EClamp2374KQ Datasheet

EClamp2374KQ
EClampTM
ESD/EMI Protection for Color LCD
PROTECTION PRODUCTS
Description
Features
The EClamp2374KQ is a low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection for Automotive grade
electronics. • Bidirectional EMI/RFI filter with integrated TVS for ESD protection
• Transient Protection to:
ŒŒ IEC 61000-4-2 (ESD) ±15kV (Air), ±8kV (Contact) ŒŒ ISO-10605 (ESD) ±30kV (Air), ±30kV (Contact)
ŒŒ IEC 61000-4-4 (EFT) 4kV (5/50ns) • Qualified to AEC-Q100, Grade 1
• Resistor: 100Ω ±15%
• Protection and filtering for four lines
• Filter performance: 30dB minimum attenuation
1.8GHz to 2.5GHz
• TVS Working Voltage: 5V
• Solid-state silicon-avalanche technology
The device consists of four identical channels comprised
of TVS diodes for ESD protection, and a resistor-capacitor
network optimized for EMI/RFI filtering. A series resitor
value of 100Ω and a capacitance value of 10pF are used
to achieve 30dB minimum attenuation from 1.8GHz to
2.5GHz. The TVS diodes provide effective suppression of
ESD voltages in excess of ±15kV (air discharge) and ±8kV
(contact discharge) per IEC61000-4-2, level 4.
The EClamp2374KQ is packaged in an 8-pin, SLP1713P8
package. The package dimensions measure 1.7 x 1.3 x
0.5mm. The leads are spaced at a pitch of 0.4mm and
are finished with a lead-free NiPdAu. Mechanical Characteristics
•
•
•
•
•
•
•
SLP1713P8 package
Pb-Free, Halogen Free, RoHS/WEEE compliant
Nominal Dimensions: 1.7 x 1.3 x 0.50 mm
Lead Pitch: 0.4mm
Lead Finish: NiPdAu
Marking: Marking code
Packaging: Tape and Reel
Applications
•
•
•
•
Circuit Diagram (Each Line)
Automotive Color LCD
Automotive Infotainment
Color LCD Protection
CCD Camera Lines
Package Configuration
1.70
1 2
100 Ohms
1.30
10pF
10pF
0.40 BSC
0.50
GND
Nominal Dimension in mm
Device Schematic (4X)
EClamp2374KQ
Final Datasheet
Revision date
Rev 2
1/18/2016
www.semtech.com
1 of 9
Semtech
Absolute Maximum Ratings
Rating
Symbol
Value
Units
ESD per IEC 61000-4-2 (Contact)(1)
ESD per IEC 61000-4-2 (Air)(1)
VESD
±17
±12
kV
ESD per ISO-10605 (Contact)(2)
ESD per ISO-10605 (Air)(2)
VESD
±17
±12
kV
Junction Temperature
TJ
125
O
Operating Temperature
TJ
-40 to +125
O
Storage Temperature
TSTG
-55 to +150
O
C
C
C
Electrical Characteristics (T=25OC unless otherwise specified)
EClamp2374KQ
Parameter
Symbol Conditions
Reverse Stand-Off Voltage
Min.
Typ.
VRWM
Reverse Breakdown Voltage
VBR
It = 1mA,
-40OC to 125OC
Max.
Units
5
V
10
V
0.50
μA
0.006
1
μA
85
100
115
Ohms
6
8
T = 25 C
O
Reverse Leakage Current
IR
VRWM = 5V
Total Series Resistance
R
Each line
Total Capacitance
Cin
Input to Gnd, Each line
VR = 0V, f=1MHz
T = 25OC
16
20
24
pF
Cin
Input to Gnd, Each line
VR = 2.5V, f=1MHz
T = 25OC
9
11
13
pF
Total Capacitance
T = 125 C
O
Notes:
(1): ESD Gun return path to Ground Reference Plane (GRP)
(2): ESD Gun return path to Horizontal Coupling Plane (HCP); Test conditions: a)150pF/330pF, 330W b) 150pF/330pF, 2kW
(3):Tested using a constant current source
(4): Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and V TLP averaging window: t1 = 70ns to t2 = 90ns.
