PICDEM™ Z Demonstration Kit
User’s Guide
© 2008 Microchip Technology Inc.
DS51524C
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
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suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC, SmartShunt and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
Endurance, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2008, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS51524C-page ii
© 2008 Microchip Technology Inc.
PICDEM™ Z
DEMONSTRATION KIT
USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 1
Chapter 1. Overview
1.1 Introduction ..................................................................................................... 5
1.2 PICDEM™ Z Demonstration Kit Contents ...................................................... 5
1.3 PICDEM Z Demonstration Kit ......................................................................... 6
1.4 PICDEM™ Z Motherboard ............................................................................. 7
1.5 Wireless Daughter Boards ............................................................................. 9
1.6 PICDEM™ Z CD-ROM ................................................................................... 9
Chapter 2. Getting Started with the PICDEM™ Z Demonstration Kit
2.1 Introduction ................................................................................................... 11
2.2 Microchip ZigBee-2006 Residential Stack Protocol ..................................... 11
2.3 Microchip MiWi™ Protocol ........................................................................... 12
2.4 Microchip MiWi P2P Protocol ....................................................................... 12
Appendix A. PICDEM™ Z Motherboard Schematics
A.1 PICDEM Z Motherboard Schematics ........................................................... 13
A.2 PICDEM Z Motherboard Bill of Materials ..................................................... 18
Appendix B. MRF24J40MA PICDEM Z 2.4 GHz RF Board
B.1 Introduction .................................................................................................. 19
B.2 MRF24J40MA PICDEM Z 2.4 GHz RF Board ............................................. 19
B.3 Schematic .................................................................................................... 20
B.4 PCB Layout .................................................................................................. 20
B.5 Bill of Materials ............................................................................................. 23
Appendix C. PICDEM™ Z 2.4 GHz RF Card
C.1 Introduction .................................................................................................. 25
C.2 The PICDEM™ Z MRF24J40 2.4 GHz Daughter Card ............................... 25
C.3 Schematic .................................................................................................... 26
C.4 PCB Layout .................................................................................................. 28
C.5 PICDEM Z MRF24J40 Daughter Card Bill of Materials ............................... 33
C.6 PCB Antenna Details ................................................................................... 34
Worldwide Sales and Service .................................................................................... 38
© 2008 Microchip Technology Inc.
DS51524C-page iii
PICDEM Z Demonstration Kit User’s Guide
NOTES:
DS51524C-page iv
© 2008 Microchip Technology Inc.
PICDEM™ Z
DEMONSTRATION KIT
USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
For the most up-to-date information on development tools, see the MPLAB® IDE on-line help.
Select the Help menu, and then Topics to open a list of available on-line help files.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
PICDEM™ Z Demonstration Kit. Items discussed include:
• Document Layout
• Conventions Used in this Guide
• Warranty Registration
• Recommended Reading
• The Microchip Web Site
• Development Systems Customer Change Notification Service
• Customer Support
DOCUMENT LAYOUT
This document describes how to use the PICDEM Z Demonstration Kit as a
development tool to evaluate and experiment with Microchip wireless solutions. The
manual layout is as follows:
• Chapter 1: Overview – Describes the PICDEM Z Demonstration Kit and how it
works.
• Chapter 2: Getting Started with the PICDEM™ Z Demonstration Kit – What
you need to know to start using the PICDEM Z Demonstration Kit.
• Appendix A: PICDEM™ Z Motherboard Schematics – Hardware information on
the PICDEM Z demonstration board.
• Appendix B: MRF24J40MA PICDEM Z 2.4 GHz RF Board – Hardware
information on the MRF24J40MA PICDEM Z 2.4 GHz RF Board.
• Appendix C: PICDEM™ Z 2.4 GHz RF Card – Hardware information on the
PICDEM Z 2.4 GHz RF Card.
© 2008 Microchip Technology Inc.
DS51524C-page 1
PICDEM Z Demonstration Kit User’s Guide
CONVENTIONS USED IN THIS GUIDE
Where applicable, this manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Represents
Referenced books
Emphasized text
A window
A dialog
A menu selection
A field name in a window or
dialog
A menu path
MPLAB® IDE User’s Guide
...is the only compiler...
the Output window
the Settings dialog
select Enable Programmer
“Save project before build”
A dialog button
A tab
A key on the keyboard
A hexadecimal number where
n is a hexadecimal digit
Click OK
Click the Power tab
Press <Enter>, <F1>
0xFFFF, 0x007A
Italic Courier New
Sample source code
Filenames
File paths
Keywords
Command-line options
Bit values
A binary number
A variable argument
Square brackets [ ]
Optional arguments
Curly brackets and pipe
character: { | }
Ellipses...
Choice of mutually exclusive
arguments; an OR selection
Replaces repeated text
#define START
autoexec.bat
c:\mcc18\h
_asm, _endasm, static
-Opa+, -Opa0, 1
‘b00100, ‘b10
file.o, where file can be
any valid filename
mcc18 [options] file
[options]
errorlevel {0|1}
Initial caps
Quotes
Underlined, italic text with
right angle bracket
Bold characters
Text in angle brackets < >
0xnnnn
Courier New font:
Plain Courier New
Represents code supplied by
user
DS51524C-page 2
Examples
File>Save
var_name [,
var_name...]
void main (void)
{ ...
}
© 2008 Microchip Technology Inc.
