19 213 G6SC M0P1Q1B0E 3T AM

SMD  B
19-213-G6SC-M0P1Q1B0E-3T-AM
Features
•RoHS compliant
•Chip LED package.
•Colorless clear resin.
•Wide viewing angle 120°
•Brightness:45.0 to 90.0mcd at 20mA.
•Qualification according to AEC-Q101.
•Precondition: Bases on JEDEC J-STD 020 Level 3.
•Automotive reflow profile (IR reflow or wave soldering)
•Compliance with EU REACH
•Compliance Halogen Free .(Br <900 ppm ,Cl <900 ppm , Br+Cl < 1500 ppm).
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Date: Rev.2
2010, Everlight All Rights Reserved. Release Date :September.9.2014 Issue
No:DSE-0006941
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Expired Period: Forever
DATASHEET
SMD  B
19-213-G6SC-M0P1Q1B0E-3T-AM
Applications
•Automotive backlighting or indicator: Dashboard, switch, audio and video equipments… etc.
•Backlight: LCD, switches, symbol, mobile phone and illuminated advertising.
•Display for indoor and outdoor application.
•Ideal for coupling into light guides.
•Substitution of traditional light.
•Optical indicator.
•General applications.
Device Selection Guide
Chip
Emitted Color
Resin Color
Brilliant Yellow Green
Water Clear
Materials
AlGaInP
Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Rating
Unit
Reverse Voltage
VR
12
V
Forward Current
IF
50
mA
IFP
80
mA
Power Dissipation
Pd
100
mW
Junction Temperature
Tj
125
℃
Operating Temperature
Topr
-40 ~ +100
℃
Storage Temperature
Tstg
-40 ~ +110
℃
Rth J-A
800
K/W
Rth J-S
450
K/W
ESD
ESDHBM
2000
V
(Classification acc. AEC Q101)
ESDMM
200
V
Soldering Temperature
Tsol
Peak Forward Current
(Duty 1/10 @1KHz)
Thermal Resistance
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Reflow Soldering : 260 ℃ for 30 sec.
Hand Soldering : 350 ℃ for 3 sec.
Release
Date: Rev.2
2010, Everlight All Rights Reserved. Release Date :September.9.2014 Issue
No:DSE-0006941
LifecyclePhase:
LifecyclePhase:Preliminary
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Expired Period: Forever
DATASHEET
SMD  B
19-213-G6SC-M0P1Q1B0E-3T-AM
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Luminous Intensity
Iv
45.0
-----
90.0
mcd
Viewing Angle
2θ1/2
-----
120
-----
deg
Peak Wavelength
λp
-----
575
-----
nm
Dominant Wavelength
λd
569.5
----
575.5
nm
Spectrum Radiation Bandwidth
Δλ
-----
30
-----
nm
Forward Voltage
VF
1.75
----
2.35
V
Reverse Current
IR
-----
-----
10
μA
Temperature coefficient of λp
TCλp
-----
0.13
-----
nm/K
Temperature coefficient of λd
TCλd
-----
0.08
-----
nm/K
Temperature coefficient of VF
TCV
-----
-4.3
-----
mV/K
Condition
IF=20mA
VR=12V
IF=20mA
Note:
1. Tolerance of Luminous Intensity: ±11%
2. Tolerance of Dominant Wavelength: ±1nm
3. Tolerance of Forward Voltage: ±0.1V
Bin Range of Luminous Intensity
Bin Code
Min.
Max.
P1
45.0
56.0
P2
56.0
71.0
Q1
71.0
90.0
Unit
Condition
mcd
IF =20mA
Note:
Tolerance of Luminous Intensity: ±11%
Bin Range of Dominant Wavelength
Bin Code
Min.
Max.
Unit
Condition
C16
569.5
571.5
nm
IF =20mA
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2010, Everlight All Rights Reserved. Release Date :September.9.2014 Issue
No:DSE-0006941
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DATASHEET
SMD  B
19-213-G6SC-M0P1Q1B0E-3T-AM
C17
571.5
573.5
C18
573.5
575.5
Note:
Tolerance of Dominant Wavelength: ±1nm
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DATASHEET
SMD  B
19-213-G6SC-M0P1Q1B0E-3T-AM
Typical Electro-Optical Characteristics Curves
Relative Intensity (%)
Typical Curve of Spectral Distribution
λp (nm)
Note: V(λ)=Standard eye response curve; IF =20mA
Relative Intensity (%)
Diagram Characteristics of Radiation
Relative Intensity
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2010, Everlight All Rights Reserved. Release Date :September.9.2014 Issue
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DATASHEET
SMD  B
19-213-G6SC-M0P1Q1B0E-3T-AM
Dominant Wavelength vs. Forward Current
(Ta=25℃)
Forward Current (mA)
Dominant Wavelength (nm)
Forward Current vs. Forward Voltage
(Ta=25℃)
Forward Voltage (V)
Forward Current (mA)
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Max. Permissible Forward Current
(Ta=25℃)
Forward Current (mA)
Relative Luminous Intensity
Relative Luminous Intensity vs. Forward
Current (Ta=25℃)
Forward Current (mA)
Temperature (℃)
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2010, Everlight All Rights Reserved. Release Date :September.9.2014 Issue
No:DSE-0006941
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DATASHEET
SMD  B
19-213-G6SC-M0P1Q1B0E-3T-AM
Junction Temperature (℃)
Note: f(Tj) = Iv / Iv(25℃); IF =20mA
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Relative Forward Voltage vs.
