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Datasheet
65V, 1A, 2MHz Synchronous Step-Down
Regulator with 20ns minimum on pulse
Under Development
BD51180TL
General Description
Key Specifications
BD51180TL is a current mode synchronous DC/DC
converter integrating high voltage tolerant POWER
MOSFETs. The wide range input up to 65V and the very
short minimum on pulse down to 20ns enables direct
conversion from 48 V battery to 3.3 V at 2.1 MHz
operation.
Input Voltage Range:
12 V to 65 V
Minimum ON pulse:
20 ns
Output Voltage Range:
1 to 5 V
Output Current:
1A (Max)
Selectable Operating Frequency:
2.1 MHz (Typ)
Reference Voltage Accuracy:±2 %(-40 °C to +125 °C)
Shutdown Circuit Current:
0 μA (Typ)
Operating Temperature Range:
-40 °C to +125 °C
Features











AEC-Q100 Qualified
Built-in N-Channel POWER MOSFETs
Soft Start Function
Current Mode Control
Over Current Protection
Thermal Shut Down Protection
Input Under Voltage Lock Out Protection
Input Over Voltage Protection
Output Over Voltage Protection
Short Circuit Protection
Compact and High Power Surface-Mounted
Package
Package(s)
W(Typ) x D(Typ) x H(Max)
4.00mm x 4.00mm x 1.00mm
VQFN24SV4040
Applications
 Automotive Battery Powered Supplies
 Industrial Equipment
 Consumer Supplies
Typical Application Circuit
BST
VIN
CBOOT
SW
PVIN
EN
CIN
RBOOT
Vo
L1
VOUT
R1
CO
FB
PGND
COMP
VREGH
R2
R3
RT
GND
CVREGH
RRT
C1
☆The contents are subject to change without notice because these are under development.
Please check the newest version when you use this datasheet.
〇Product structure : Silicon monolithic integrated circuit
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Datasheet
BD51180TL
EN
VIN
PVIN
PVIN
PVIN
PVIN
Pin Configuration
PGND
TEST(N.C.)
PGND
VOUT
FB
PGND
E-PAD
GND
PGND
TEST(N.C.)
VREGH
TEST(N.C.)
RT
BST
TEST(N.C.)
SW
COMP
SW
TEST(N.C.)
Pin Descriptions
Pin No.
Pin Name
1
EN
2
VIN
3 to 6
PVIN
7 to 10
PGND
Power GND input pin. Connect GND terminal of input capacitor(s).
11, 12, 16,
18, 24
TEST
No connection pins. Connect these pins to GND.
13, 14
SW
15
BST
17
VREGH
19
RT
20
COMP
21
GND
22
FB
23
VOUT
Output voltage terminal.
E-PAD
Exposed pad. Connect this pad to the internal PCB ground plane using multiple vias to
obtain excellent heat dissipation characteristics.
-
Function
Enable pin. Apply low-level (0.8 V or lower) to turn this device into shutdown mode.
Apply high-level (2.5 V or higher) to enable this device.
Power supply input pin for internal circuits.
Connect this pin to PVIN.
Power supply input pin for the switching regulator. Connect VIN terminal of input
capacitor(s). 10 µF and 0.1 µF ceramic capacitors are recommended.
Switching node pin. This pin is connected to internal Power MOSFETs. Connect an
power inductor to this pin.
Connect a 0.1uF MLCC bootstrap capacitor between this pin and SW pin.
This capacitor becomes the power supply of the high-side MOSFET gate driver.
Internal power supply output terminal.
A power supply is supplied to a circuit for the control.
Switching frequency setting pin. Connect a frequency setting resistor between this pin
and GND.
Output of the gm error amplifier, and the input of PWM comparator. Connect phase
compensation components to this pin. See page TBD on how to calculate the
resistance and capacitance for phase compensation.
Ground
Inverting input node for the gm error amplifier. Connect output voltage divider to this pin
for setting the output voltage.
☆The contents are subject to change without notice because these are under development.
Please check the newest version when you use this datasheet.
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Datasheet
BD51180TL
Block Diagram
VREGH
VOUT
VCC
PREREG
EN
EN
VREF
VREF
VREGH
VREGH
BST
VCC
UVLO
VCC
OVP_VCC
TSD
PVCC
SDWN
VREGH
VREGH
FB
0.8V
OVPOUT
OVP_FB
ERR
AMP
PWM
RESET PWM
LOGIC
SET
SOFT
START
VREF
0.96V
SLOPE
DRIVER
SDWN
OSC
SW
OCPOUT
OVPOUT
OCPOUT
GND
OCP
COMP
RT
PGND
☆The contents are subject to change without notice because these are under development.
