Telegesis™
TG-ETRX35X-PM-010-110
ETRX351 and ETRX357
Product Manual 1.10
Telegesis™ is a trademark of Silicon Laboratories Inc.
ETRX35x ZIGBEE MODULES
PRODUCT MANUAL
©2015 Silicon Labs
ETRX35x Product Manual
ETRX351 and ETRX357
Table of Contents
1
1.1
2
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
INTRODUCTION ................................................................................................................. 5
Hardware Description ....................................................................................................... 5
PRODUCT APPROVALS ................................................................................................... 6
FCC Approvals................................................................................................................. 6
FCC Labelling Requirements ........................................................................................... 7
IC (Industry Canada) Approvals ....................................................................................... 7
European Certification (ETSI)........................................................................................... 8
ICASA Approvals ............................................................................................................. 8
Australia and New Zealand (C-Tick) ................................................................................. 8
Brazil ................................................................................................................................ 9
Declarations of Conformity ............................................................................................... 9
IEEE 802.15.4 .................................................................................................................. 9
The ZigBee Protocol ...................................................................................................... 10
3
MODULE PINOUT ............................................................................................................ 11
4
HARDWARE DESCRIPTION ............................................................................................ 13
4.1
5
5.1
5.2
5.3
6
6.1
6.2
Hardware Interface......................................................................................................... 13
FIRMWARE DESCRIPTION ............................................................................................. 14
Token Settings ............................................................................................................... 15
Custom Firmware ........................................................................................................... 15
Software Interface .......................................................................................................... 16
ABSOLUTE MAXIMUM RATINGS ................................................................................... 17
Environmental Characteristics ........................................................................................ 17
Recommended Operating Conditions............................................................................. 17
7
DC ELECTRICAL CHARACTERISTICS ........................................................................... 18
8
DIGITAL I/O SPECIFICATIONS ....................................................................................... 20
9
A/D CONVERTER CHARACTERISTICS .......................................................................... 21
10
AC ELECTRICAL CHARACTERISTICS ........................................................................... 21
10.1
TX Power Characteristics ............................................................................................... 23
11
PHYSICAL DIMENSIONS ................................................................................................. 25
12
RECOMMENDED SOLDERING TEMPERATURE PROFILE ........................................... 27
13
PRODUCT LABEL DRAWING ......................................................................................... 28
14
RECOMMENDED FOOTPRINT ........................................................................................ 29
14.1
14.2
14.3
Pad dimensions.............................................................................................................. 29
Recommended Placement ............................................................................................. 30
Example carrier board .................................................................................................... 32
15
RELIABILITY TESTS........................................................................................................ 33
16
APPLICATION NOTES ..................................................................................................... 33
16.1
16.2
Safety Precautions ......................................................................................................... 33
Design Engineering Notes.............................................................................................. 33
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
16.3
17
17.1
17.2
17.3
17.4
17.5
Storage Conditions......................................................................................................... 34
PACKAGING .................................................................................................................... 34
Embossed Tape ............................................................................................................. 34
Component Orientation .................................................................................................. 35
Reel Dimensions ............................................................................................................ 35
Packaging - bag ............................................................................................................. 37
Packaging – carton ........................................................................................................ 37
18
ORDERING INFORMATION ............................................................................................. 38
19
ROHS DECLARATION ..................................................................................................... 39
20
DATA SHEET STATUS .................................................................................................... 39
21
RELATED DOCUMENTS ................................................................................................. 39
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
The Telegesis ETRX351 and ETRX357 modules are low power
2.4GHz ZigBee modules, based on the latest Ember EM351 and
EM357 single chip ZigBeeTM solutions.
These 3rd generation modules have been designed to be
integrated into any device without the need for RF experience
and expertise. Utilizing the EmberZNet ZigBee stack, the
ETRX35x enables you to add powerful wireless networking
capability to your products and quickly bring them to market.
Image not shown actual size; enlarged to show detail.
The module’s unique AT-style command line interface allows
designers to quickly integrate ZigBee technology without
complex software engineering. For custom application
development the ETRX35x series integrates with ease into
Ember’s InSight development environment.
Module Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Suggested Applications
Small form factor, SMT module 25mm x 19mm
Side Castellations for easy soldering and optical
inspection
2 antenna options: Integrated chip antenna or U.FL
coaxial connector
Industry’s first ARM® Cortex-M3 based family of ZigBee
modules
Industry standard JTAG Programming and real time
network level debugging via the Ember InSight Port
192kB (ETRX357) and 128kB (ETRX351) flash and
12kbytes of RAM
Lowest Deep Sleep Current of sub 1µA and multiple
sleep modes
Wide supply voltage range (2.1 to 3.6V)
Optional 32.768kHz watch crystal can be added
externally
Module ships with standard Telegesis AT-style command
interface based on the ZigBee PRO feature set
Can act as an End Device, Router or Coordinator
24 general-purpose I/O lines including analogue inputs
(all GPIOs of the EM35x are accessible)
Firmware upgrades via serial port or over the air
(password protected)
Hardware supported encryption (AES-128)
CE, FCC and IC compliance, FCC modular approval
Operating temperature range: -40°C to +85°C
Long range version with a link budget of up to 124dB
available in the same form factor
Radio Features
•
•
•
•
•
•
•
•
AMR – ZigBee Smart Energy applications
Wireless Alarms and Security
Home/Building Automation
Wireless Sensor Networks
M2M Industrial Controls
Lighting and ventilation control
Remote monitoring
Environmental monitoring and control
Development Kit
• New Development kit containing everything required to
set up a mesh network quickly and evaluate range and
performance of the ETRX35x and its long-range version.
• AT-style software interface command dictionary can be
modified for high volume customers.
• Custom software development available upon request.
Example AT-Style Commands
AT+BCAST
AT+UCAST:<address>
AT+EN
AT+JN
Send a Broadcast
Send a Unicast
Establish PAN network
Join PAN
At power-up the last configuration is loaded from non-volatile
S-Registers, which can eliminate the need for an additional
host controller.