(5): Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
EClamp2374KQ
Final Datasheet
Revision date
Rev 2
1/18/2016
www.semtech.com
2 of 9
Semtech
Typical Characteristics
Analog Crosstalk (Each Line)
Typical Insertion Loss S21 (Each Line)
0
0
-10
-10
CrossTalk (dB)
Insertion Loss (dB)
-20
-20
-30
-30
-40
-50
-40
-60
-50
-70
0
1
2
3
Frequency (GHz)
4
5
0
1
Capacitance vs. Reverse Voltage
5
15
14
18
13
16
12
14
Capacitance (pF)
Capacitance(pF)
4
Capacitance vs. Temperature
20
12
10
8
6
4
11
10
9
8
7
f = 1 MHz
2
0
2
3
Frequency (GHz)
f = 1 MHz
VR = 5V
6
0
1
2
3
Reversed Voltage (V)
4
5
5
-75
Series Resistance vs. Temperature
-50
-25
0
25
50
75
Temperature (C°)
100
125
150
175
Reverse Breakdown Voltage vs. temperature
9.0
105
VBR @ 1mA
8.5
104
Vbr (V)
Resistance (Ω)
8.0
103
102
7.5
7.0
101
100
6.5
-50
EClamp2374KQ
Final Datasheet
Revision date
0
Rev 2
1/18/2016
50
Temperature (°C)
100
150
6.0
-50
www.semtech.com
0
50
Temperature (°C)
100
150
3 of 9
Semtech
Typical Characteristics
ESD Clamping (-8kV Contact per IEC 61000-4-2)
ESD Clamping (8kV Contact per IEC 61000-4-2)
10
8
7
0
-2
6
Clamping Voltege (V)
Clamping Voltage (V)
2
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground
plane.
9
5
4
3
2
-4
-6
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground
plane.
-8
1
0
-10
0
10
20
30
40
Time (ns)
50
60
70
ESD Clamping (+8kV Contact per ISO-10605 330pF, 330W)
25
10
5
0
10
20
EClamp2374KQ
Final Datasheet
Revision date
10
Rev 2
1/18/2016
30
Time (ns)
50
70
50
60
70
80
0
-2
-4
-6
-8
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 10dB attenuator. ESD gun
return path connected to board ground
-10
-10
30
40
Time (ns)
2
Clamping Voltage (V)
Clamping Voltage (V)
15
-10
ESD Clamping (-8kV Contact per ISO-10605 330pF, 330W)
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 10dB attenuator. ESD gun
return path connected to board ground
20
0
-10
80
-12
www.semtech.com
-10
0
10
20
30
40
Time (ns)
50
60
70
80
4 of 9
Semtech
Application Information
Figure 1: Pin Identification and Configuration
(Top Side View)
Device Connection
The EClamp2374KQ is comprised of four identical circuits
each consisting of a low pass filter for EMI/RFI suppression
and dual TVS diodes for ESD protection. The device is in
a 8-pin SLP package. Electrical connection is made to the
8 pins located at the bottom of the device. A center tab
serves as the ground connection. The devices has a flow
through design for easy layout. Pin connection are noted
in Figure 1. All path lengths should be kept a short as
possible to minimize the effects of parasitic inductance
in the board traces. Recommendations for the ground
connection are given below.
Ground Connection Recommendations
Parasitic inductance present in the board layout will affect
the filtering performance of the device. As frequency
increases, the effect of the inductance becomes more
dominant. This effect if given by Equation 1.
S
In 1
In 2
In 3
In 4
Gnd
4
5
Identification
Input Lines
Output Lines
Ground
Ground
Via 1
Ground
Via 2
x
Where:
L = Inductance (H)
f = frequency (Hz)
d
Signal Layer
Ground Layer
Layer
y
Via connections to the ground plane form rectangular
wire loops or ground loop inductance as shown in Figure
2. Ground loop inductance can be reduced by using
multiple vias to make the connection to the ground
plane. Bringing the ground plane closer to the signal
layer (preferably to the next layer) also reduces ground
loop inductance. Multiple vias in the device ground pad
will result in a lower inductance ground loop over two
exterior vias. Vias with a diameter d are separated by a
distance y run between layers separated by a distance
x. The inductance of the loop path is given by Equation
2. Thus, decreasing distance x and y will reduce the loop
inductance and result in better high frequency filter
characteristics.
Out 1
Out 2
Out 3
Out 4
Figure 2: Inductance of Rectangular Wire Loops
XLF (L,f ) = 2*π*f*L
Rev 2
1/18/2016
8
Pin
1-4
5-8
Center Tab
Equation 1: The Impedance
of an Inductor at
S
Frequency XLF
EClamp2374KQ
Final Datasheet
Revision date
1
Equation 2: Inductance of Rectangular Wire Loop
> @
>
> @
> > @
@
> @@
2y
2x 

LRECT(d, x, y) = 10.16 • 10 -9 •  x • ln( ) + y • ln( ) 
d
d 

Where:
d = diameter of the wire (in)
L = Length of the wire loop (in)
y = Breath of the wire loop (in)
www.semtech.com
5 of 9
Semtech
Application Information
Figure 4: Filter Characteristics Using Recommended
Layout with Internal Vias
Figure 3 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches (0.20 mm)
while the two external vias have a diameter of 0.010 inches
(0.250mm). The internal vias are spaced approximately
evenly from the center of the pad. The designer may
choose to use more vias with a smaller diameter (such as
0.005 inches or 0.125mm) since changing the diameter of
the via will result in little change in inductance (i.e. the log
function in Equation 2 in highly insensitive to parameter
d) . Figure 4 shows a typical insertion loss (S21) plot for
the device using Semtech’s filter evaluation board with
50 Ohm traces and the recommended via configuration. Figure 5 shows a typical insertion loss (S21) plot using a
similar board without the internal ground pad vias. The
result is a more inductive ground loop. Note the “hump”
at a frequency of 2.5GHz. This is the resonant frequency
of the higher ground loop inductance.
