567BJ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP10, 1.67x1.05
CASE 567BJ−01
ISSUE O
SCALE 4:1
È
È
PIN A1
REFERENCE
2X
0.05 C
2X
0.05 C
D
A
DATE 26 JUL 2010
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
DIM
A
A1
A2
b
D
E
eD
eE
TOP VIEW
A2
OptiGuard Option
ÏÏÏÏ
0.05 C
A
RECOMMENDED
SOLDERING FOOTPRINT*
0.05 C
NOTE 3
A1
C
SIDE VIEW
eD/2
10X
b
eD
0.05 C A B
0.03 C
C
B
SEATING
PLANE
A1
PACKAGE
OUTLINE
0.35
eE
0.35
0.40
PITCH
10X
0.25
DIMENSIONS: MILLIMETERS
A
1 2 3
4 5 6
BOTTOM VIEW
DOCUMENT NUMBER:
MILLIMETERS
MIN
MAX
0.54
0.69
0.17
0.24
0.42 REF
0.24
0.29
1.67 BSC
1.05 BSC
0.400 BSC
0.347 BSC
98AON49818E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP10, 1.67X1.05
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON49818E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
DATE
26 JUL 2010
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2010
July, 2010 − Rev. 01O
Case Outline Number:
567BJ