Preface
WARRANTY REGISTRATION
Please complete the enclosed Warranty Registration Card and mail it promptly.
Sending in the Warranty Registration Card entitles users to receive new product
updates. Interim software releases are available at the Microchip web site.
RECOMMENDED READING
This user's guide describes how to use the PICDEM™ Z Demonstration Kit. Other
useful documents are listed below. The following Microchip documents are available
and recommended as supplemental reference resources.
AN1232 “Microchip ZigBee-2006 Residential Stack Protocol” (DS01232)
AN1066, “MiWi™ Wireless Networking Protocol Stack” (DS01066)
AN1204, “Microchip MiWi P2P Wireless Protocol” (DS01204)
AN1192, “MRF24J40 Radio Driver Utility Program” (DS01192)
These application notes describe how you can use the Microchip wireless solutions to
quickly build your application. To illustrate the usage of the Microchip Wireless Protocol
Stack’s working demo, applications are provided in their respective application notes.
These demo applications can be used as a reference or simply modified and adapted
to your requirements.
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
© 2008 Microchip Technology Inc.
DS51524C-page 3
PICDEM Z Demonstration Kit User’s Guide
DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip
products. Subscribers will receive e-mail notification whenever there are changes,
updates, revisions or errata related to a specified product family or development tool of
interest.
To register, access the Microchip web site at www.microchip.com, click on Customer
Change Notification and follow the registration instructions.
The Development Systems product group categories are:
• Compilers – The latest information on Microchip C compilers and other language
tools. These include the MPLAB C18 and MPLAB C30 C compilers; MPASM™
and MPLAB ASM30 assemblers; MPLINK™ and MPLAB LINK30 object linkers;
and MPLIB™ and MPLAB LIB30 object librarians.
• Emulators – The latest information on Microchip in-circuit emulators.This
includes the MPLAB ICE 2000 and MPLAB ICE 4000.
• In-Circuit Debuggers – The latest information on the Microchip in-circuit
debugger, MPLAB ICD 2.
• MPLAB® IDE – The latest information on Microchip MPLAB IDE, the Windows®
Integrated Development Environment for development systems tools. This list is
focused on the MPLAB IDE, MPLAB SIM simulator, MPLAB IDE Project Manager
and general editing and debugging features.
• Programmers – The latest information on Microchip programmers. These include
the MPLAB PM3 and PRO MATE II device programmers and the PICSTART®
Plus and PICkit™ 1 development programmers.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://support.microchip.com
DOCUMENT REVISION HISTORY
Revision C (November 2008)
• Extensive rewrite of all sections.
DS51524C-page 4
© 2008 Microchip Technology Inc.
PICDEM™ Z
DEMONSTRATION KIT
USER’S GUIDE
Chapter 1. Overview
1.1
INTRODUCTION
This chapter introduces the PICDEM™ Z Demonstration Kit features. This chapter
discusses:
•
•
•
•
•
1.2
PICDEM™ Z Demonstration Kit Contents
PICDEM Z Demonstration Kit
PICDEM™ Z Motherboard
Wireless Daughter Boards
PICDEM™ Z CD-ROM
PICDEM™ Z DEMONSTRATION KIT CONTENTS
The PICDEM Z Demonstration Kit (Part Number DM163027-5) contains the following
items:
1.
2.
3.
4.
5.
6.
Two PICDEM™ Z Motherboards
Two MRF24J40MA PICDEM Z 2.4 GHz RF Boards
PICDEM Z CD-ROM
ZENA™ Network Analyzer
USB Cable
ZENA CD-ROM
These items can be ordered separately. Table 1-1 lists the individual part numbers.
TABLE 1-1:
PICDEM™ Z COMPONENT PART NUMBERS
Description
Part Number
PICDEM™ Z Motherboard
AC163027-1
MRF24J40MA PICDEM Z 2.4 GHz RF Board
AC163028
ZENA™ Network Analyzer
DM183023
© 2008 Microchip Technology Inc.
DS51524C-page 5
PICDEM Z Demonstration Kit User’s Guide
FIGURE 1-1:
1.3
PICDEM™ Z DEMONSTRATION KIT
PICDEM Z DEMONSTRATION KIT
The PICDEM Z Demonstration Kit allows developers to evaluate and develop with
Microchip wireless solutions. The kit provides two motherboards and two 2.4 GHz
MRF24J40MA daughter boards which can be used to form a simple two node wireless
network. More nodes can be added by purchasing additional PICDEM Z Demonstration
Kits or individual components (see Table 1-1).
The PICDEM Z Demonstration Kit comes preprogrammed with a wireless demo program. Refer to Chapter 2. “Getting Started with the PICDEM™ Z Demonstration
Kit” to learn how to operate the preprogrammed demo program and how to load other
Microchip Wireless Protocols for evaluation and development. Additional wireless protocols can be downloaded from the Microchip Wireless Design Center at
http://www.microchip.com/wireless/.
The motherboard is powered by an external power supply via the 2.5 mm coaxial power
connector (J1) or portably via a 9V battery (B1).
Note:
The 9V wall adapter and 9V battery are not included in the kit. A 9V wall
adapter may be ordered from microchipDIRECT under part number
AC162039.