CH1 S21
LOG
6 dB / REF 0 dB
1: -9.1473 dB
297.671 MHz
2: -19.559 dB
900 MHz
0 dB
3: -30.645 dB
1.8 GHz
-6 dB
-12 dB
1
4: -34.705 dB
2.5 GHz
-18 dB
2
-24 dB
-30 dB
3
4
-36 dB
-42 dB
-48 dB
1
MHz
10
MHz
100
MHz
3
1
GHz GHz
STOP 3000.000000 MHz
START. 030 MHz
Figure 5: Filter Characteristics Using Layout without
Internal Ground Vias
CH1 S21
LOG
6 dB / REF 0 dB
1: -8.9400 dB
288.002 MHz
2: -20.032 dB
900 MHz
Figure 3: Recommended Layout Using Ground Vias
3: -23.761 dB
1.8 GHz
0 dB
4: -16.085 dB
2.5 GHz
-6 dB
1
-12 dB
4
-18 dB
2
-24 dB
3
-30 dB
-36 dB
1
MHz
START. 030 MHz
EClamp2374KQ
Final Datasheet
Revision date
Rev 2
1/18/2016
www.semtech.com
10
MHz
100
MHz
3
1
GHz GHz
STOP 3000.000000 MHz
6 of 9
Semtech
Outline Drawing - SLP1713P8
A
D
B
DIM
PIN 1
INDICATOR
(LASER MARK)
E
A
SEATING
PLANE
aaa C
A2
C
A1
A
A1
A2
b
D
D1
E
E1
e
L
N
aaa
bbb
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.018 .020 .022
.000 .001 .002
(.005)
.006 .008 .010
.065 .067 .070
.047 .051 .055
.049 .051 .054
.008 .012 .016
.016 BSC
.008 .010 .012
8
.003
.004
0.45 0.50 0.55
0.00 0.02 0.05
(0.13)
0.15 0.20 0.25
1.65 1.70 1.775
1.20 1.30 1.40
1.25 1.30 1.375
0.20 0.30 0.40
0.40 BSC
0.20 0.25 0.30
8
0.08
0.10
D1
1 2
LxN
E1
N
E/2
bxN
e/2
bbb
C A B
e
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP1713P8
P
Z
X
G
H (C)
Y
DIM
C
G
H
K
P
X
Y
Z
DIMENSIONS
INCHES
MILLIMETERS
(.050)
(1.27)
0.69
.027
.012
0.30
.055
1.40
0.40
.016
0.20
.008
0.58
.023
.073
1.85
K
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
EClamp2374KQ
Final Datasheet
Revision date
Rev 2
1/18/2016
www.semtech.com
7 of 9
Semtech
Marking
2374K
YYWW
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0
B0
1.51 +/-0.10 mm
K0
1.91 +/-0.10 mm
0.66 +/-0.10 mm
Tape
Width
B, (Max)
D
D1
8 mm
4.2 mm
(.165)
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
0.8 mm
±0.05
(.031)
E
1.750±.10
mm
(.069±.004)
F
K
(MAX)
P
P0
P2
T(MAX)
W
3.5±0.05
mm
(.138±.002)
2.4 mm
(.094)
4.0±0.1
mm
(.157±.004)
4.0±0.1
mm
(.157±.004)
2.0±0.05mm
(.079±.002)
0.4 mm
(.016)
8.0 mm
+ 0.3 mm
- 0.1 mm
(.312±.012)
Ordering Information
Part Number
Working
Voltage
Qty per
Reel
Reel Size
EClamp2374KQTCT
5V
3,000
7”
EClamp and EMIClamp are trademarks of Semtech Corporation
EClamp2374KQ
Final Datasheet
Revision date
Rev 2
1/18/2016
www.semtech.com
8 of 9
Semtech
IMPORTANT NOTICE
Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a
guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right
to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders
and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time
of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale.
SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES
OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE
OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN
SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall
indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney
fees which could arise.
The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and
names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document
without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any
particular purpose. All rights reserved.
© Semtech 2015
Contact Information
Semtech Corporation
200 Flynn Road, Camarillo, CA 93012
Phone: (805) 498-2111, Fax: (805) 498-3804
www.semtech.com
EClamp2374KQ
Final Datasheet
Revision date
Rev 2
1/18/2016
9 of 9
Semtech
Similar pages