Please check the newest version when you use this datasheet.
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Datasheet
BD51180TL
Description of Blocks
・ERROR AMP
The ERROR-AMP block is an error amplifier and its inputs are the reference voltage 0.8 V (Typ) and the “FB” pin voltage.
The output “COMP” pin controls the switching duty and output voltage Vo. Insert a capacitor and a resistor between this
pin and GND for the loop phase compensation.
・SOFT START
The SOFT START block prevents the overshoot of the output voltage VO by gradually increasing the input of the error
amplifier when the power supply turns ON to gradually increase the switching duty cycle. The soft start time is set to 1.1
ms (Typ). The soft start time can be changed by setting of the oscillating frequency.
・EN
The IC is in normal operation when the voltage at “EN” terminal is more than 2.5 V. The IC will shut down when the voltage
at “EN” terminal becomes less than 0.8 V.
・OSC (Oscillator)
This circuit generates a clock signal which determines converter switching frequency. The frequency of the clock can be
set by a resistor connected between the RT pin and GND, and the typical switching frequency is 2.1 MHz.
This clock is also used to set the ramp rate of the Soft Start block.
・SLOPE
This block generates saw tooth signal used for ramp compensation to prevent sub-harmonic oscillation. Inductor current
information is added to the saw tooth signal.
・PWM
This block modulates duty cycle by comparing the COMP pin voltage and the saw tooth signal from the SLOPE block.
・PWM LOGIC
The PWM LOGIC block controls the power MOSFET on and off timings. The clock signal from OSC block determines the
side MOSFET on timing, and the PWM block output determines the off timing in normal operation. In addition, each
protection output signal is passed to the PWM LOGIC and it controls proper protection functions.
・TSD (Thermal Shut Down)
This is a thermal shutdown circuit. The switching regulator operation is disabled to prevent thermal damage or a
thermo-runaway of the IC when the chip temperature reaches to approximately 175 oC s (Typ), and the operation comes
back when the chip temperature comes down. Note that the thermal shutdown circuit is intended to prevent catastrophic
failure of the IC itself. Therefore it is highly recommended to keep the IC temperature always within the operating
temperature range. Operation above operating temperature range will reduce lifetime.
・OCP (Over Current Protection)
While the low-side N-Channel POWER MOSFET is ON, if the voltage between the drain and source exceeds the
reference voltage which is internally set within the IC, the OCP will be activated. This protection is a self-return (foldback)
type. However, this protection circuit is only effective in preventing destruction from sudden accident. It does not support
the continuous operation of the protection circuit (e.g. when a load is connected, which significantly exceeds the output
current capability).
・OVP_FB (Over Voltage Protection)
Output over voltage protection circuit. When the output becomes than 120 % (Typ) of the target voltage, both of the output
MOSFETs are turned off and the regulator operation is stopped. When the output voltage comes down to 110 % (Typ) of
the target voltage, it returns to normal operation.
・UVLO (Under Voltage Lock-Out)
UVLO is a protection circuit that prevents low voltage malfunction, especially during power up. It monitors the VIN power
supply voltage. If VIN is less than the falling threshold voltage, 11 V (Max), the regulator is disabled. When the input voltage
becomes higher than the rising threshold, the regulator restarts the operation with soft-start.
・DRIVER
This circuit drives the gate of the N-Channel POWER MOSFETs.
・OVP_VCC
Input over voltage protection circuit. When input voltage becomes higher than 65 V (Min), the regulator is disabled. When
the input voltage becomes lower than the falling threshold, the regulator restarts the operation with soft-start. This
hysteresis is typically 5 V.
☆The contents are subject to change without notice because these are under development.
Please check the newest version when you use this datasheet.
