517BE

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN16, 3.3x1.35, 0.4P
CASE 517BE−01
ISSUE O
16
DATE 18 NOV 2009
1
SCALE 4:1
A
B
D
2X
0.10 C
PIN ONE
REFERENCE
2X
0.10 C
L
L1
ÏÏÏ
ÏÏÏ
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
TOP VIEW
EXPOSED Cu
A
DETAIL B
0.05 C
(A3)
16X
A1
0.05 C
NOTE 4
16X
A1
SIDE VIEW
SEATING
PLANE
C
DETAIL A
D2
L
L
8
1
ÎÎ
ÎÎ
ÏÏ
MOLD CMPD
DETAIL B
OPTIONAL
CONSTRUCTION
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
3.30 BSC
2.70
2.90
1.35 BSC
0.30
0.50
0.40 BSC
0.15
−−−
0.20
0.30
−−− 0.05
GENERIC
MARKING DIAGRAM*
E2
XX MG
G
K
16
9
e
BOTTOM VIEW
16X
b
0.10 C A B
0.05 C
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
3.00
16X
1
XX
= Specific Device Code
M
= Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.40
1.55
0.50
16X
0.40
PITCH
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON47062E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
UDFN16, 3.3X1.35, 0.4P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON47062E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY A. TAM.
DATE
18 NOV 2009
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2009
November, 2009 − Rev. 01O
Case Outline Number:
517BE
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