• Based on the Ember EM351 or EM357 single chip ZigBee
solutions
• 2.4GHz ISM Band
• 250kbit/s over the air data rate
• 16 channels (IEEE802.15.4 Channel 11 to 26)
• +3dBm output power ( +8dBm in boost mode)
• High sensitivity of -100dBm (-102dBm in boost mode)
typically @ 1% packet error rate
• RX Current: 26mA, TX Current: 31mA at 3dBm
• Robust Wi-Fi and Bluetooth coexistence
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
1 Introduction
This document describes the Telegesis ETRX351 and ETRX357 ZigBee modules which have been
designed to be easily integrated into another device and to provide a fast, simple and low cost
wireless mesh networking interface.
The Telegesis ETRX3 series modules are based on the Ember ZigBee platform consisting of the
single chip EM351 or EM357 combined with the ZigBee PRO compliant EmberZNet meshing stack.
Integration into a wide range of applications is made easy using a simple AT style command interface
and advanced hardware design.
The configurable functionality of the Telegesis AT Commandset often allows the ETRX3 series
ZigBee modules to be used without an additional host microcontroller saving even more integration
time and costs. In addition to the Telegesis AT Commandset, the ETRX351 and ETRX357 modules
can be used with custom-built firmware whilst representing an ideal platform for custom firmware
development in conjunction with the Ember development kits.
No RF experience or expertise is required to add this powerful wireless networking capability to your
products. The ETRX351 and ETRX357 offer fast integration opportunities and the shortest possible
time to market for your product.
1.1
Hardware Description
The main building blocks of the ETRX351 and ETRX357 are the single chip EM351 and EM357
SoCs from Ember, a 24MHz reference crystal and RF front-end circuitry optimized for best RF
performance. The modules are available with on-board antenna or alternatively a U.FL coaxial
connector for attaching external antennae. Modules with the U.FL connector are identified by the
“HR” suffix.
The integrated antenna is an Antenova Rufa, and details of the radiation pattern etc are available
from the Antenova website [5].
Module
ETRX351
ETRX351HR
ETRX357
ETRX357HR
Chip
EM351
EM351
EM357
EM357
Flash
128kB
128kB
192kB
192kB
RAM
12kB
12kB
12kB
12kB
Table 1: Memories
The ETRX351 and ETRX357 are used for ZigBee (www.zigbee.org) applications. In case it is desired
to develop custom firmware instead of using the pre-loaded AT-Command interface, the Ember
InSight toolchain, consisting of InSight Desktop™ together with a comprehensive integrated
development environment (IDE), is required. The Ember development environment is currently not
suitable for developing an IEEE802.15.4-only application that does not use the ZigBee layer.
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
2 Product Approvals
The ETRX351 and ETRX357 as well as the ETRX351HR and ETRX357HR have been designed to
meet all national regulations for world-wide use. In particular the following certifications have been
obtained:
2.1
FCC Approvals
The Telegesis ETRX351 and ETRX357 with integrated Antenna as well as the ETRX351HR and the
ETRX357HR including the antennas listed in Table 2 have been tested to comply with FCC CFR
Part 15 (USA) The devices meet the requirements for modular transmitter approval as detailed in
the FCC public notice DA00.1407.transmitter. FCC statement:
This device complies with Part 15 of the FCC rules. Operation is subject to the following
two conditions: (1) this device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
FCC ID: S4GEM35XA
Item
1
Manufacturer
EAD Ltd. [6]
Type
¼ Wave
EAD Ltd. [6]
¼ Wave
3
Part No.
BT-Stubby (straight)
BT-Stubby (rightangle)
WH-2400-U2.5
Wellhope Wireless [7]
½ Wave
4
Rufa (on board)
Antenova
Chip
2
Impedance Gain
50Ω
0dBi
50Ω
0dBi
50Ω
50Ω
2.5dBi
2.1dBi
(peak)
Table 2: Approved Antennae
While the applicant for a device into which the ETRX351 (ETRX357) or ETRX351HR (ETRX357HR)
with an antenna listed in Table 2 is installed is not required to obtain a new authorization for the
module, this does not preclude the possibility that some other form of authorization or testing may
be required for the end product.
The FCC requires the user to be notified that any changes or modifications made to this device that
are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the
equipment.
When using the ETRX351HR and ETRX357HR with approved antennae, it is required to prevent
end-users from replacing them with non-approved ones. The module and associated antenna must
be installed to provide a separation distance of at least 20cm from all persons and must not transmit
simultaneously with any other antenna or transmitter.
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
FCC Labelling Requirements
When integrating the ETRX351, ETRX357, ETRX351HR or ETRX357HR into a product it must be
ensured that the FCC labelling requirements are met. This includes a clearly visible label on the
outside of the finished product specifying the Telegesis FCC identifier (FCC ID: S4GEM35XA) as
well as the FCC notice shown on the previous page. This exterior label can use wording such as
“Contains Transmitter Module FCC ID: S4GEM35XA” or “Contains FCC ID:S4GEM35XA”
although any similar wording that expresses the same meaning may be used.
2.2
IC (Industry Canada) Approvals
The Telegesis ETRX351 and ETRX357 with integrated Antenna as well as the ETRX351HR and the
ETRX357HR modules have been approved by Industry Canada to operate with the antenna types
listed in Table 2 with the maximum permissible gain and required antenna impedance for each
antenna type indicated. Antenna types not included in this list, having a gain greater than the
maximum gain indicated for that type, are strictly prohibited for use with this device.
IC-ID: 8735A-EM35XA
•
This device complies with Industry Canada license-exempt RSS standard(s).
Operation is subject to the following two conditions: (1) this device may not cause
interference, and (2) this device must accept any interference, including interference
that may cause undesired operation of the device.
•
Under Industry Canada regulations, this radio transmitter may only operate using an
antenna of a type and maximum (or lesser) gain approved for the transmitter by
Industry Canada. To reduce potential radio interference to other users, the antenna
type and its gain should be so chosen that the equivalent isotropically radiated
power (e.i.r.p.) is not more than that permitted for successful communication.
•
•
This module complies with FCC and Industry Canada RF radiation exposure limits
set forth for general population. To maintain compliance, this module must not be colocated or operating in conjunction with any other antenna or transmitter.