The kit comes with the ZENA™ Network Analyzer that graphically displays wireless
network traffic following the IEEE 802.15.4™ specification on the 2.4 GHz band. The
ZENA Network Analyzer supports IEEE 802.15.4, ZigBee™ and MiWi™ protocols. The
software can analyze complete network traffic and graphically display decoded packets. It can also display a graphical representation of the network topology and the messages as they flow through the network. This information can then be saved and/or
exported for further analysis. Refer to the User's Guide (DS51606) for more information
on the operation of the ZENA Network Analyzer.
DS51524C-page 6
© 2008 Microchip Technology Inc.
Overview
1.4
PICDEM™ Z MOTHERBOARD
The PICDEM Z Motherboard contains many features to enable the evaluation and
development of wireless solutions. Figure 1-2 shows the motherboard with a
MRF24J40MA Module Daughter Board plugged in. Below is a description of the call
outs in the figure. The motherboard schematic, PCB layout and bill of materials are
available in Appendix A.
1. Microcontroller 28 and 40-pin DIP Sockets: The sockets allow the use of a variety
of 28 and 40-pin DIP package PIC® microcontrollers. The 40-pin socket (U4)
contains a PIC18LF4620 microcontroller clocked by a 4 MHz crystal (Y1). The
28-pin socket is unpopulated and is located under the 40-pin DIP package. To
use the 28-pin connector, carefully remove the 40-pin DIP microcontroller.
2. Temperature Sensor: The motherboard contains the Microchip TC77 thermal
sensor with SPI interface. The TC77 shares the SPI bus with the wireless
daughter card plugged into connector J2.
3. LEDs: D1 and D2 are driven by microcontroller ports RA0 and RA1, respectively.
4. Push Button Switches: S2 and S3 are connected to microcontroller ports RB5
and RB4, respectively. There are no external pull-up resistors on the motherboard. Therefore, the internal pull-up on PORTB feature must be enabled.
5. MCLR Push Button Switch: Connected to the MCLR pin of the microcontroller.
6. ICSP™ Jack: The 6-pin RJ-11 jack is used to connect a microcontroller programmer such as the MPLAB ICD 2 in-circuit debugger or MPLAB REAL ICE™
in-circuit emulator.
7. RS-232 Connector: Allows the motherboard to connect to a PC serial port for
interactive control or debugging. The microcontroller USART interfaces to the
RS-232 connector via a RS-232 level shifter (U5).
8. Wireless Daughter Card Connector: Connector J2 is a 12-pin connector that supplies 3.3V power, 4-wire SPI, reset, wake and interrupt connections to the microcontroller. The pinout is shown in Figure 1-3. The 12-pin connector is a Samtec
P/N LST-106-07-F-D.
9. Prototyping Area: Provided to breadboard additional circuitry for development.
Connections to +3.3V, ground and microcontroller I/O signals are provided.
10. Power: The motherboard is powered by an external power supply via the 2.5 mm
coaxial power connector (J1) or portably via a 9V battery (B1). The on-board voltage regulator (U2) is a LP2981, a micropower 100 mA ultra low-dropout regulator
in a SOT-23 package. The maximum input voltage for the LP2981 is 16V. The
motherboard is protected from accidental reverse power connection by diode D3.
When using a 9V battery, S7 switches the power on and off. When powering via
an external power supply, J1 will disconnect the battery from the circuit and
power the circuit continuously (switch S7 only switches the battery on or off, not
the external power source).
CAUTION
Do not exceed the combined current rating of 100 mA for all circuitry or the voltage
regulator will overheat and possibly fail.
Note:
A 9V wall adapter may be ordered from microchipDIRECT under part
number AC162039.
11. Measure Current: Jumper JP4 can be used to measure the current draw by all
the circuitry on the motherboard past the voltage regulator (U2). To measure the
current, cut the PCB trace on the bottom side and insert an ampmeter. You can
also install a low value resistor into position R9 and measure the voltage across
to determine the current.
© 2008 Microchip Technology Inc.
DS51524C-page 7
PICDEM Z Demonstration Kit User’s Guide
TABLE 1-2:
JUMPERS
Jumper
Purpose
J3
To connect or disconnect the RS-232 level shifter U5 from the microcontroller
USART. The pins are connected by PCB traces.
JP2
To enable or disable LED D1. The pins are connected by PCB traces.
JP3
To enable or disable LED D2. The pins are connected by PCB traces.
JP4
To measure current draw by all circuitry past the voltage regulator U2.
FIGURE 1-2:
PICDEM™ Z MOTHERBOARD
10
7
6
11
5
4
8
2
3
1
9
DS51524C-page 8
© 2008 Microchip Technology Inc.
Overview
FIGURE 1-3:
CONNECTOR J2 PINOUT
J2
Microcontroller
Signal
Pin
Pin
Signal
Microcontroller
RB3
12
11
RB1
10
9
SCK
RC3
RB2
RC4
MISO
8
7
MOSI
RC5
RC0
CS
6
5
INT
RB0
RC1
WAKE
4
3
RESET
RC2
GND
2
1
+3.3V
(Top view on Motherboard)
1.5
WIRELESS DAUGHTER BOARDS
The PICDEM Z Motherboard is designed to interface with a variety of wireless daughter
boards via connector J2. Connector J2 is a 12-pin connector that supplies 3.3V power,
4-wire SPI, reset, wake and interrupt connections to the microcontroller. The pinout is
shown in Figure 1-3. The 12-pin connector is a Samtec P/N LST-106-07-F-D.
