30 01 B74 S3NC C6T1U1DH AM

3mm Advanced Super Flux LEDs
30-01-B74-S3NC-C6T1U1DH-AM
Lead (Pb) Free Product - RoHS Compliant
Feature
‧
‧
‧
‧
‧
‧
‧
‧
Piranha package.
Colorless clear resin.
Low thermal resistance
Packaged in tubes for automatic insertion equipment.
Total flux: 7150 to 14250 mlm at 70mA.
Qualification according to AEC-Q101.
Compliance with EU REACH.
Compliance Halogen Free .(Br <900 ppm ,Cl <900 ppm , Br+Cl < 1500 ppm).
Applications
‧ Automotive Lighting
‧ Electronic signs and signals
‧ General lighting application
Device Selection Guide
Chip
LED Part No.
30-01-B74-S3NC-C6T1U1DH-AM
Revision
1
:4
Resin Color
Material
Emitted Color
AlGaInP
Sunset Orange
Release Date:2014-06-30 16:46:07.0
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DATASHEET
P-LED
30-01-B74-S3NC-C6T1U1DH-AM
Table of Content
Page
Product Nomenclature
3
Absolute Maximum Ratings (Ta=25℃)
4
Electro-Optical Characteristics (Ta=25℃)
5
Bin Range of Forward Voltage (Ta=25℃)
6
Bin Range of Dominant Wavelength (Ta=25℃)
7
Bin Range of Total Flux (Ta=25℃)
8
Typical Electro-Optical Characteristics Curves
9
Package Dimensions
11
Label Explanation
12
Antistatic Packing Materials Tube and Standard Boxes
12
Precautions
13
Revision History
16
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:4
2
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DATASHEET
P-LED
30-01-B74-S3NC-C6T1U1DH-AM
Product Nomenclature
30
-
01
1
-
2
B7
4
3
4
-
S3N
C
5
6
-
C6
T1U1
D
H
AM
7
8
9
10
11
The product name is designated as below:
1.
Product type
2.
Lead-frame type
3.
Angle
4.
Product pasted without Zener
5.
Chip code
6.
Resin color
7.
Wavelength
8.
Power &Luminous Intensity
9.
Range of Forward Voltage specification
10.
Operation current
11
Application
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:4
3
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DATASHEET
P-LED
30-01-B74-S3NC-C6T1U1DH-AM
Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Rating
Unit
Reverse Voltage
VR
12
V
Continuous Forward Current
IF
70
mA
Power Dissipation
Pd
210
mW
LED Junction Temperature
Tj
120
℃
Operating Temperature
Topr
-40 ~ +100
℃
Storage Temperature
Tstg
-40 ~ +110
℃
Thermal Resistance
Rth J-A
150
K/W
Thermal Resistance
Rth J-P
70
K/W
ESD
ESDHBM
2000
(Classification acc. AEC Q101)
ESDMM
200
Soldering Temperature(T=5 sec)
Tsol
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V
Wave Soldering : 260 ℃ for 5 sec.
Hand Soldering : 350 ℃ for 3 sec.
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DATASHEET
P-LED
30-01-B74-S3NC-C6T1U1DH-AM
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Total Flux
Φv
7150
-----
14250
mlm
IF =70mA
Peak Wavelength
λp
-----
624
-----
nm
IF =70mA
Dominant Wavelength
λd
611
-----
620
nm
IF =70mA
Δλ
-----
18
-----
nm
IF =70mA
Viewing Angle
2θ1/2
-----
80
-----
deg
IF =70mA
Forward Voltage
VF
1.9
-----
2.9
V
IF =70mA
Reverse Current
IR
-----
-----
10
μA
VR =5V
Spectrum Radiation
Bandwidth
Note:
1. Tolerance of Total Flux: ±11%
2. Tolerance of Dominant Wavelength: ±1nm
3. Tolerance of Forward Voltage: ±0.1V
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DATASHEET
P-LED
30-01-B74-S3NC-C6T1U1DH-AM
Bin Range of Forward Voltage (Ta=25℃)
Bin
Min.
Max.
1
1.9
2.1
2
2.1
2.3
3
2.3
2.5
4
2.5
2.7
5
2.7
2.9
Unit
Condition
V
IF =70mA
Note:
Tolerance of Forward Voltage: ±0.1V
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DATASHEET
P-LED
30-01-B74-S3NC-C6T1U1DH-AM
Bin Range of Dominant Wavelength (Ta=25℃)
Bin
Min.
Max.
2
611
614
3
614
617
4
617
620
Unit
Condition
nm
IF =70 mA
Note:
Tolerance of Dominant Wavelength: ±1nm
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DATASHEET
P-LED
30-01-B74-S3NC-C6T1U1DH-AM
Bin Range of Total Flux (Ta=25℃)
Bin
Min.
Max.
T1
7150
9000
T2
9000
11250
U1
11250
14250
Unit
Condition
mlm
IF =70mA
Note:
Tolerance of Total Flux: ±11%
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DATASHEET
P-LED
30-01-B74-S3NC-C6T1U1DH-AM
Typical Electro-Optical Characteristics Curves
Typical Curve of Spectral Distribution
Relative Intensity(%)
100
50
0
500
550
600
650
700
750
Wavelength(nm)
Diagram Characteristics of Radiation
0
Relative Intensity (a.u.)
Relative Intensity
1.0
0
10
0
20
0
30
0
40
0.8
0
50
0.6
0
60
0.4
70
0.2
0.0
0
0
-90 -70
0
0
80
-50
0
-30
0
0
90
-10
0
0
View Angle
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DATASHEET
P-LED
30-01-B74-S3NC-C6T1U1DH-AM
Forward Current vs. Forward Voltage
(Ta=25℃)
Dominant Wavelength vs. Forward Current
(Ta=25℃)
100
621
90
Dominant Wavelength (nm)
Forward Current (mA)
80
70
60
50
40
30
20
10
0
1.7
1.9
2.1
2.3
2.5
620
619
618
617
0
2.7
10
20
30
40
50
60
70
FORWARD CURRENT
Forward Voltage (V)
Forward Current (mA)
Max. Permissible Forward Current vs.
Ambient Temperature
Relative Luminous Intensity vs.
Forward Current (Ta=25℃)
100.0
1.5
80.0
1.2
Forward Current (mA)
Relative Luminous Intensity(a.u.)
90.0
0.9
0.6
0.3
70.0
60.0
50.0
40.0
30.0
20.0
10.0
0.0
0.0
0
10
20 30 40
50 60
70 80 90 100
Forward Current (mA)
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0.0
20.0
40.0
60.0
80.0
100.0
Ambient Temperature (℃)
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DATASHEET
P-LED
30-01-B74-S3NC-C6T1U1DH-AM
Package Dimension
Notes: 1. An epoxy meniscus may extend about 1.5mm(0.059") down the leads
2. Tolerances unless dimensions ±0.25mm
3. All dimensions are in millimeters
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DATASHEET
P-LED
30-01-B74-S3NC-C6T1U1DH-AM
Antistatic Packing Materials
Tube
PART NO:
CAT:
LOT NO:
QTY:
Tube Label Explanation
‧ QTY: Packing Quantity
‧ LOT No: Lot Number
‧ CAT: Rank of (VF)(Note*)(ΦV)
Note: λd/CIE/Color temperature
Note: Tolerances unless mentioned ±2.0mm. Unit = mm
Standard Box
Outer Label Explanation
‧ CPN: Customer’s Product Number
‧ P/N: Product Number
‧ QTY: Packing Quantity
‧ CAT: Rank of (VF)(Note*)(ΦV)
‧ Note: λd/CIE/Color temperature
‧ HUE/REF: Reference
‧ LOT No: Lot Number
Note: Tolerances unless mentioned ±3.0mm. Unit = mm
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DATASHEET
P-LED
30-01-B74-S3NC-C6T1U1DH-AM
Packing Quantity
Packing material
Length × Width × height (mm)
Tube Quantity (Pcs) LED Quantity (Pcs)
Tube
640 x 9.5 x12
1
80
Standard box
682 x 128 x 45
36
2880
Large box
702 x 420 x 164
324
25920
Note:
1. Normal packing specification is use standard box, unless already defined initially.
2. Vacuum packing with anti-static bag after packing in standard box.
3. Specifications are subject to change without prior notice.
Notes
1. Lead Forming
 During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy
bulb.
 Lead forming should be done before soldering.
 Avoid stressing the LED package during leads forming. The stress to the base may damage the
LED’s characteristics or it may break the LEDs.

Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may
cause failure of the LEDs.

When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead
position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the
epoxy resin and this will degrade the LEDs.
2. Storage
 The LEDs should be stored at 30°C or less and 60%RH or less after being shipped from Everlight
and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be
stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.
 Please avoid rapid transitions in ambient temperature, especially, in high humidity environments
where condensation can occur.
3. Soldering
 Careful attention should be paid during soldering. Solder the LED no lower than 1.6mm from the
base of stopper is recommended.
 Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly
when soldering.
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DATASHEET
P-LED
30-01-B74-S3NC-C6T1U1DH-AM
Hand Soldering
DIP Soldering
Temp. at tip of iron
300℃ Max. (30W Max.)
Preheat temp.
100℃ Max. (60 sec Max.)
Soldering time
3 sec Max.
Bath temp.
260 Max.
Distance
No lower than 1.6mm from
Bath time.
5 sec Max.
Distance
No lower than 1.6mm from the
the base of stopper
base of stopper



Recommended soldering conditions:
Dip and hand soldering should not be done more than one time.
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration
until the LEDs return to room temperature.
 A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
 Although the recommended soldering conditions are specified in the above table, dip or
handsoldering at the lowest possible temperature is desirable for the LEDs.
 Wave soldering parameter must be set and maintain according to recommended temperature and
dwell time in the solder wave.
4. Cleaning
 When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a
duration of no more than one minute. Dry at room temperature before use.
 Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of
ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled
condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the
LED
5. Heat Management
 Heat management of LEDs must be taken into consideration during the design stage of LED
application. The current should be de-rated appropriately by referring to the de-rating curve found
in each product specification.

The temperature surrounding the LED in the application should be controlled. Please refer
to the data sheet de-rating curve.
6. ESD (Electrostatic Discharge)
 Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.
 An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling LEDs.
 All devices, equipment and machinery must be properly grounded.
 Use ion blower to neutralize the static charge which might have built up on surface of the LEDs
plastic lens as a result of friction between LEDs during storage and handing.
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DATASHEET
P-LED
30-01-B74-S3NC-C6T1U1DH-AM
7. Other
 Above specification may be changed without notice. EVERLIGHT will reserve authority on
material change for above specification.
 When using this product, please observe the absolute maximum ratings and the instructions for
using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any
damage resulting from use of the product which does not comply with the absolute maximum
ratings and the instructions included in these specification sheets.
 These specification sheets include materials protected under copyright of EVERLIGHT
corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s
consent.
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DATASHEET
P-LED
30-01-B74-S3NC-C6T1U1DH-AM
Revision History
Rev.
Modified date
3
2013/5/24
4
Revision
:4
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File modified contents
Change the form of datasheet
Change the packing specification
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