This device has been designed to operate with the antennas listed in Table 2, and
having a maximum gain of 2.5 dBi. Antennas not included in this list or having a gain
greater than 2.5 dBi are strictly prohibited for use with this device. The required
antenna impedance is 50 ohms.
The labelling requirements for Industry Canada are similar to those of the FCC. Again a clearly
visibly label must be placed on the outside of the finished product stating something like “Contains
Transmitter Module, IC: 8735A-EM35XA”, although any similar wording that expresses the same
meaning may be used.
The integrator is responsible for the final product to comply to IC ICES-003 and FCC Part 15, Sub.
B – Unintentional Radiators.
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
2.3
European Certification (ETSI)
The ETRX351, ETRX357, ETRX351HR and ETRX357HR have been certified to the following
standards:
•
•
•
Radio:
EMC:
Safety:
EN 300 328:V1.8.1
EN 301 489-17:V2.2.1
EN 60950-1:2006 / A12:2011
For this purpose the ETRX351HR and ETRX357HR have been tested with the antennae listed in
Table 2.
If the ETRX351, ETRX357, ETRX351HR or ETRX357HR module is incorporated into an OEM
product, the OEM product manufacturer must ensure compliance of the final product to the European
Harmonised EMC, and low voltage/safety standards. A Declaration of Conformity must be issued
for each of these standards and kept on file as described in Annex II of the R&TTE Directive. The
final product must not exceed the specified power ratings, antenna specifications and installation
requirements as specified in this user manual. If any of these specifications are exceeded in the
final product then a submission must be made to a notified body for compliance testing to all of the
required standards.
The ‘CE’ marking must be applied to a visible location on any OEM product. For more information
please refer to http://ec.europa.eu/enterprise/faq/ce-mark.htm. Customers assume full responsibility
for learning and meeting the required guidelines for each country in their distribution market.
2.4
ICASA Approvals
The ETRX351, ETRX357, ETRX351HR and ETRX357HR have been certified to be used in South
Africa.
2.5
Australia and New Zealand (C-Tick)
The ETRX351, ETRX357, ETRX351HR and ETRX357HR have been certified to be used in Australia
and New Zealand.
In order to have a C-Tick mark on an end product integrating an ETRX35x device, a company must
comply with a or b below.
a). have a company presence in Australia.
b). have a company/distributor/agent in Australia that will sponsor the importing of the end
©2015 Silicon Labs
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product.
ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
2.6
Brazil
The ETRX357 and ETRX357HR have been certified to be used in Brazil.
2.7
Declarations of Conformity
Telegesis (UK) Ltd has issued Declarations of Conformity for all ETRX3 series ZigBee RF Modules,
which cover Radio Emissions, EMC and Safety. These documents are available from our website
or on request.
2.8
IEEE 802.15.4
IEEE 802.15.4 is a standard for low data-rate, wireless networks (raw bit-rate within a radio packet
of 250kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life
applications as well as mains-powered applications. It is the basis for the open ZigBee Protocol.
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
2.9
The ZigBee Protocol
The ZigBee Protocol is a set of standards for wireless connectivity for use between any devices over
short to medium distances. The specification was originally ratified in December 2004, paving the
way for companies to start making low-power networks a reality.
ZigBee uses the IEEE 802.15.4 radio specification running on the 2.4GHz band, plus three additional
layers for networking, security and applications. What makes the specification unique is its use of a
mesh network architecture which, in bucket chain style, passes data from one node to the next until
it lands at its destination. The network is self-healing and adapts its routing as link quality changes
or nodes move. Furthermore, nodes can be defined as End Devices which do not act as routers,
but can therefore be put into a low-power sleep state.
The enhanced version of the ZigBee standard (or ZigBee 2006) was released in December 2006,
adding new features and improvements to the only global wireless communication standard enabling
the development of easily deployable low-cost, low-power, monitoring and control products for
homes, commercial buildings and industrial plant monitoring. In 2007 the ZigBee Alliance introduced
the PRO featureset which offers advantages over earlier versions, including
•
•
•
•
•
Truly self healing mesh networking
Messages can now travel up to 30 hops
Source-Routing for improved point to multipoint message transmission
Improved security including Trust-Centre link keys
New message types and options
The Telegesis AT-Commandset, which by default ships on all ETRX3 series products is based on
the ZigBee PRO featureset. For more information on the Telegesis AT-Commandset please refer to
the separate documentation at www.telegesis.com.
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
3 Module Pinout
Figure 1: ETRX3 series Module Pinout (top view)
The table below gives details about the pin assignment for direct SMD soldering of the ETRX3 series
modules to the application board. For more information on the alternate functions please refer to
[2]. Also refer to the Telegesis AT Commandset documentation and the Telegesis development kit
documentation to understand how the pre-programmed firmware makes use of the individual I/Os.
All GND pads are connected within the module, but for best RF performance all of them should be
grounded externally ideally to a ground plane.
“Important Note: If designers would like to keep open the option of using either standard or long
range modules in the same product please note the following. The ETRX35x series and the
ETRX35x-LRS series of modules are footprint compatible, but on the ETRX35x-LRS series pins PB0
and PC5 of the EM357 are used internally to control the front-end module and are not available to
the user.”