1.6
PICDEM™ Z CD-ROM
The PICDEM Z CD-ROM contains documentation on the motherboard, wireless
daughter boards, data sheets, application notes and wireless protocol software. Check
the Microchip web site for the latest revisions http://www.microchip.com/wireless/.
© 2008 Microchip Technology Inc.
DS51524C-page 9
PICDEM Z Demonstration Kit User’s Guide
NOTES:
DS51524C-page 10
© 2008 Microchip Technology Inc.
PICDEM™ Z
DEMONSTRATION KIT
USER’S GUIDE
Chapter 2. Getting Started with the PICDEM™ Z Demonstration Kit
2.1
INTRODUCTION
The PICDEM Z Demonstration Kit can be used with a variety of Microchip software protocol stacks or it can be used to develop proprietary protocol stacks. Microchip software
protocol stacks are available as a free download, including source code, from the
Microchip website: http://www.microchip.com/wireless/.
The PICDEM Z Demonstration Kit assumes that the user is familiar with Microchip PIC
microcontrollers and development tools such as MPLAB IDE. There is a wealth of getting started information on the Microchip website http://www.microchip.com/. Select the
Design>Getting Started links for more information about microcontrollers and development tools.
Topics covered in this chapter include:
• Microchip ZigBee-2006 Residential Stack Protocol
• Microchip MiWi™ Protocol
• Microchip MiWi P2P Protocol
2.2
MICROCHIP ZIGBEE-2006 RESIDENTIAL STACK PROTOCOL
The ZigBee protocol is a wireless network protocol specifically designed for low data
rate, low-cost wireless sensors and control networks. It is based on the IEEE 802.15.4
global standard ensuring interoperability and reliable communication. ZigBee protocol
supports star, cluster and mesh wireless network topologies making it well suited for
short range and low-power applications. The Microchip ZigBee-2006 protocol is certified to run on the PIC18 and PIC24 families of Microchip PIC microcontrollers and the
MRF24J40 2.4 GHz RF Transceiver.
The software stack is available on the PICDEM Z CD-ROM. Check the Microchip web
site for the latest revision at http://www.microchip.com/wireless/. Once the software
stack is installed, the source code and documentation are available at:
C:\Microchip Solutions\ZigBee2006Res\
The PICDEM Z Demonstration Kit is preprogrammed with a ZigBee protocol demo program. Please refer to the “Getting Started: Running the ZigBee-2006 Demo” document
located in the directory: C:\Microchip Solutions\ZigBee2006Res\
Complete documentation is available in application note AN1232, “Microchip
ZigBee-2006 Residential Stack Protocol” (DS01232).
© 2008 Microchip Technology Inc.
DS51524C-page 11
PICDEM Z Demonstration Kit User’s Guide
2.3
MICROCHIP MiWi™ PROTOCOL
The MiWi Wireless Networking Protocol is a simple protocol designed for low data rate,
short distance, low-cost networks. It is an application layer on top of the IEEE 802.15.4
MAC and PHY layers. The MiWi protocol provides an easy-to-use alternative for wireless communication. In particular, it targets smaller applications that have relatively
small network sizes with few hops between nodes. The MiWi protocol runs on a variety
of Microchip PIC microcontrollers in the PIC18, PIC24 and PIC32 families and the
MRF24J40 2.4 GHz RF Transceiver.
The software stack is available on the PICDEM Z CD-ROM. Check the Microchip web
site for the latest revision http://www.microchip.com/wireless/. Once the software stack
is installed, the source code and documentation are available at:
C:\Microchip Solutions\MiWi\
To load and run the MiWi Protocol demonstration program, please refer to the “Getting
Started: Running the MiWi™ demo” document located in the above directory.
Complete documentation is available in application note AN1066, “MiWi™ Wireless
Networking Protocol Stack” (DS01066).
2.4
MICROCHIP MiWi P2P PROTOCOL
The MiWi Peer-to-Peer (P2P) protocol is an application layer on top of the IEEE
802.15.4 MAC and PHY layers that supports peer-to-peer and star topologies. It has
no routing mechanism, so the wireless communication coverage is defined by the radio
range. Application note AN1204, “Microchip MiWi P2P Wireless Protocol” describes
the MiWi P2P protocol. It details the supported features and how to implement them.
Simple application level data structures and programming interfaces are also
described. The MiWi P2P protocol runs on a variety of Microchip PIC microcontrollers
in the PIC18, PIC24 and PIC32 families and the MRF24J40 2.4 GHz RF Transceiver.
The software stack is available on the PICDEM Z CD-ROM. Check the Microchip web
site for the latest revision at http://www.microchip.com/wireless/. Once the software
stack is installed, the source code and documentation are available at:
C:\Microchip Solutions\P2P\
To load and run the MiWi P2P Protocol demonstration program, please refer to the
“Getting Started: Running the MiWi™ P2P demo” document located in the above
directory.
Complete documentation is available in application note AN1204, “Microchip MiWi P2P
Wireless Protocol” (DS01204).
DS51524C-page 12
© 2008 Microchip Technology Inc.
PICDEM™ Z
DEMONSTRATION KIT
USER’S GUIDE
Appendix A. PICDEM™ Z Motherboard Schematics
A.1
PICDEM Z MOTHERBOARD SCHEMATICS
The PICDEM Z motherboard schematics are shown here. The RF daughter card
schematics are found in the appendices that follow.