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Datasheet
BD51180TL
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Rating
Unit
VIN
-0.3 to +80
V
EN Input Voltage
VEN/SYNC
-0.3 to VIN
V
SW Input Voltage
VSW
-1.0 to VIN
V
BST Input Voltage
VBST
-0.3 to VSW+7
V
Supply Voltage
VBST-SW
-0.3 to +7
V
FB Input Voltage
VFB
-0.3 to +7
V
REG Input Voltage
Voltage from SW to BST
VREG
-0.3 to +7
V
Storage Temperature Range
Tstg
-55 to +150
˚C
Maximum Junction Temperature
Tjmax
150
˚C
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Thermal Resistance (Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note 3)
2s2p(Note 4)
Unit
VQFN24SV4040
Junction to Ambient
θJA
150.6
37.9
°C/W
Junction to Top Characterization Parameter(Note 2)
ΨJT
20
9
°C/W
(Note 1)Based on JESD51-2A (Still-Air)
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4)Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
4 Layers
Thermal Via(NOTE 5)
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Copper Pattern
Footprints and Traces
Thickness
Copper Pattern
70μm
74.2mm2 (Square)
Pitch
1.20mm
Diameter
Φ0.30mm
Bottom
Thickness
Copper Pattern
Thickness
35μm
74.2mm2(Square)
70μm
(Note 5) This thermal via connects with the copper pattern of all layers.
☆The contents are subject to change without notice because these are under development.
Please check the newest version when you use this datasheet.
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Datasheet
BD51180TL
Recommended Operating Conditions (Ta= -40 °C to +125 °C)
Parameter
Symbol
Min
Typ
Max
Unit
VIN
12
-
65
V
Operating Temperature Range
Topr
-40
-
125
˚C
Output Voltage
VOUT
0.8
-
5
V
TONMIN
-
20
-
ns
IOUT
0
-
1
A
Operating Power Supply Voltage
SW minimum ON time
Output Current
(Note 1)
(Note 1) Overcurrent protection SW current should not be exceeded.
Electrical Characteristics (Unless otherwise specified Ta = -40 ˚C to +125 ˚C, VIN = 48 V, VEN/SYNC = 5 V)
Parameter
Symbol
Min
Shutdown Circuit Current
ISDN
-
0
5
µA
VEN/SYNC = 0 V, Ta = 25 ˚C
Circuit Current
ICC
-
3.5
TBD
mA
VFB = 2.0 V
Reference Voltage
VFB
0.784
0.800
0.816
V
VFB = VCOMP
IFB
-
0
1
µA
VFB = 2.0 V
ICPSINK
-
50
-
µA
VCOMP = 1.2 V, VFB = 2 V
ICPSOURCE
-
-50
-
µA
VCOMP = 1.2 V, VFB = 0 V
TSS
-
1.1
-
ms
fSW = 2.1 MHz
POWER MOS Over ON Resistance
RONH
-
450
900
mΩ
IO = 50 mA
POWER MOS Under ON Resistance
RONH
-
300
600
mΩ
IOLEAKH
-
0
5
µA
IO = 50 mA
VIN = 80 V, VEN/SYNC = 0 V
Ta = 25 ˚C, VSW = 0 V
ISW
TBD
TBD
TBD
A
FB pin Input Current
COMP pin Sink Current
COMP pin Source Current
Soft Start Time
Output Leak Current
Operating Output Switch Current
Of Overcurrent Protection
Oscillating Frequency
Typ
Max
Unit
fSW
1.9
2.1
2.3
MHz
EN Threshold Voltage H
VENH
2.5
-
VIN
V
EN Threshold Voltage L
VENL
0
-
0.8
V
IEN
-
25
50
µA
VUV_ON
-
-
11.0
V
VUV_OFF
-
-
12.0
V
VOV_ON
65
-
-
V
VOV_OFF
60
-
-
V
EN pin Input Current
VIN Under Voltage Protection
Detection Voltage
VIN Under Voltage Protection
Return Voltage
VIN Over Voltage Protection
Detection Voltage
VIN Over Voltage Protection
Return Voltage
Conditions
VEN/SYNC = 3 V
☆The contents are subject to change without notice because these are under development.
Please check the newest version when you use this datasheet.
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Datasheet
BD51180TL
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a
voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may
result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the
board size and copper area to prevent exceeding the maximum junction temperature rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
☆The contents are subject to change without notice because these are under development.
Please check the newest version when you use this datasheet.
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Datasheet
BD51180TL
12.
Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 1. Example of monolithic IC structure
13.
Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14.
Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
15.
Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls
below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
16.
Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
17.
Disturbance light
In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due
to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip
from being exposed to light.
☆The contents are subject to change without notice because these are under development.
Please check the newest version when you use this datasheet.
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Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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