2016 Product Line Card

Connecting People and Technology
June
2016
Product Line Card
www.amkor.com
Table of Contents
03
05
12
Overview
23
Power
24
03..... Amkor Overview
04..... Locations
Laminate
05..... PBGA
06..... CABGA
07..... Stacked CSP
08..... fcCSP
09..... fcCSP (CuBOL)
09..... fcTMV®
09..... FPFCMEP
11...... Ceramic CSP
12..... PowerSOP® (PSOP3)
12..... TSOP
13..... TSSOP/MSOP
13..... SSOP/QSOP
14..... SOIC
14..... PDIP
15..... ePad TSSOP/MSOP/
SOIC/SSOP
15..... SOT-23/TSOT
16..... TQFP/LQFP
17..... E-Pad TQFP/LQFP
17..... MQFP PowerQuad®
18..... MQFP
19..... PLCC
19..... FusionQuad®
19..... MLF®
23..... PSMC
23..... SOD123-FL
23..... SOD128-FL
23..... SOD323-FL
23..... TO-220
23..... TO-220F
23..... TO-220FP
23..... TO-220SMD
23..... TO-251
23..... TO-252JEDEC
23..... TO-252JEITA
23..... TO-263
23..... SO8-FL
23..... TO-263 (7-pin)
23..... HSON8
23..... HVSON (8-pin mini)
23..... HVSON (8-pin)
23..... SO8-FL
23..... TSON8-FL
Leadframe
Test
24..... Major Testers Platform
24..... Wafer Prober
25..... Conventional Handler
25..... Strip Test/Film Frame Handler
26..... Wafer Test Roadmap
26..... Package Test Roadmap – PnP
27..... About Us
Founded in 1968, Amkor’s
path of continuous
improvement, growth and
innovation has led us to
be a strategic and trusted manufacturing partner
for the world’s leading semiconductor companies
and OEMs. Our unique expertise in high-volume
manufacturing techniques and the ability to solve
the technological challenges facing the industry are
among our greatest strengths.
Our customers benefit from our extensive global
footprint in Asia, Europe and the US, enabling us to
easily handle large orders and offer quick turnaround
times.
Semiconductor IC Package Design Services
Customer demand for highly sophisticated products
has made semiconductor packaging a vital
contributor to system performance. As one of the
world’s largest suppliers of outsourced semiconductor
advanced packaging design, assembly and test
services, Amkor helps make these innovations a
reality.
Amkor works closely
with substrate and
software suppliers to
drive next generation
package design. Our
design engineers are
trained experts and are
experienced in all of the latest design tools and
packaging technology. This allows our World Class
Design Centers to reduce design cycle times and
provide expert advice.
Our Product Portfolio
Packaging
Amkor offers more than
3,000 different package
formats and sizes. These
products range from
traditional leadframe
ICs for through-hole and
surface mounting, all the
way to the latest chip
scale packages (CSP) and ball grid array (BGA)
solutions required in high pin count and high density
applications.
Consumers are demanding greater functionality
and performance in a smaller space at a lower cost.
Amkor is an industry leader in finding semiconductor
packaging solutions to meet these complex
requirements.
Our diverse portfolio includes stacked die, wafer
level, MEMS, flip chip, Through Silicon Via (TSV)
and 2.5D/3D packaging allowing us to be a single
source for many of our customers. We fulfill total
semiconductor packaging requirements from
legacy devices to tomorrow’s System-in-Package
(SiP) solutions. The availability of high quality
packaging services allows our customers to focus
their resources on semiconductor design and wafer
fabrication while utilizing Amkor as their packaging
technology innovator and test partner.
Final Test Services
Speeding Time to Market
Amkor’s operations
encompass more than
8M ft2 of floor space with
production facilities, product
development centers and
sales and support offices
strategically located in key
electronics manufacturing
regions.
Assembly
With high-volume manufacturing in five Asian
countries, Amkor is poised to assemble a broad
portfolio of packaging solutions including wirebond
and flip chip using Pb-free and green packaging.