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
ETRX35x
Pad
Name
EM35x Pin
Default use
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
GND
PC5 {1}
PC6
PC7
PA7 {5}
PB3 {2,3}
nReset {6}
PB4 {2,3}
PA0
PA1
PA2
PA3
GND
PA4
PA5 {4}
PA6 {5}
PB1 {3}
PB2 {3}
GND
GND
JTCK
PC2
PC3
PC4
PB0
PC1
PC0 {5}
PB7 {5}
PB6 {5}
PB5
GND
Vcc
GND
GND
11
13
14
18
19
12
20
21
22
24
25
GND
26
27
29
30
31
GND
GND
32
33
34
35
36
38
40
41
42
43
GND
Vcc
GND
GND
Alternate Functions
TX_ACTIVE
OSC32B, nTX_ACTIVE
OSC32A, OSC32_EXT
TIM1C4
SC1nCTS, SC1SCLK, TIM2C3
I/O
I/O
I/O
I/O, CTS
nReset
I/O, RTS
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
TXD
RXD
GND
GND
TIM2C4, SC1nRTS, SC1nSSEL
TIM2C1, SC2MOSI
TIM2C3, SC2SDA, SC2MISO
TIM2C4, SC2SCL, SC2SCLK
SC2nSSEL, TRACECLK, TIM2C2
ADC4, PTI_EN, TRACEDATA
ADC5, PTI_DATA, nBOOTMODE, TRACEDATA3
TIM1C3
SC1MISO, SC1MOSI, SC1SDA, SC1TXD, TIM2C1
SC1MISO, SC1MOSI, SC1SCL, SC1RXD, TIM2C2
SWCLK
JTDO, SWO
JTDI
JTMS, SWDIO
VREF, IRQA, TRACECLK, TIM1CLK, TIM2MSK
ADC3, SWO, TRACEDATA0
JRST, IRQD, TRACEDATA1
ADC2, IRQC, TIM1C2
ADC1, IRQB, TIM1C1
ADC0, TIM2CLK, TIM1MSK
I/O
I/O
I/O
I/O, IRQ
I/O
I/O
I/O
I/O
I/O
GND
Vcc
GND
Table 3: Pin Information
Notes:
{1} When the alternate function is selected, TX_ACTIVE becomes an output that indicates that the EM35x
radio circuit is in transmit mode. PC5 is not usable on the long range version of the ETRX35x as this
GPIO is used internally as TX_ACTIVE to control the external RF frontend.
{2} The serial UART connections TXD, RXD, CTS and RTS are PB1, PB2, PB3 and PB4 respectively.
The device sends its data on TXD and receives on RXD.
{3} When using the Telegesis AT Commandset, RTS/CTS handshaking is selectable in firmware. See
the AT Command Manual.
{4} If PA5 is driven low at power-up or reset the module will boot up in the bootloader
{5} PA6, PA7, PB6, PB7 and PC0 can drive high current (see section 8)
{6} nRESET is level-sensitive, not edge-sensitive. The module is held in the reset state while nRESET is
low
See also the table “Module pads and functions” in the ETRX357 Development Kit Product Manual.
Refer to Ember’s EM357 manual for details of the alternate functions and pin names.
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
4 Hardware Description
Vreg
Vcc
I/O
LDO
1V8
1,8Vdc
integrated
antenna
LDO
1V25
A/D
EM35x
RESET
BALUN
5
U.FL socket
rf
terminal
selection,
filtering and
matching
circuitry
I/O
UART
JTAG
RESET
programming
24MHz
Figure 2: Hardware Diagram
The ETRX351, ETRX351HR, ETRX357 and ETRX357HR are based on the Ember EM351 and
EM357 respectively. The EM351 and EM357 are fully integrated 2.4GHz ZigBee transceivers with a
32-bit ARM® Cortex M3TM microprocessor, flash and RAM memory, and peripherals.
The industry standard serial wire and JTAG programming and debugging interfaces together with
the standard ARM system debug components help to streamline any custom software development.
In addition to this a number of MAC functions are also implemented in hardware to help maintaining
the strict timing requirements imposed by the ZigBee and IEEE802.15.4 standards.
The new advanced power management features allow faster wakeup from sleep and new power
down modes allowing this 3rd generation module to offer a longer battery life than any 2nd generation
modules on the market.
The EM35x has fully integrated voltage regulators for both required 1.8V and 1.25V supply voltages.
The voltages are monitored (brown-out detection) and the built in power-on-reset circuit eliminates
the need for any external monitoring circuitry. An optional 32.768 kHz watch crystal can be
connected externally to pads 3 and 4 in case more accurate timing is required. To utilize the external
watch crystal custom firmware is required.
4.1
Hardware Interface
All GPIO pins of the EM351 or EM357 are accessible on the module’s pads. Whether signals are
used as general purpose I/Os, or assigned to a peripheral function like ADC is set by the firmware.
When using the Telegesis AT Commandset please refer to the AT Commandset manual and the
development kit manual for this information and when developing custom firmware please refer to
the EM35x datasheet [2].
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
5 Firmware Description
The modules will be pre-loaded with a standalone bootloader which supports over-the-air
bootloading as well as serial bootloading of new firmware.
In order to enter the standalone bootloader using a hardware trigger pull PA5 to ground and powercycle or reset the module. To avoid entering the standalone bootloader unintentionally make sure
not to pull this pin down during boot-up unless the resistance to ground is >10kΩ. (A pull-up is not
required).
In addition to the standalone bootloader the modules also contain the current release of the
Telegesis AT-style command interface as described in the Telegesis AT command dictionary and
the Telegesis user guide. Check www.telegesis.com for updates. Each module comes with a unique
64-bit 802.15.4 identifier which is stored in non-volatile memory. The commands and responses
pass through the serial port of the ETRX35x as ASCII text, so a simple terminal application will
usually suffice. We provide Telegesis Terminal for interaction with the module but it is not an
essential feature.
The pre-loaded AT-style command interface firmware is based on the latest EmberZNet meshing
stack which implements routers/coordinators as well as (sleepy) end devices. [End devices have no
routing responsibility and therefore are allowed to go to sleep, whilst still being able to send and
receive messages via a parent router. In addition to classical sleepy and non-sleepy end devices
the module firmware also supports mobile (sleepy) end devices capable of changing their parent
quickly whenever they change their position within the network.]
A router is typically a mains powered device whilst a sleepy end device (SED) can be battery
powered.
The module is also able to act as a coordinator and Trust Centre through external host control. The
AT style command line supplies all the tools required to set up and manage a ZigBee network by
allowing easy access to the low-level functionality of the stack.
The Telegesis firmware uses the meshing and self healing EmberZNet PRO stack to overcome
many of the limitations of the tree network topology of the ZigBee 2006 stack by using the ZigBee
PRO featureset.
The Telegesis firmware allows low-level access to physical parameters such as channel and power
level. Parameters that define the functionality of the ETRX35x module and also allow standalone
functionality are saved in non-volatile memory organised in so-called S-Registers. The SPI and I2C
buses are not supported by the current firmware release, but can be used with custom firmware.