Topic included in this appendix are:
• PICDEM Z Motherboard Schematics
• PICDEM Z Motherboard Bill of Materials
© 2008 Microchip Technology Inc.
DS51524C-page 13
PICDEM Z Demonstration Kit User’s Guide
8
10
12
16
7
1 EN
INVALID
FORCEON
FORCEOFF
14 GND
V-
13
9
2 C1+
4 C15 C2+
6 C2-
DS51524C-page 14
11
PICDEM™ Z MOTHERBOARD
VCC 15
V+ 3
FIGURE A-1:
© 2008 Microchip Technology Inc.
PICDEM™ Z Motherboard Schematics
FIGURE A-2:
PICDEM™ Z MOTHERBOARD TOP ASSEMBLY
M
© 2008 Microchip Technology Inc.
DS51524C-page 15
PICDEM Z Demonstration Kit User’s Guide
FIGURE A-3:
DS51524C-page 16
PICDEM™ Z MOTHERBOARD LAYER 1
© 2008 Microchip Technology Inc.
PICDEM™ Z Motherboard Schematics
FIGURE A-4:
PICDEM™ Z MOTHERBOARD LAYER 2
© 2008 Microchip Technology Inc.
DS51524C-page 17
PICDEM Z Demonstration Kit User’s Guide
A.2
PICDEM Z MOTHERBOARD BILL OF MATERIALS
TABLE A-1:
PICDEM™ Z MOTHERBOARD BILL OF MATERIALS (BOM)
Reference
Description
Vendor
Vendor P/N
D3
Diode Schottky 20V 1A SMD MELF
Diodes Inc.
1N5817M-13
BT1
Conn Batt Male 9V Horz Snap-on
Keystone Electronics
593
BT1
Conn Batt Fem 9V Horz Snap-on
Keystone Electronics
594
Conn PC Vert 9V Snap-on
Keystone Electronics
968
C3, C4
22 pF 100V 5% Monolith Cerm Cap
Panasonic - ECG
ECU-S2A220JCA
C1, C2, C5, C7,
C9, C10, C11,
C12, C13, C14
Cap .1 μF 16V Ceramic X7R 0805
Panasonic - ECG
ECJ-2VB1C104K
C6
Capacitor Tant 2.2 μF 25V 10% SMD
Kemet
T491B225K025AS
C8
Capacitor Tant 3.3 μF 16V 10% SMD
Kemet
T491B335K016AS
Y1
Crystal 4.000 MHz 20 pF HC-49/US
ECS Inc.
ECS-40-20-4
P1
DB9 F
J1
Conn Powerjack Mini .1" R/A PCMT
Switchcraft Inc.
RAPC712
2 x 6 .100" Socket/Terminal
Samtec
LST-106-07-F-D
D1, D2
LED Thin 565NM Grn Diff 0805 SMD
Lumex Opto
SML-LXT0805GW-TR
U2
IC Reg LDO Micropower SOT23-5
National Semiconductor LP2981AIM5-3.3
J3
J2
JP2, JP3, JP4
U5
Maxim
MAX3221CAE
U1
28-pin Socket
Mill-Max
110-99-328-41-001
U4
40-pin Socket (needs to have no internal ribs) Mill-Max
110-99-640-41-001
U4
PIC® MCU
Microchip
PIC18LF4620-I/P
R3
No Load
R5, R6
Res 330 OHM 1/8W 5% 0805 SMD
Yageo America
9C08052A3300JLHFT
R2, R7, R8
Res 470 OHM 1/8W 5% 0805 SMD
Yageo America
9C08052A4700JLHFT
R1
Res 4.7K OHM 1/8W 5% 0805 SMD
Yageo America
9C08052A4701JLHFT
R4
Res 1.0M OHM 1/8W 5% 0805 SMD
Yageo America
9C08052A1004JLHFT
J5
Conn Mod Jack 6-6 R/A PCB 50AU
AMP/Tyco
520470-3
S1, S2, S3
Switch Tact 6MM SMD MOM 230GF
Omron Electronics
B3S-1002
S7
Switch Slide SPDT PC MNT L = 2 MM
E-Switch, Inc.
EG1271
U3
IC Sensor Thermal SPI 3.3V SOT235
Microchip
TC77-3.3MCTTR
Test Point PC Multi-Purpose Blk
Keystone Electronics
5011
Test Point PC Multi-Purpose Red
Keystone Electronics
5010
DS51524C-page 18
© 2008 Microchip Technology Inc.
PICDEM™ Z
DEMONSTRATION KIT
USER’S GUIDE
Appendix B. MRF24J40MA PICDEM Z 2.4 GHz RF Board
B.1
INTRODUCTION
This appendix describes the MRF24J40MA Z 2.4 GHz RF Board. Topics covered in this
appendix include:
•
•
•
•
B.2
MRF24J40MA PICDEM Z 2.4 GHz RF Board
Schematic
PCB Layout
Bill of Materials
MRF24J40MA PICDEM Z 2.4 GHz RF BOARD
The MRF24J40MA PICDEM Z 2.4GHz RF Board (AC163028) is shown in Figure B-1.
It features the MRF24J40MA transceiver module. The MRF24J40MA is a fully FCC, IC
and ETSI certified module. It is designed to plug into the PICDEM Z Motherboard, or to
any application, using a 12-pin connector. The 12-pin connector is available from
Samtec P/N LST-106-07-F-D.
