511BL

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WDFN16 4x2, 0.5P
CASE 511BL−01
ISSUE O
DATE 29 JUN 2010
SCALE 4:1
2X
0.10 C
PIN 1
REFERENCE
2X
0.10 C
L
A B
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L1
ÎÎÎÎ
ÎÎÎÎ
E
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
ÏÏ
ÎÎ
EXPOSED Cu
TOP VIEW
(A3)
DETAIL B
0.05 C
L
A
A1
ÎÎ
ÏÏ
ALTERNATE
CONSTRUCTIONS
A1
SIDE VIEW
MOLD CMPD
DETAIL B
0.05 C
NOTE 4
A3
C
SEATING
PLANE
8
12X
XXMG
G
L
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
0.10
MIN
16
9
e
14X
e/2
BOTTOM VIEW
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.15
0.25
4.00 BSC
2.00 BSC
0.50 BSC
0.70
0.90
0.05
0.15
GENERIC
MARKING DIAGRAM*
DETAIL A
1
DIM
A
A1
A3
b
D
E
e
L
L1
b
0.10
M
C A B
0.05
M
C
(Note: Microdot may be in either location)
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
NOTE 3
RECOMMENDED
MOUNTING FOOTPRINT
13X
12X
0.30
1.07
PACKAGE
OUTLINE
2.30
1
0.45
0.50 PITCH
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
98AON52150E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WDFN16 4X2, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON52150E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
DATE
29 JUN 2010
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2010
June, 2010 − Rev. 01O
Case Outline Number:
511BL
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