Amkor provides a complete range of semiconductor
test services including various types of final testing,
system level testing, wafer testing, strip testing and
complete end-of-line services up to and including
final shipping.
Logistics and Inventory Management
We provide customers around the world with the
electronic components they need to grow their
businesses. Amkor offers tape & reel, dry pack and
warehousing services with the ability to drop ship
products worldwide.
Preparing for the Future
As the industry moves aggressively to more new
and advanced technologies such as 3D stacking of
integrated circuits, the complexity of chip-package
interaction is increasing significant. Companies look
to Amkor to deliver end-to-end solutions that meet the
requirements of a broad range of product designs.
Amkor Worldwide Presence
Strategically Located Factories and Customer Support Centers
Factory Code Legend
Amkor has twenty-two assembly and test manufacturing facilities worldwide.
The product tables indicate which facility manufactures different packages.
China
C3............... Shanghai
Korea
K1............... Seoul
K4............... Gwangju
Japan
JFI............... Fukui
JFO............. Fukuoka
JHD............. Hakodate
JKM............ Kumamoto
JMG............ Miyagi
JUK............. Usuki
Malaysia
ATM............ Kuala Lumpur
Philippines
P1............... Muntinlupa City
P3............... Binan Laguna
Amkor Product Line Card • June 2016
4
Laminate Packages
The higher functional capabilities of Amkor’s laminate package technology benefits high power and high speed ICs that require enhanced electrical and thermal performance.
Laminate packages employ a ball grid array design, which utilizes a plastic or tape laminate substrate rather than a leadframe substrate, and places the electrical connections on
the bottom of the package rather than around the perimeter. A substrate is a laminate of multiple layers of epoxy resin, woven glass fibers and metal conductors. Bumps provide
the electrical connection to the system board. The bumps are typically distributed evenly across the bottom surface of the substrate (called a “ball grid array” format). This allows
greater distance between individual leads and a higher number of interconnects than leadframe packages.
Laminate packages are the ideal solution for high-performance applications such as microprocessors/controllers, gate arrays, memory, chipsets, analog, Flash, SRAM, DRAM,
ASICs, DSPs, RF devices and PLDs.
PBGA Packages – Package Dimensions (mm)
Body Size
17 x 17
19 x 19
21 x 21
0.8 mm
–
529
–
23 x 23
–
Lead Count and Pitch
1.0 mm
256
324
400
1.27 mm
–
–
324, 345, 352, 376,
441, 484
289
Factory
Package Outline
Drawing #
Data Sheet #
JKT
K4, P3
K4, P3
–
–
–
DS520
DS520
DS520
K4, P3, JKT
–
DS520
25 x 25
–
576
–
K4, P3
–
DS520
27 x 27
796
416, 420, 449, 456, 484, 507,
516, 537, 676
256, 316,360, 400
K4, P3, JKT
–
DS520
29 x 29
–
780
–
K4, P3
–
DS520
31 x 31
–
425, 561, 564, 576, 577, 613, 620,
626, 640, 641, 706, 753, 780, 900
304, 385, 421, 576
K4, P3, JKT
–
DS520
35 x 35
–
597,681, 729, 769, 814, 868,
1012, 1156
456, 484, 729
K4, P3, JKT
–
DS520
37.5 x 37.5
40 x 40
–
–
1296
1521
841
957
K4, P3
K4, P3
–
–
DS520
DS520
PBGA
PBGA
Sample
Legend: Blue = Future Packages – Max full array ball count shown – contact Amkor for custom BGA pattern availability.