Junction Temperature
Relative Forward Voltage
Relative Luminous Intensity
Relative Luminous Intensity vs.
Junction Temperature
Junction Temperature (℃)
Note: △VF = VF -VF(25 ℃) = f(Tj); IF =20mA
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2010, Everlight All Rights Reserved. Release Date :September.9.2014 Issue
No:DSE-0006941
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LifecyclePhase:Preliminary
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DATASHEET
SMD  B
19-213-G6SC-M0P1Q1B0E-3T-AM
Package Dimension
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DATASHEET
SMD  B
19-213-G6SC-M0P1Q1B0E-3T-AM
Cathode Mark
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
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DATASHEET
SMD  B
19-213-G6SC-M0P1Q1B0E-3T-AM
Moisture Resistant Packing Materials
Label Explanation
Label Explanation
․CPN: Customer’s Product Number
․P/N: Product Number
․QTY: Packing Quantity
․CAT: Luminous Intensity Rank
․HUE: Dom. Wavelength Rank
․REF: Forward Voltage Rank
․LOT No: Lot Number
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
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2010, Everlight All Rights Reserved. Release Date :September.9.2014 Issue
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DATASHEET
SMD  B
19-213-G6SC-M0P1Q1B0E-3T-AM
Carrier Tape Dimensions: Loaded Quantity 3000 pcs Per Reel
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
Moisture Resistant Packing Process
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
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2010, Everlight All Rights Reserved. Release Date :September.9.2014 Issue
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DATASHEET
SMD  B
19-213-G6SC-M0P1Q1B0E-3T-AM
Precautions for Use
1. Soldering
Condition (Reference: IPC/JEDEC J-STD-020D)
a. IR reflow
300
Temperature(℃ )
max. 260℃
245℃
255℃
240℃
217℃
250
200
max. 30s
150
max. 100s
max. 120s
100
max. Ramp Up 3 ℃ /s
50
max. Ramp Down 6 ℃ /s
0
0
50
100
150
200
250
300
Times(s)
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DATASHEET
SMD  B
19-213-G6SC-M0P1Q1B0E-3T-AM
(B) Recommend soldering pad
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
2. Current limiting
A resistor should be used to limit current spikes that can be caused by voltage fluctuations. Otherwise
damage could occur.
3. Storage
3.1 Moisture proof bag should only be opened immediately prior to usage.
3.2 Environment should be less than 30℃ and 60% RH when moisture proof bag is opened.
3.3 After opening the package MSL Conditions stated on page 1 of this spec should not be exceeded.
3.4 If the moisture sensitivity card indicates higher than acceptable moisture, the component should be baked
at min. 60deg +/-5deg for 24 hours.
4. Iron Soldering
Hand soldering is not recommended for regular production. These guidelines are for rework only. Soldering
iron tip should contact each terminal no more than 3 sec at 350℃, using soldering iron with nominal power
less than 25W. Allow min. 2 sec. between soldering intervals.
5. Usage
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2010, Everlight All Rights Reserved. Release Date :September.9.2014 Issue
No:DSE-0006941
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LifecyclePhase:Preliminary
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DATASHEET
SMD  B
19-213-G6SC-M0P1Q1B0E-3T-AM
Do not exceed the values given in this specification.
Application Restrictions
1. High reliability applications such as military/aerospace, automotive safety/security systems, and medical
equipment may require different product. If you have any concerns, please contact Everlight before using
this product in your application. This specification guarantees the quality and performance of the product as
an individual component. Do not use this product beyond the specification described in this document.
Revision History:
Rev.
Modified date
File modified contents
1
2012/3/20
New Spec
2
2014/9/9
Release
14 Copyright
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: (2)©
Release
Date: Rev.2
2010, Everlight All Rights Reserved. Release Date :September.9.2014 Issue
No:DSE-0006941
LifecyclePhase:
LifecyclePhase:Preliminary
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Expired Period: Forever
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