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
5.1
Token Settings
The ETRX3 Series Modules’ tokens will be pre-programmed with the settings shown in the table
below.
Token
MFG_CIB_OBS
MFG_CUSTOM_VERSION
MFG_CUSTOM_EUI_64
MFG_STRING
MFG_BOARD_NAME
MFG_MANUF_ID
MFG_PHY_CONFIG
MFG_BOOTLOAD_AES_KEY
MFG_EZSP_STORAGE
MFG_CBKE_DATA
MFG_INSTALLATION_CODE
MFG_OSC24M_BIAS_TRIM
Description
Option Bytes
Optional Version Number
Custom EUI
Device Specific String
Hardware Identifier
Manufacturer ID
Default Power Settings
Bootloader Key
EZSP related
SE Security
SE Installation
Crystal Bias
TG Default
<not written>
<not written>
<not written>
TELEGESIS
<Order Code>
0x1010
0xFF26
<not written>
<not written>
<not written>
<not written>
<not written>
Table 4. Manufacturing tokens
5.2
Custom Firmware
For high volume customers the firmware can be customised on request. In addition to this the ETRX3
series of modules is an ideal platform for developing custom firmware. In order to develop custom
firmware the Ember Insight toolchain is required.
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
5.3
Software Interface
Using the default firmware the ETRX35x is controlled using a simple AT-style command interface
and (mostly) non-volatile S-Registers. In order to get a full listing of all the available AT-Commands,
please refer to the AT command dictionary document which corresponds to the firmware revision
you intend to use.
In addition to the command dictionary there are user guides explaining the features of the firmware
in more detail. If you need to find out which firmware resides on your module simply type “ATI”
followed by a carriage return and you will be prompted with the module’s manufacturing information.
The Development Kit manual describes how to upgrade the firmware either via a serial link or over
the air.
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
6 Absolute Maximum Ratings
No.
Item
Symbol
Absolute Maximum Ratings
Unit
1
2
Supply voltage
Voltage on any Pad
Voltage on any Pad pin (PA4, PA5,
PB5, PB6, PB7, PC1), when used as an
input to the general purpose ADC with
the low voltage range selected
Module storage temperature range
Reel storage temperature range
Operating temperature range
Input RF level
Reflow temperature
V CC
V in
-0.3 to +3.6
-0.3 to V CC +0.3
Vdc
Vdc
V in
-0.3 to +2.0
Vdc
T stg
T strgreel
T op
P max
T Death
-40 to +105
0 to 75
-40 to +85
15
Please refer to chapter 12
°C
°C
°C
dBm
°C
3
4
5
6
7
8
Table 5: Absolute Maximum Ratings
The absolute maximum ratings given above should under no circumstances be violated. Exceeding
one or more of the limiting values may cause permanent damage to the device.
Caution! ESD sensitive device. Precautions should be used when handling the device
in order to prevent permanent damage.
6.1
No.
1
2
3
4
Environmental Characteristics
Item
ESD on any pad according to
Human Body Model (HBM) circuit
description
ESD on non-RF pads according to
Charged Device Model (CDM) circuit
description
ESD on RF terminal according to
Charged Device Model (CDM) circuit
description
Moisture Sensitivity Level
Symbol
Absolute Maximum Ratings
Unit
V THHBM
±2
kV
V THCDM
±400
V
V THCDM
±225
V
MSL
MSL3
Table 6: Absolute Maximum Ratings
6.2
No.
Recommended Operating Conditions
Item
Condition /
Remark
Symbol
Value
Min
1
2
3
4
Supply voltage
RF Input Frequency
RF Input Power
Operating temperature
range
Typ
Unit
Max
V CC
fC
p IN
2.1
2405
3.6
2480
0
Vdc
MHz
dBm
T op
-40
+85
°C
Table 7: Recommended Operating Conditions
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
7 DC Electrical Characteristics
V CC = 3.0V, T AMB = 25°C, NORMAL MODE (non-Boost) unless otherwise stated
No.
Item
Condition /
Remark
Symbol
Value
Min
1
Module supply voltage
Deep Sleep Current
Quiescent current,
2
internal RC oscillator
disabled
Quiescent current,
3
internal RC oscillator
enabled
Quiescent current,
4
including
32.768kHz oscillator
Quiescent current
including internal RC
5
oscillator and 32.768kHz
oscillator
Reset Current
Quiescent current
6
nReset asserted
Processor and Peripheral Currents
ARM® CortexTM M3,
25°C, 12MHz
7
RAM and flash memory
Core clock
ARM® CortexTM M3,
25°C, 24MHz
8
RAM and flash memory
Core clock
ARM® CortexTM M3,
25°C, 12MHz
9
RAM and flash memory
Core clock
sleep current
ARM® CortexTM M3,
25°C, 6MHz Core
10
RAM and flash memory
clock
sleep current
Per serial
11
Serial controller current
controller at max.
clock rate
General purpose timer
Per timer at max.
12
current
clock rate
General purpose ADC
Max. Sample
13
current
rate, DMA
RX Current
Radio receiver MAC and ARM® CortexTM
14
Baseband
M3 sleeping.
Receive current
Total, 12MHz
15
consumption
clock speed
Receive current
Total, 24MHz
16
consumption
clock speed
Receive current
Total, 12MHz
17
consumption
clock speed
BOOST MODE
Receive current
Total, 24MHz
18
consumption
clock speed
BOOST MODE
©2015 Silicon Labs
V CC
Typ
2.1
Unit
Max
3.6
Vdc
I SLEEP
0.4
µA
I SLEEP
0.7
µA
I SLEEP
1.0
µA
I SLEEP
1.3
µA
I RESET
1.2
I MCU
6.0
mA
I MCU
7.5
mA
I MCU
3.0
mA
I MCU
2.0
mA
I SC
0.2
mA
I TIM
0.25
mA
I ADC
1.1
mA
I RX
22
mA
I RX
25
mA
I RX
26.5
mA
I RX
27
mA
I RX
28.5
mA
- 18 -
2.0
mA
ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
TX Current
Transmit current
19
consumption
Transmit Current
20
consumption
BOOST MODE
Transmit current
21
consumption
Transmit current
22
consumption
23
Wake time from deep
sleep
24
Shutdown time
at +3dBm module
output power
I TXVCC
31
mA
at +8dBm module
output power
I TXVCC
42
mA
I TXVCC
28.5
mA
I TXVCC
23.5
mA
100
µs
5
µs
at +0dBm module
output power
at min. module
output power
From wakeup
event to 1st
instruction
From last
instruction into
deep sleep
Table 8: DC Electrical Characteristics
Please Note: The average current consumption during operation is dependent on the firmware and
the network load, therefore these figures are provided in the command dictionary of the respective
firmware.