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • June 2016
5
CABGA Packages – Package Dimensions (mm)
Lead Count and Pitch
0.65 mm
–
20
–
–
0.8 mm
–
–
–
24
1 mm
–
–
–
–
1.27 mm
–
–
–
–
Factory
Package Outline
Drawing #
Data Sheet #
P3
K4, P3
C3, K4, P3
C3, K4, P3
–
–
–
–
DS550
DS550
DS550
DS550
49
25
–
–
C3, K4, P3
–
DS550
49, 58
36
–
–
C3, K4, P3
–
DS550
64
–
–
–
C3, K4, P3
–
DS550
64, 104, 107, 116
64, 80
48, 49, 64
–
–
C3, K4, P3
–
DS550
209, 211, 256
121, 132, 137, 143, 144,
154, 160, 160
81, 84, 137
–
–
–
C3, K4, P3
–
DS550
121, 252
56, 80, 100, 108, 112, 113, 120
105
52, 64, 80, 81
–
–
C3, K4, P3
–
DS550
8x8
308
124, 128, 132, 133, 144,
160, 161, 164, 176, 180
140
–
–
–
C3, K4, P3
–
DS550
8x8
9x9
–
383
195, 196, 208, 219, 225
128, 156, 188, 220, 225, 265
–
144
–
81, 100
–
–
–
–
C3, K4, P3
C3, K4, P3
–
–
DS550
DS550
10 x 10
360, 384
173, 179, 180
164
96, 100, 104,
120, 121, 128, 144
81
–
C3, K4, P3
–
DS550
10 x 10
387, 409
181, 192, 200, 216, 221,
224, 225, 233, 235, 240
183
–
–
–
C3, K4, P3
–
DS550
10 x 10
424, 454
244, 257, 267, 268, 273, 284,
285, 289, 292, 296, 297, 328
196
–
–
–
C3, K4, P3
–
DS550
10 x 10
11 x 11
11 x 11
456
432, 440, 452
476, 576
336, 345, 346
204, 223
256, 280, 305, 337, 361, 416
–
165, 192, 196
200, 208
–
128, 132, 144, 169
–
–
100
–
–
–
–
C3, K4, P3
C3, K4, P3
C3, K4, P3
–
–
–
DS550
DS550
DS550
12 x 12
216, 487, 547
236, 244, 260, 272,
291, 308, 337, 343
177
144, 160, 168, 179
121
–
C3, K4, P3
–
DS550
12 x 12
12 x 12
13 x 13
560, 569, 617
697, 714, 745
–
388, 424
–
276
208
213
240, 248, 273
180, 196
–
–
–
–
–
–
–
–
C3, K4, P3
C3, K4, P3
C3, K4, P3
–
–
–
DS550
DS550
DS550
13 x 13
–
281, 286, 289, 325,
337, 341, 345
280, 282, 294
–
–
–
C3, K4, P3
–
DS550
13 x 13
13 x 13
14 x 14
14 x 14
–
–
270
683
356, 384, 400, 416, 420, 424
–
169, 220
409, 456, 480, 516, 521, 538
328, 336, 348
361
304, 332, 345
379, 387, 400
177, 193, 201, 224, 225
256
233, 256
–
144
–
166, 169
–
–
–
–
–
C3, K4, P3
C3, K4, P3
C3, K4, P3
C3, K4, P3
–
–
–
–
DS550
DS550
DS550
DS550
15 x 15
–
393, 464, 543, 603
339, 349, 351
208, 217, 220, 233, 240,
255, 260, 261, 288, 289
–
–
C3, K4, P3
–
DS550
15 x 15
16 x 16
–
–
–
609, 624
352, 368
304, 324, 423, 445, 477
319, 324
280, 285
160, 176, 196
174, 225
–
–
C3, K4, P3
C3, K4, P3
–
–
DS550
DS550
17 x 17
–
–
281, 457
256, 268, 272, 292
199, 208, 224,
228, 252, 256