For more information about the MRF24J40 IC and module, refer to:
“MRF24J40 2.4 GHz IEEE 802.15.4 RF Transceiver Data Sheet” (DS39776)
“MRF24J40MA 2.4 GHz IEEE 802.15.4 RF Transceiver Module Data Sheet”
(DS70329)
Features of the PICDEM Z MRF24J40 2.4 GHz RF Board include:
1. MRF24J40MA Transceiver Module (U1): An IEEE 802.15.4 compliant transceiver module.
2. Daughter Card Connector (P1): Connector P1 is a 12-pin connector used to connect to the PICDEM Z Motherboard or any application with a mating connector.
It supplies 3.3V power, 4-wire SPI, reset, wake and interrupt connections to the
MRF24J40MA. The pinout is shown in Figure B-2. The 12-pin connector is a
Samtec P/N LST-106-07-F-D.
© 2008 Microchip Technology Inc.
DS51524C-page 19
PICDEM Z Demonstration Kit User’s Guide
FIGURE B-1:
B.3
MRF24J40MA PICDEM™ Z 2.4 GHz RF BOARD
SCHEMATIC
The schematic for the MRF24J40MA module is available in the MRF24J40MA Data
Sheet (DS70329). Figure B-2 shows the schematic of the daughter board with the
MRF24J40MA module mounted on it.
FIGURE B-2:
MRF24J40MA PICDEM™ Z GHZ RF BOARD SCHEMATIC
U1
MRF24J40MA
GND
RESET
WAKE
INT
SDI
SCK
GND
GND
Vin
CLKOUT
CS
SDO
12
11
10
9
NC
8
7
NC
1
2
3
4
5
6
11 9 7 5 3 1
P1
C1
0.1æF
NC
NC
12 10 8 6 4 2
B.4
PCB LAYOUT
Figure B-3 through Figure B-6 show the PCB layout of the daughter board without the
MRF24J40MA module mounted on it.
DS51524C-page 20
© 2008 Microchip Technology Inc.
MRF24J40MA PICDEM Z 2.4 GHz RF Board
FIGURE B-3:
TOP SILKSCREEN
FIGURE B-4:
TOP COPPER
© 2008 Microchip Technology Inc.
DS51524C-page 21
PICDEM Z Demonstration Kit User’s Guide
DS51524C-page 22
FIGURE B-5:
BOTTOM COPPER
FIGURE B-6:
BOTTOM SILKSCREEN
© 2008 Microchip Technology Inc.
MRF24J40MA PICDEM Z 2.4 GHz RF Board
B.5
BILL OF MATERIALS
TABLE B-1:
BILL OF MATERIALS
Reference Designator
Value
Description
U1
MRF24J40MA
IEEE 802.15.4™ Transceiver
Module
C1
0.1 uF, 16V, X7R, 10%, 0603
Capacitor, Ceramic
P1
LST-106-07-F-D
Samtec Connector 2x6 Header
with Locking Socket
© 2008 Microchip Technology Inc.
DS51524C-page 23
PICDEM Z Demonstration Kit User’s Guide
NOTES:
DS51524C-page 24
© 2008 Microchip Technology Inc.
PICDEM™ Z
DEMONSTRATION KIT
USER’S GUIDE
Appendix C. PICDEM™ Z 2.4 GHz RF Card
C.1
INTRODUCTION
This appendix describes the PICDEM Z MRF24J40 2.4 GHz Daughter Card. Topics
discussed in this chapter are:
•
•
•
•
•
C.2
The PICDEM™ Z MRF24J40 2.4 GHz Daughter Card
Schematic
PCB Layout
PICDEM Z MRF24J40 Daughter Card Bill of Materials
PCB Antenna Details
THE PICDEM™ Z MRF24J40 2.4 GHz DAUGHTER CARD
The PICDEM Z MRF24J40 2.4 GHz Daughter Card (AC163027-4) is shown in
Figure C-1. It features the MRF24J40 transceiver IC, all passive circuitry, PCB
antenna, and optional SMA connector footprint. It is designed to plug into the PICDEM
Z Motherboard, or to any application, using a 12-pin connector or Explorer 16
Development Board using the side edge connector.
The PICDEM Z MRF24J40 2.4 GHz Daughter Card is a good platform to evaluate an
inverted F-type PCB antenna. The optional SMA connector can be populated to
evaluate external antenna options or to connect to test equipment for measurement.
The PICDEM Z MRF24J40 2.4 GHz Daughter Card may be used as a reference
design. The Gerber files are available for download on the at Microchip website
http://www.microchip.com/wireless/ and on the PICDEM Z CD-ROM.
More information about the MRF24J40 IC, refer to:
“MRF24J40 2.4 GHz IEEE 802.15.4 RF Transceiver Data Sheet” (DS39776)
Features of the PICDEM Z MRF24J40 2.4 GHz Daughter Card include:
1. MRF24J40 Transceiver IC (U1): An IEEE 802.15.4 compliant transceiver IC in a
40-pin QFN package.
2. Daughter Card Connector (J2): Connector J2 is a 12-pin connector used to connect to the PICDEM Z Motherboard or any application with a mating connector.
It supplies 3.3V power, 4-wire SPI, reset, wake and interrupt connections to the
MRF24J40. The pinout is shown in Figure C-2. The 12-pin connector is a Samtec
P/N LST-106-07-F-D.
