Data Sheet LAMINATE Stacked CSP Applications Stacked CSP (SCSP) The Stacked CSP (SCSP) family leverages Amkor's industry-leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities. This broad, high-volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost requirements. Stacked CSP technology enables the stacking of a wide range of different semiconductor devices to deliver the high level of silicon integration and area efficiency required in portable multi-media products. Stacked CSP utilizes high density thin core substrates, advanced materials (ie: thin film die attach adhesive, fine filler epoxy mold compound), along with leading-edge wafer thinning, die attach, wire bonding and molding capabilities to stack multiple devices in a conventional fine pitch BGA (FBGA) surface mount component. These advanced assembly capabilities in combination with Amkor's expertise in design and test, enable stacks up to 16 active devices while optimizing yield and mounted height requirements. Many customers have relied on Amkor to solve their highest density and most complex device stack combinations. As a result, Amkor has established industry leadership in stacking pure memory, mixed signal, and logic + memory devices, including NAND, NOR and DRAM memory, digital base band or applications processors + high density flash or mobile DRAM devices. Designers are looking to Stacked CSP technologies to achieve a high level of integration, along with size and cost reductions in future chip set combinations. Portable multi-media devices including cell phones, digital cameras, PDAs, audio players and mobile gaming employ SCSP solutions to address a range of design requirements, including: • Higher memory capacity and more efficient memory architectures • Smaller, lighter and more innovative product form factors • Lower cost and more space efficient Features • • • • • • • • • • • • • • • 2-21 mm body size Package height down to 0.6 mm High die count pure memory, eMMC, eMCP and MCP Design, assembly and test capabilities that enable stacking of DRAM with Logic or Flash memory devices Logic/Flash, digital/analog and other ASIC/memory combinations of 320 I/O and greater Established package infrastructure with standard CABGA footprints Consistent product performance, high yields and reliability JEDEC standard outlines including MO-192 and MO-219 Thin DA film and spacer technology, FoW and FoD Extended die overhang wire bonding Low loop wire bonding less than 45 µm Vacuum transfer and compression molding Wafer thinning/handling to 30 µm Pb free, RoHS compliant and green materials Passive component integration options Reliability Qualification Amkor assures reliable performance by continuously monitoring key indices, including: Package Level: • Moisture Sensitivity JEDEC Level 3 @ 260°C; Characterization • Additional Test Data at [(30°C/85% RH, 96 hours)+260] x2 or 3 • HAST 130°C/85% RH, 96 hours • Temp/Humidity85°C/85% RH, 1000 hours • Temp Cycle -55°C/+125°C, 1000 cycles • High Temp Storage 150°C, 1000 hours Board Level: • Thermal Cycle Visit Amkor Technology online for locations and to view the most current product information. -40°C/+125°C, 1000 cycles DS573K Rev Date: 11/15 Questions? Contact us: [email protected] Data Sheet LAMINATE Stacked CSP Process Highlights • Die qty, stack Up to 16 high die configurations • Ball pad pitch 0.3, 0.4, 0.5, 0.65, 0.75, 0.8 mm • Die thickness (min) Down to 30 µm • Laminate core thickness 40, 50, 60, 100 or 150 µm • Ball diameter 0.25, 0.30, 0.40, 0.46 mm • Die bond pitch (min) 40 µm (In-line) with roadmap to 25 µm • Wirebond length (max) 5 mm (200 mils) • Wirebond dia (min) 15, 18, 20, 25, 30 µm • Low loop wirebonding 45 µm • Wafer thinning 200 & 300 mm wafers Standard Materials • Package substrate – Dielectric Laminate (e.g., DS7409, E679, BT) Polyimide (e.g., Kapton®) – Layer count (laminate) 2-6 • Die attach Film DA compatible with all passivation types • Wire typeAg, Gold, Cu, PCC High tensile strength • Encapsulant Thixotropic epoxy (black) • Solder balls 63Sn/37Pb & PbFree Sn/3-4Ag/0.5Cu • Device type Silicon, SiGe, etc. • MarkingLaser Stacked CSP Key Technologies Stacked CSP Cross Section 2 Die on 2-Layer Laminate Structure Top and Bottom Die Solderball Die Attach Film/Paste Dielectric Stacked CSP Cross Section 2 + 1 Die on 4-Layer Laminate Structure Die Attach Film/Paste Solderball Bottom and Side Die Dielectric Same Size (SS) Die Stacked CSP Cross Section 2 Die on 2-Layer Laminate Structure Stacked CSP Cross Section 3 + 1 Logic + Memory Low Loop Wire Bonding Film on Wire Wafer Thinning Stacked CSP Cross Section 16 + 0 Die Memory Visit Amkor Technology online for locations and to view the most current product information. With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2015, Amkor Technology Incorporated. All Rights Reserved. DS573K Rev Date: 11/15 Questions? Contact us: [email protected]