136, 164
C3, K4, P3
–
DS550
17 x 17
–
540, 604, 608
508, 532
308, 316, 318,
324, 326, 358, 400
–
–
C3, K4, P3
–
DS550
Body Size
2.5 x 2.5
3x3
3.5 x 3.5
4x4
0.4 mm
36
49
34, 49
49, 64
0.5 mm
–
25
36
40, 41, 48,49
5x5
97, 100
44, 48, 56, 57, 64,
65, 68, 72, 76, 81
6x6
76
48, 56, 64, 80, 84, 86, 88, 92
6x6
96, 140, 155
96, 96, 97, 100, 101,
105, 111, 112, 121
7x7
187, 191
7x7
8x8
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • June 2016
CABGA
CABGA
Sample
6
Stacked CSP (SCSP) Packages – Package Dimensions (mm)
Body Size
–
–
–
98
–
–
Lead Count and Pitch
0.65 mm
0.75 mm
–
–
–
–
–
–
–
–
49
–
49, 64
–
–
54
–
–
–
–
64, 81, 84
81
–
–
–
–
–
105, 140
92, 100
64
–
–
–
C3, K4
–
DS573
–
–
–
–
–
–
–
–
–
–
–
–
–
–
121
–
144
–
–
–
–
–
–
–
–
–
–
–
–
–
–
56, 88
73
66,67 ,74
56
81, 100
63, 103, 105
100, 121, 128, 144
79, 88
63
96
–
107, 137
72, 88, 107, 133
144, 169
–
–
–
–
44
–
–
–
409
–
–
–
–
–
–
–
–
–
–
–
–
130
–
–
–
–
–
124, 144, 160
165
196
–
–
–
–
–
–
200
134
–
162
134
134
64
–
–
–
–
468
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
K4
K4
C3, K4
K4
K4
K4
K4
C3, K4
C3, K4
K4
C3
K4
K4
C3, K4
K4
K4
K4
C3, K4
K4
K4
K4
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
168, 228, 260, 272, 277,
289, 318, 385
–
208
–
117, 128, 144, 160, 161,
168, 179, 196
–
–
–
C3, K4
–
DS573
169
–
169
289, 325, 341, 401, 417
220, 240, 348, 409, 516
169
–
543
–
–
–
–
–
–
–
–
–
–
–
–
–
–
199
294
151, 152, 300
–
–
160, 272
–
–
–
–
–
–
–
–
–
–
–
–
–
–
100
225
134
52, 53, 152
–
208, 255, 289
208, 256
361, 484
–
–
–
144
–
–
–
–
–
–
119
–
–
–
–
60
–
–
–
52
–
–
–
–
K4
K4
K4
K4
C3, K4
K4
K4
K4
K4
K4
–
–
–
–
–
–
–
–
–
–
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
3x3
3.5 x 3.5
4x4
4.5 x 4.5
5x5
6x6
6x8
6.2 x 7.2
6.6 x 6.9
7x7
7 x 10
7.5 x 7.5
0.4 mm
–
–
81
–
97
140
181
–
–
209, 211
–
210
0.5 mm
25
48, 49
41, 48
40, 60
56, 64, 65, 72, 76, 77, 81
64, 76, 84, 96, 97, 100, 121
–
96
105
84, 117, 121, 143, 144, 160, 169
210
–
8x8
252
113, 120, 128, 160, 161,
176, 196, 208, 225
8x9
8 x 9.2
8 x 11
8 x 11.6
8 x 12
9x7
9x9
9 x 11
10 x 10
10 x 12
10 x 13
10 x 14
10.5 x 10.5
10.5 x 13
11 x 8
11 x 11
11 x 11.5
11 x 13
11 x 13.5
11.5 x 11.5
11.5 x 13
–
–
–
–
–
–
296
–
360, 387
–
–
–
–
–
–
432
–
–
–
–
–
153
44
–
–
–
–
128, 204, 216, 225, 236
–
173, 180, 216, 259, 268, 328, 345
–
–
–
316
–
133
225, 256
–
–
–
–
153, 162, 221
12 x 12
216