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
8 Digital I/O Specifications
The digital I/Os of the ETRX35x module
V CC = 3.0V, T AMB = 25°C, NORMAL MODE unless otherwise stated
No.
Item
Condition /
Remark
Symbol
Value
Min
1
Low Schmitt switching
threshold
2
High Schmitt switching
threshold
3
4
5
6
Schmitt input
threshold going
from high to low
Schmitt input
threshold going
from low to high
Input current for logic 0
Input current for logic 1
Input Pull-up resistor
value
Input Pull-down resistor
value
7
Output voltage for logic 0
8
Output voltage for logic 1
9
Output Source Current
10
Output Sink current
11
12
13
Output Source Current
Output Sink current
Total output current
Typ
Max
V SWIL
0.42 x V CC
0.5 x V CC
Vdc
V SWIH
0.62 x V CC
0.8 x V CC
Vdc
-0.5
0.5
µA
µA
I IL
I IH
I OL = 4mA (8mA) for
standard (high
current) pads
I OH = 4mA (8mA)for
standard (high
current) pads
Standard current
pad
Standard current
pad
High current pad (1)
High current pad (1)
Unit
R IPU
24
29
34
kΩ
R IPD
24
29
34
kΩ
V OL
0
0.18 x V CC
V
V OH
0.82 x V CC
V CC
V
I OHS
4
mA
I OLS
4
mA
I OHH
I OLH
I OH + I OL
8
8
40
mA
mA
mA
Table 9. Digital I/O Specifications
Notes
1) High current pads are PA6, PA7, PB6, PB7, PC0
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
9 A/D Converter Characteristics
The ADC is a first-order sigma-delta converter. For additional information on the ADC please refer
to section 10 of the EM35x datasheet.
No.
1
2
3
4
5
Item
A/D resolution
A/D sample time for 7-bit conversion
A/D sample time for 14-bit conversion
Reference Voltage
Max current drain from Vref pin
Up to 14 bits
5.33µs
682µs
1.2V
1mA
Table 10. A/D Converter Characteristics
10 AC Electrical Characteristics
V CC = 3.0V, T AMB = 25°C, NORMAL MODE measured at 50Ω terminal load connected to the U.FL socket
No.
Receiver
Value
Min
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Frequency range
Sensitivity for 1% Packet Error Rate (PER)
Sensitivity for 1% Packet Error Rate (PER) BOOST MODE
Saturation (maximum input level for correct operation)
High-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
Low-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
2nd High-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
2nd Low-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
Channel Rejection for all other channels
(1% PER and desired signal –82dBm acc. to [1])
802.11g rejection centred at +12MHz or –13MHz
(1% PER and desired signal –82dBm acc. to [1])
Co-channel rejection
(1% PER and desired signal –82dBm acc. to [1])
Relative frequency error
(2x40ppm required by [1])
Relative timing error
(2x40ppm required by [1])
Linear RSSI range
Output power at highest power setting
NORMAL MODE
BOOST MODE
Output power at lowest power setting
Error vector magnitude as per IEEE802.15.4
Carrier frequency error
PSD mask relative
3.5MHz distance from carrier
PSD mask absolute
3.5MHz distance from carrier
Unit
Typ
Max
-100
-102
2500
-94
-96
2400
0
MHz
dBm
dBm
dBm
41
dB
44
dB
53
dB
52
dB
40
dB
36
dB
-6
dBc
-120
120
ppm
-120
120
ppm
40
0
dB
3
8
-55
5
-40 (1)
dBm
15
40 (1)
dBm
%
ppm
-20
dB
-30
dBm
Table 11. AC Electrical Characteristics
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
Notes
(1) Applies across the full ranges of rated temperature and supply voltage.
Please Note: For the relationship between EM35x power settings and module output power please
relate to chapter 10.1 of this document. When developing custom firmware the output power settings
described in this document relate directly to the EM35x power settings accessible via the Ember
stack API.
No.
Synthesiser Characteristics
Limit
Typ
Min
22
23
24
25
26
27
28
29
Frequency range
Frequency resolution
Lock time from off state, with correct VCO DAC settings
Relock time, channel change or Rx/Tx turnaround
Phase noise at 100kHz offset
Phase noise at 1MHz offset
Phase noise at 4MHz offset
Phase noise at 10MHz offset
2400
11.7
Unit
Max
2500 MHz
kHz
100 µs
100 µs
-75dBc/Hz
-100dBc/Hz
-108dBc/Hz
-114dBc/Hz
Table 12: Synthesiser Characteristics
No.
30
31
Power On Reset (POR) Specifications
V CC POR release
V CC POR assert
Min
Limit
Typ
Max
Unit
0.62
0.45
0.95
0.65
1.2
0.85
Vdc
Vdc
Table 13: Power On Reset Specifications
No.
nRESET Specifications
Min
32
33
34
35
36
Reset Filter Time constant
Reset Pulse width to guarantee a reset
Reset Pulse width guaranteed not to cause reset
Input pull-up resistor value while the chip is not reset
Input pull-up resistor value while the chip is reset
2.1
26
0
24
12
Limit
Typ
Unit
Max
12
16
29
14.5
1
34
17
µs
µs
µs
kΩ
kΩ
Table 14: nReset Specifications
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
10.1 TX Power Characteristics
The diagrams below show the typical output power and module current in dependency on module
EM35x power setting. Power settings above 3dBm have Boost Mode enabled. Please note that the
output power is independent of the supply voltage as the radio is supplied by an internally regulated
voltage.
