711AW

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN16 3.5x1.35, 0.4P
CASE 711AW
ISSUE A
16
DATE 17 JUN 2014
1
SCALE 4:1
A
B
D
2X
ÏÏÏÏ
ÏÏÏÏ
0.10 C
PIN ONE
REFERENCE
2X
0.10 C
L
L
L1
DETAIL A
E
ALTERNATE TERMINAL
CONSTRUCTIONS
ÏÏÏ
ÏÏÏ
ÎÎÎ
TOP VIEW
EXPOSED Cu
DETAIL B
(A3)
0.10 C
A
MOLD CMPD
DETAIL B
16X
0.08 C
NOTE 4
A1
SIDE VIEW
C
SEATING
PLANE
e/2
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
e
12X
ALTERNATE
CONSTRUCTION
DIM
A
A1
A3
b
D
E
e
L
L1
GENERIC
MARKING DIAGRAM*
XXXM
G
L
8
1
MILLIMETERS
MIN
MAX
0.40
0.50
0.00
0.05
0.15 REF
0.15
0.25
3.50 BSC
1.35 BSC
0.40 BSC
0.40
0.60
−−−
0.15
1
16
9
16X
b
0.10 C A B
0.05 C
BOTTOM VIEW
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
0.40
PITCH
XXX = Specific Device Code
M = Month Code
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
12X
0.65
1.55
1
15X
0.55
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON83555F
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
XDFN16 3.5X1.35, 0.4P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON83555F
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
25 MAR 2014
A
CHANGED DIMENSION A3 FROM 0.13 TO 0.15. REQ. BY D. TRUHITTE.
17 JUN 2014
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2014
June, 2014 − Rev. A
Case Outline Number:
711AW
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