the effects of parasitic inductance in the board traces. Recommendations for the ground connection are given below. Ground Connection Recommendations Parasitic inductance present in the board layout will affect the filtering performance of the device. As frequency increases, the effect of the inductance becomes more dominant. This effect if given by Equation 1. S In 1 In 2 In 3 In 4 Gnd 4 5 Identification Input Lines Output Lines Ground Ground Via 1 Ground Via 2 x Where: L = Inductance (H) f = frequency (Hz) d Signal Layer Ground Layer Layer y Via connections to the ground plane form rectangular wire loops or ground loop inductance as shown in Figure 2. Ground loop inductance can be reduced by using multiple vias to make the connection to the ground plane. Bringing the ground plane closer to the signal layer (preferably to the next layer) also reduces ground loop inductance. Multiple vias in the device ground pad will result in a lower inductance ground loop over two exterior vias. Vias with a diameter d are separated by a distance y run between layers separated by a distance x. The inductance of the loop path is given by Equation 2. Thus, decreasing distance x and y will reduce the loop inductance and result in better high frequency filter characteristics. Out 1 Out 2 Out 3 Out 4 Figure 2: Inductance of Rectangular Wire Loops XLF (L,f ) = 2*π*f*L Rev 2 1/18/2016 8 Pin 1-4 5-8 Center Tab Equation 1: The Impedance of an Inductor at S Frequency XLF EClamp2374KQ Final Datasheet Revision date 1 Equation 2: Inductance of Rectangular Wire Loop > @ > > @ > > @ @ > @@ 2y 2x LRECT(d, x, y) = 10.16 • 10 -9 • x • ln( ) + y • ln( ) d d Where: d = diameter of the wire (in) L = Length of the wire loop (in) y = Breath of the wire loop (in) www.semtech.com 5 of 9 Semtech Application Information Figure 4: Filter Characteristics Using Recommended Layout with Internal Vias Figure 3 shows the recommended device layout. The ground pad vias have a diameter of 0.008 inches (0.20 mm) while the two external vias have a diameter of 0.010 inches (0.250mm). The internal vias are spaced approximately evenly from the center of the pad. The designer may choose to use more vias with a smaller diameter (such as 0.005 inches or 0.125mm) since changing the diameter of the via will result in little change in inductance (i.e. the log function in Equation 2 in highly insensitive to parameter d) . Figure 4 shows a typical insertion loss (S21) plot for the device using Semtech’s filter evaluation board with 50 Ohm traces and the recommended via configuration. Figure 5 shows a typical insertion loss (S21) plot using a similar board without the internal ground pad vias. The result is a more inductive ground loop. Note the “hump” at a frequency of 2.5GHz. This is the resonant frequency of the higher ground loop inductance. CH1 S21 LOG 6 dB / REF 0 dB 1: -9.1473 dB 297.671 MHz 2: -19.559 dB 900 MHz 0 dB 3: -30.645 dB 1.8 GHz -6 dB -12 dB 1 4: -34.705 dB 2.5 GHz -18 dB 2 -24 dB -30 dB 3 4 -36 dB -42 dB -48 dB 1 MHz 10 MHz 100 MHz 3 1 GHz GHz STOP 3000.000000 MHz START. 030 MHz Figure 5: Filter Characteristics Using Layout without Internal Ground Vias CH1 S21 LOG 6 dB / REF 0 dB 1: -8.9400 dB 288.002 MHz 2: -20.032 dB 900 MHz Figure 3: Recommended Layout Using Ground Vias 3: -23.761 dB 1.8 GHz 0 dB 4: -16.085 dB 2.5 GHz -6 dB 1 -12 dB 4 -18 dB 2 -24 dB 3 -30 dB -36 dB 1 MHz START. 030 MHz EClamp2374KQ Final Datasheet Revision date Rev 2 1/18/2016 www.semtech.com 10 MHz 100 MHz 3 1 GHz GHz STOP 3000.000000 MHz 6 of 9 Semtech Outline Drawing - SLP1713P8 A D B DIM PIN 1 INDICATOR (LASER MARK) E A SEATING PLANE aaa C A2 C A1 A A1 A2 b D D1 E E1 e L N aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .018 .020 .022 .000 .001 .002 (.005) .006 .008 .010 .065 .067 .070 .047 .051 .055 .049 .051 .054 .008 .012 .016 .016 BSC .008 .010 .012 8 .003 .004 0.45 0.50 0.55 0.00 0.02 0.05 (0.13) 0.15 0.20 0.25 1.65 1.70 1.775 1.20 1.30 1.40 1.25 1.30 1.375 0.20 0.30 0.40 0.40 BSC 0.20 0.25 0.30 8 0.08 0.10 D1 1 2 LxN E1 N E/2 bxN e/2 bbb C A B e D/2 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - SLP1713P8 P Z X G H (C) Y DIM C G H K P X Y Z DIMENSIONS INCHES MILLIMETERS (.050) (1.27) 0.69 .027 .012 0.30 .055 1.40 0.40 .016 0.20 .008 0.58 .023 .073 1.85 K NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. EClamp2374KQ Final Datasheet Revision date Rev 2 1/18/2016 www.semtech.com 7 of 9 Semtech Marking 2374K YYWW Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape A0 B0 1.51 +/-0.10 mm K0 1.91 +/-0.10 mm 0.66 +/-0.10 mm Tape Width B, (Max) D D1 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 0.8 mm ±0.05 (.031) E 1.750±.10 mm (.069±.004) F K (MAX) P P0 P2 T(MAX) W 3.5±0.05 mm (.138±.002) 2.4 mm (.094) 4.0±0.1 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05mm (.079±.002) 0.4 mm (.016) 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) Ordering Information Part Number Working Voltage Qty per Reel Reel Size EClamp2374KQTCT 5V 3,000 7” EClamp and EMIClamp are trademarks of Semtech Corporation EClamp2374KQ Final Datasheet Revision date Rev 2 1/18/2016 www.semtech.com 8 of 9 Semtech IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. 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