3. PCB Edge Connector (J3): Connector J3 is a 30-pin connector used to connect
to the Explorer 16 Development Board. It supplies 3.3V power, 4-wire SPI, reset,
wake and interrupt connections to the MRF24J40. The pinout is shown in
Figure C-2.
4. PCB Antenna: An inverted F-type PCB antenna.
5. Optional SMA Connector (P5): The SMA footprint may be populated with an
SMA connector for connecting to an external antenna or test equipment. The
PCB antenna is connected by default. To enable the SMA connector and disable
the PCB antenna, removed capacitor C38 and move it to position C8.
© 2008 Microchip Technology Inc.
DS51524C-page 25
PICDEM Z Demonstration Kit User’s Guide
Note:
The MRF24J40 SDO pin 17 defaults to a low state when nCS is high (the
MRF24J40 is not selected). If the MRF24J40 Daughter Card is to share an
SPI bus, a tri-state buffer can be placed on the SDO signal to provide a
high-impedance signal to the SPI bus. Refer to the “MRF24J40 Data Sheet”
(DS39776) for more information.
FIGURE C-1:
C.3
PICDEM™ Z MRF24J40 2.4 GHZ DAUGHTER CARD
SCHEMATIC
The PICDEM Z MRF24J40 2.4 GHz Daughter Card schematic is shown in Figure C-2.
DS51524C-page 26
© 2008 Microchip Technology Inc.
FIGURE C-2:
PICDEM Z MRF24J40 2.4 GHZ DAUGHTER CARD SCHEMATIC
PICDEM Z Demonstration Kit User’s Guide
DS51524C-page 27
© 2008 Microchip Technology Inc.
PICDEM Z Demonstration Kit User’s Guide
C.4
PCB LAYOUT
The PICDEM Z MRF24J40 2.4 GHz Daughter Card is fabricated as a four layer PCB.
The material is FR4 with signal traces in 0.5 oz copper. Figure C-4 through Figure C-9
show the individual layers from top to bottom. Figure C-10 shows the layer stack up.
The following guidelines are intended to aid users in high-frequency PCB layout
design. The printed circuit board is comprised of four basic FR4 layers: signal layout,
RF ground, power line routing and ground (see Figure C-3). The guidelines will explain
the requirements of these layers.
FIGURE C-3:
FOUR BASIC COPPER FR4 LAYERS
Signal Layout, Thickness = 1.8 mils
Dielectric ε = 4.5, Thickness = 7 mils
RF Ground, Thickness = 1.2 mils
Dielectric ε = 4.5, Thickness = 19 mils
Power Line Routing, Thickness = 1.2 mils
Dielectric ε = 4.5, Thickness = 7 mils
Ground, Thickness = 1.8 mils
Note:
Care should be taken with all ground lines to prevent breakage.
• It is important to keep the original PCB thickness since any change will affect
antenna performance (see total thickness of dielectric) or microstrip lines
characteristic impedance.
• The first layer width of a 50Ω characteristic impedance microstrip line is 12 mils.
• Avoid having microstrip lines longer than 2.5 cm, since that line might get very
close to a quarter wave length of the working frequency of the board which is
3.0 cm, and start behaving as an antenna.
• Except for the antenna layout, avoid sharp corners since they can act as an
antenna. Round corners will eliminate possible future EMI problems.
• Digital lines by definition are prone to be very noisy when handling periodic
waveforms and fast clock/switching rates. Avoid laying out a RF signal close to
any digital lines.
• A via filled ground patch underneath the IC transceiver is mandatory.
• A power supply must be distributed to each pin in a star topology and low-ESR
capacitors must be placed at each pin for proper decoupling noise.
• Thorough decoupling on each power pin is beneficial for reducing in-band transceiver noise, particularly when this noise degrades performance. Usually, low
value caps (27-47 pF) combined with large value caps (100 nF) will cover a large
spectrum of frequency.
• Passive components (inductors) must be in the high-frequency category and the
SRF (Self-Resonant Frequency) should be at least two times higher than the
operating frequency.
DS51524C-page 28
© 2008 Microchip Technology Inc.
PICDEM™ Z 2.4 GHz RF Card
FIGURE C-4:
TOP SILKSCREEN
FIGURE C-5:
TOP COPPER – LAYER 1
© 2008 Microchip Technology Inc.
DS51524C-page 29
PICDEM Z Demonstration Kit User’s Guide
DS51524C-page 30
FIGURE C-6:
GROUND PLANE – LAYER 2
FIGURE C-7:
POWER PLANE – LAYER 3
© 2008 Microchip Technology Inc.
PICDEM™ Z 2.4 GHz RF Card
FIGURE C-8:
BOTTOM COPPER – LAYER 4
FIGURE C-9:
BOTTOM SILKSCREEN
© 2008 Microchip Technology Inc.
DS51524C-page 31
PICDEM Z Demonstration Kit User’s Guide
FIGURE C-10:
PCB STACKUP
Top Copper
0.5 oz
7 mil
FR4
Ground Plane
0.5 oz
19 mil
FR4
Power Plane
0.5 oz
7 mil
FR4
Bottom Copper
DS51524C-page 32
Total
39 mil
0.5 oz
© 2008 Microchip Technology Inc.