Figure 3: Output Power vs. Power Setting
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
Transmit current A
ETRX351 and ETRX357
Figure 4: Module Current vs. Power Setting
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
11 Physical Dimensions
Figure 5: ETRX3 Physical Dimensions
Symbol
Explanation
L
W
H
A1
A2
R1
R2
X1
X2
Length of the module
Width of the module
Height of the module
Distance centre of pad PCB edge
Pitch
Keep-out Zone from corner of PCB
Keep-out Zone from corner of PCB
Distance centre of Antenna connector PCB edge
Distance centre of Antenna connector PCB edge
Typical Distance
25.0mm
19.0mm
3.8mm
0.9mm
1.27mm
17.5mm
4.1mm
3.8mm
2.8mm
Table 15: ETRX3 Physical Dimensions
For ideal RF performance when using the on-board antenna, the antenna should be located at the
corner of the carrier PCB. There should be no components, tracks or copper planes in the keep-out
area which should be as large as possible. When using the U.FL RF connector the keep-out area
does not have to be obeyed. Note: The modules’ transmit/receive range will depend on the antenna
used and also the housing of the finished product.
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
Figure 6. Typical pad dimensions
Module weight: 2.9-3.0g depending on variant
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
12 Recommended Soldering Temperature Profile
Recommended temperature profile
for reflow soldering
60 +60-20s
Temp.[°C]
230°C -250°C max.
220°C
150°C – 200°C
90 ±30s
Time [s]
Figure 7. Recommended Reflow Profile
Use of “No-Clean” solder paste is recommended to avoid the requirement for a cleaning process.
Cleaning the module is strongly discouraged because it will be difficult to ensure no cleaning agent
and other residuals are remaining underneath the shielding can as well as in the gap between the
module and the host board.
Please Note:
Maximum number of reflow cycles: 2
Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the
module on the bottom / underside of your PCB and re-flow).
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
13 Product Label Drawing
Figure 8: Product Label
The label dimensions are 16.0mm x 14.0 mm. The label will withstand temperatures and chemicals
used during a typical manufacturing process.
Imprint
Description
Model:ETRX357
000001
090101
01
02
FCC ID: S4GEM35XA
IC: 8735A-EM35XA
CE
2D-Barcode
Module Order Code.
Indication for the serial number.
Starting at 000000 for each batch incrementing with each module
Production Date Code in the format YYMMDD, e.g. 090101
Indication for batch number
Indication for the production location (first character) and the hardware revision (second
character)
The FCC ID
The IC ID
The CE Mark
Information in the 2D-Barcode are the serial number [6 characters], the Part-Order code [12
characters filled with trailing spaces e.g. “ETRX357
“ instead of “ETRX357”], identifier for
the batch number [2 characters], the identifier for the hardware release [2 characters] and
the production date code in the format Year-Month-Day [6 characters], separated by a
semicolon.
Table 16: ETRX35x Label Details
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
14 Recommended Footprint
14.1 Pad dimensions
In order to surface mount an ETRX3 series module, we recommend that you use pads which are
1mm wide and 1.2mm high. You must retain the keep-out zone shown in section 12, and ensure
that this keep-out area is free of components, copper tracks and/or copper planes/layers.
You must also ensure that there is no exposed copper on your layout which may contact with the
underside of the ETRX3 series module.
For best RF performance it is required to provide good ground connections to the ground pads of
the module. It is recommended to use multiple vias between each ground pad and a solid ground
plane to minimize inductance in the ground path.
Figure 9: Recommended Footprint
The land pattern dimensions above serve as a guideline.
We recommend that you use the same pad dimensions for the solder paste screen as you have for
the copper pads. However these sizes and shapes may need to be varied depending on your
soldering processes and your individual production standards. We recommend a paste screen
thickness of 120μm to 150μm.
Figure 6 shows the typical pad dimensions of the module and Figure 10 - Figure 12 in section 14.2
show examples of how to align the module on its host PCB.
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
Although the undersides of the ETRX3 series modules are fully coated, no exposed copper, such as
uncovered through-hole vias, planes or tracks on your board component layer, should be located
below the ETRX3 series module in order to avoid ‘shorts’. All ETRX3 series modules use a multilayer
PCB containing an inner RF shielding ground plane, therefore there is no need to have an additional
copper plane directly under the ETRX3 series module.
14.2 Recommended Placement
When placing the module please either locate the antenna in the corner as shown in Figure 10 so
that the recommended antenna keepout zone is being followed, or add a no copper zone as
indicated in Figure 12.
Figure 10. Typical placement
Figure 11. How to not place the Module
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
Figure 12. Adding a no copper / no component area
©2015 Silicon Labs
- 31 -
ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
14.3 Example carrier board
Since the RF performance of the module with the on board antenna is strongly dependent on the
proper location of the module on its carrier board, Figure 13 shows the reference carrier board which
was used during testing by Telegesis.
Figure 13. Reference Board
For best performance it is recommended to locate the antenna towards the corner of the carrier
board and to respect the recommended keep-out areas as described in section 11.
Finally to provide a good reference ground to the on board antenna, the carrier board should have
a ground plane spanning no less than 40 x 40mm. In many cases a smaller ground plane will suffice,
but degradation in radio performance could be the result.
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
15 Reliability Tests
The measurements below have been conducted on random samples out of mass production and
passed after the module has been exposed to standard room temperature and humidity for 1 hour.
No
Item
Limit
1
Vibration test
Electrical parameter should be
in specification
2
Shock test
the same as the above
3
Heat cycle test
the same as the above
4
5
6
Moisture test
Low temp. test
High temp. test
the same as the above
the same as the above
the same as the above
Condition
Freq.:40Hz,Amplitude:1.5mm
20min. / cycle,1hrs. each of X and Y axis
Dropped onto hard wood from height of
50cm for 3 times
-40°C for 30min. and +85°C for 30min.;
each temperature 300 cycles
+60°C, 90% RH, 300h
-40°C, 300h
+85°C, 300h
Table 17: Reliability Tests
16 Application Notes
16.1 Safety Precautions
These specifications are intended to preserve the quality assurance of products as individual
components.
Before use, check and evaluate the module’s operation when mounted on your products. Abide
by these specifications when using the products. These products may short-circuit. If electrical
shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit
occurs, then provide the following failsafe functions as a minimum:
(1)
(2)
Ensure the safety of the whole system by installing a protection circuit and a protection
device.