PICDEM™ Z 2.4 GHz RF Card
C.5
PICDEM Z MRF24J40 DAUGHTER CARD BILL OF MATERIALS
TABLE C-1:
Quantity
MRF24J40 DAUGHTER CARD BILL OF MATERIALS(1)
Reference
Description
Component Name
Value
Description
Vendor
Vendor #
1
CAP3528
C1
2.2 μF_Tant Capacitor TANT,
Kemet
2.2 μF, 25V, 10%, SMD
4
CAP0402
C23, C37,
C38, C43
0.5 pF
CAP, Ceramic, 0.5 pF,
50V, NP0, 0402
Yageo America 0402CG508C9B200
2
CAP0402
C21, C54
20 pF
CAP, Ceramic, 20 pF,
50V, 5%, C0G, 0402
Murata
Electronics
GRM1555C1H200JZ01D
4
CAP0402
C19, C44,
C55, C58
27 pF
CAP, Ceramic, 27 pF,
50V, 0402, SMD
Panasonic ECG
ECJ-0EC1H270J
1
CAP0402
C40
47 pF
CAP, Ceramic, 47 pF,
50V, C0G, 5%, 0402
TDK
Corporation
C1005C0G1H470J
2
CAP0402
C52, C63
10 nF
CAP, Ceramic,
10000 pF, 16V, X7R,
0402
Kemet
C0402C103K4RACTU
2
CAP0402
C39, C45
100 nF
CAP, Ceramic, 100 nF,
10V, X7R, 10%, 0402
Kemet
C0402C104K8PACTU
1
CAP0402
C48
180 pF
CAP, Ceramic, 180 pF,
50V, C0G, 5%, 0402
TDK
Corporation
C1005C0G1H181J
1
CAP0603
C53
2.2 μF
CAP, Ceramic, 2.2 μF,
10V, Y5V, 0603
Taiyo Yuden
LMK107F225ZA-T
1
CRYSTAL_ABM8
Y3
20 MHz
Crystal, 20.000 MHz,
18 pF, FUND, SMD
Abracon
Corporation
ABM8-20.000MHZ-B2-T
1
MRF24J40_I/ML
U1
MRF24J40, Single
Chip Transceiver
Microchip
MRF24J40-I/ML
1
IND0402
L1
4.7 nH
Inductor Multilayer,
4.7 nH, 0402
TDK
Corporation
MLK1005S4N7S
1
IND0402
L3
5.6 nH
Inductor Multilayer,
5.6 nH, 0402
TDK
Corporation
MLK1005S5N6D
2
IND0402
L4, L5
10 nH
Inductor Multilayer,
10 nH, 0402
TDK
Corporation
MLK1005S10NJ
2
RES0402
R20, R22
0Ω
RES, 0Ω, 1/16W, 5%,
0402, SMD
Panasonic ECG
ERJ-2GE0R00X
1
RES0402
R19
10K
RES, 10 kΩ, 1/16W,
5%, 0402, SMD
Yageo America RC0402JR-0710KL
1
HDR6X2
J2
.100" Socket/Terminal
Samtec
Note 1:
T491B225K025AT
LST-106-07-F-D
Not placed: C7, C8, C41, C42, P5 and Y1.
© 2008 Microchip Technology Inc.
DS51524C-page 33
PICDEM Z Demonstration Kit User’s Guide
C.6
PCB ANTENNA DETAILS
FIGURE C-11:
IMPEDANCE OF THE PCB ANTENNA
FIGURE C-12:
IMPEDANCE OF THE PCB ANTENNA IN SMITH CHART
DS51524C-page 34
© 2008 Microchip Technology Inc.
PICDEM™ Z 2.4 GHz RF Card
FIGURE C-13:
IMPEDANCE OF THE PCB ANTENNA WITH VOLTAGE STANDING WAVE RATIO
The most critical part of maintaining proper impedance is adhering to the specified
dimensions of the printed circuit board antenna (see Figure C-14). The antenna dimensions, if altered, will change the specified impedance. As an example, a 1 mm variance
will shift the impedance by 5-10 MHz.
Note:
FIGURE C-14:
This part has been simulated using a HFSS™ simulator by Ansoft
Corporation.
PRINTED CIRCUIT BOARD ANTENNA DIMENSIONS(1)
1.3
22.0
1.0
6.0
4.2
8.6
3.8
2.0
5.3
1.0
9.6
0.5
1.2
0.5
3.37
6.6
4.3
1.54
0.85
1.2
3.82
1.0
2.0
1.0
1.0
6.6
0.72
Note 1:
Dimensions are in mm and tolerance is +/– 0.05 mm.
Figure C-15 and Figure C-16 illustrate simulation results of this PCB antenna. Note the
simulation results are very close to the measurements.
© 2008 Microchip Technology Inc.
DS51524C-page 35
PICDEM Z Demonstration Kit User’s Guide
FIGURE C-15:
DS51524C-page 36
SIMULATED PCB ANTENNA IMPEDANCE, XY PLOT
© 2008 Microchip Technology Inc.
PICDEM™ Z 2.4 GHz RF Card
FIGURE C-16:
SIMULATED PCB ANTENNA IMPEDANCE, SMITH PLOT
© 2008 Microchip Technology Inc.
DS51524C-page 37
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
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Tel: 91-11-4160-8631
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01/02/08
DS51524C-page 38
© 2008 Microchip Technology Inc.