Ensure the safety of the whole system by installing a redundant circuit or another system
to prevent a single fault causing an unsafe status.
16.2 Design Engineering Notes
(1)
(2)
(3)
(4)
(5)
Heat is the major cause of shortening the life of the modules. Avoid assembly and use
of the target equipment in conditions where the product’s temperature may exceed the
maximum allowable.
Failure to do so may result in degrading of the product’s functions and damage to the
product.
If pulses or other transient loads (a large load applied in a short time) are applied to the
products, before use, check and evaluate their operation when assembled onto your
products.
These products are not intended for other uses, other than under the special conditions
shown below. Before using these products under such special conditions, check their
performance and reliability under the said special conditions carefully, to determine
whether or not they can be used in such a manner.
In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid
may splash.
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
(6)
(7)
(8)
In direct sunlight, outdoors, or in a dusty environment
In an environment where condensation occurs.
In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2, SO2,
H2S, NH3, and NOx)
(9) If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these products with new products because they may not be able to
provide normal performance even if their electronic characteristics and appearances
appear satisfactory.
(10) Mechanical stress during assembly of the board and operation has to be avoided.
(11) Pressing on parts of the metal cover or fastening objects to the metal cover is not
permitted.
16.3 Storage Conditions
(1)
(2)
(3)
(4)
(5)
(6)
The module must not be stressed mechanically during storage.
Do not store these products in the following conditions or the performance characteristics
of the product, such as RF performance, may well be adversely affected:
Storage in salty air or in an environment with a high concentration of corrosive gas, such
as Cl2, H2S, NH3, SO2, or NOX
Storage in direct sunlight
Storage in an environment where the temperature may be outside the range of 5°C to
35°C range, or where the humidity may be outside the 45 to 85% range.
Storage (before assembly of the end product) of the modules for more than one year
after the date of delivery at your company even if all the above conditions (1) to (3) have
been met, should be avoided.
17 Packaging
17.1 Embossed Tape
(1)
Dimensions of the tape
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
(2)
Cover tape peel force
Force direction
θ= 10deg
Speed = 300mm/min.
Cover tape peel force
=0.098～0.68N (10～70g)
(3)
Empty pockets
NB: Empty pockets in the populated area will be less than two per reel and those empty pockets
will not be consecutive.
17.2 Component Orientation
Top cover tape will not obstruct the carrier tape holes and will not extend beyond the edges of
the carrier tape
(top view)
Part No.
Direction
Component Orientation
17.3 Reel Dimensions
(4)
(5)
Quantity per reel: 600 pieces
Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code will be on
the reel
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
17.4 Packaging - bag
(6)
(7)
Each reel will be packed in a hermetically-sealed bag containing desiccant and a
humidity indicator card
Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code
17.5 Packaging – carton
(8)
(9)
Each reel and bag will be placed in a cardboard carton of nominal dimensions
343 x 338 x 68 mm.
Weight of carton containing reel of 600 modules: 2.51kg approx.
©2015 Silicon Labs
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ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
18 Ordering Information
Ordering/Product Code
Description
ETRX351
ETRX357
Telegesis Wireless Mesh Networking Module with Ember
ZigBee Technology:
•
•
•
•
ETRX351HR
ETRX357HR
Telegesis Wireless Mesh Networking Module with Ember
ZigBee Technology:
•
•
•
•
ETRX3DVK
Based on Ember EM351 or EM357
Telegesis AT Style Command Interpreter based on
EmberZNet meshing and self-healing ZigBee PRO
stack
Integrated 2.4GHz Antenna
Based on Ember EM351 or EM357
Telegesis AT Style Command Interpreter based on
EmberZNet meshing and self-healing ZigBee PRO
stack
U.FL coaxial Antenna Connector
Telegesis Development Kit with:
•
•
•
•
•
•
•
•
•
3 x ETRX35xDV Development Boards
3 x USB cables
2 x ETRX35x on carrier boards
2 x ETRX35xHR on carrier boards
2 x ETRX35x-LR on carrier boards
2 x ETRX35xHR-LR on carrier boards
1 x ETRX2USB USB stick
2 x ½-wave antennae
2 x ¼-wave antennae
Notes:
• Customers’ PO’s must state the Ordering/Product Code.
• There is no “blank” version of the ETRX35x modules available. All Modules are preprogrammed with the Telegesis AT style command interpreter based on the EmberZNet
stack. (In case it is desired to program custom firmware the pre-programmed firmware can
simply be overwritten).
©2015 Silicon Labs
- 38 -
ETRX35x Product Manual (Rev 1.10)
ETRX351 and ETRX357
19 RoHS Declaration
Declaration of environmental compatibility for supplied products:
Hereby we declare based on the declaration of our suppliers that this product does not contain any
of the substances which are banned by Directive 2011/65/EU (RoHS2) or if they do, contain a
maximum concentration of 0,1% by weight in homogeneous materials for:
•
•
•
•
•
Lead and lead compounds
Mercury and mercury compounds
Chromium (VI)
PBB (polybrominated biphenyl) category
PBDE (polybrominated biphenyl ether) category
And a maximum concentration of 0.01% by weight in homogeneous materials for:
•
Cadmium and cadmium compounds
20 Data Sheet Status
Telegesis (UK) Ltd. reserves the right to change the specification without notice, in order to improve
the design and supply the best possible product. Please consult the most recently issued data sheet
before initiating or completing a design.
21 Related Documents
[1] IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical Layer
(PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
[2]
Datasheet EM35x, Silicon Labs. (www.silabs.com)
[3] Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors - Low
Profile 1.9mm or 2.4mm Mated Height
[4]
The ZigBee specification (www.zigbee.org)
[5]
Specification for Antenova Rufa Antenna (www.antenova.com)
[6]
Embedded Antenna design Ltd. (EAD Ltd.) (www.ead-ltd.com)
[7]
Wellhope Communication Equipment (www.wellhope-wireless.com)
©2015 Silicon Labs
- 39 -
ETRX35x Product Manual (Rev 1.10)
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or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and
"Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to
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included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses
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