12 x 16
12 x 17
12 x 18
13 x 13
14 x 14
14 x 18
14 x 22
15 x 15
17 x 17
19 x 19
–
–
–
–
270
–
–
–
–
–
0.6 mm
–
–
–
–
–
0.8 mm
–
–
–
–
–
–
63
–
–
49
–
–
1 mm
–
–
–
–
–
–
48
–
–
–
–
–
1.27 mm
–
–
–
–
–
–
–
–
–
–
–
–
2 mm
–
–
–
–
–
–
–
–
–
–
–
–
105, 135
–
–
–
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
100
–
196
256
260, 324
Factory
Package Outline
Drawing #
Data
Sheet #
K4
K4
K4
K4
K4
K4
K4
K4
K4
C3, K4
C3
K4
–
–
–
–
–
–
–
–
–
–
–
–
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
Amkor Product Line Card • June 2016
Stacked CSP
Stacked CSP
Sample
7
fcCSP Packages – Nominal Package Dimensions (mm)
17
Body Size
Lead
Count
BGA Size
Ball Count
Package Height
Ball Pitch
Tray
Matrix
Units
Per Tray
Factory
Package Outline
Drawing #
Data
Sheet #
2.21 x 3.05
3x3
3 x 7.5
3x8
3.2 x 2.8
4x4
5x5
5x5
5x6
5x6
5x7
6x6
6x6
6.2 x 7.8
6.5 x 6.5
6.7 x 8
8 x 13
8 x 13.5
8 x 6.5
8x8
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
10.6 x 10.6
10.7 x 10.7
11 x 11
11 x 11
11 x 13.5
12 x 12
12 x 12
12 x 12
12 x 12
12 x 12
12.2 x 9.8
12.6 x 12.6
13 x 10
13 x 13
13 x 13
13 x 13.4
13.9 x 12.3
14 x 14
14 x 14
17
40
53
48
21
21
33
39
53
102
97
81
105
196
97
136
135
253
53
165
69
144
284
424
454
54
337
169
325
325
121
121
121
121
288
486
669
517
144
225
873
255
617
617
N/A
0.25
0.5
0.5
LGA
LGA
LGA
LGA
LGA
0.25
0.25
0.3
0.2
0.25
0.25
0.3
0.46
0.5
LGA
0.3
0.5
0.46
0.3
0.25
N/A
0.45
0.2
0.4
0.3
0.3
0.64
0.6
0.6
0.5
0.3
0.25
0.25
0.3
0.5
0.46
0.25
0.4
0.3
0.3
17
40
53
48
21
21
33
39
53
102
97
81
105
196
97
136
135
253
50
165
69
144
284
424
454
54
337
169
325
325
121
121
121
121
288
486
669
517
144
225
873
255
617
617
N/A
1.15
1.2
1.15
0.88
0.9
0.9
0.72
1.1
0.73
1
0.85
0.889
1
0.77
1.49
2.36
1.32
1.1
0.76
1.16
1.91
0.98
0.95
N/A
0.85
0.889
0.85
0.91
1.06
2.57
1.82
2.09
1.51
1.3
1
1
1.673
1.51
1.89
0.9
1.29
1.21
0.91
0.5
0.4
0.50
0.65
0.40
0.50
0.50
0.40
0.40
0.452
0.5
0.5
0.46/0.65
0.4
0.4
0.5
0.8
0.5/0.6
0.40
0.5
1.0
0.8
0.5
0.4
0.4
0.65
0.46/0.65
0.8
0.5
0.5
1
1
1
1.0
0.67
0.4
0.4
0.5
1.0
0.8
0.4
0.8
0.5
0.5
14 x 35
14 x 35
14 x 26
14 x 26
14 x 35
14 x 35
14 x 35
14 x 35
14 x 35
13 x 31
14 x 26
13 x 33
12 x 29
12 x 25
10 x 26
12 x 25
N/A
10 x 17
10 x 26
12 x 29
8 x 23
8 x 21
8 x 21
8 x 21
8 x 21
8 x 21
9 x 21
8 x 22
8 x 22
8 x 17
8 x 20
8 x 19
9 x 21
8 x 21
8 x 20
8 x 24
8 x 19
8 x 24
8 x 20
8 x 20
7 x 17
7 x 17
7 x 17
7 x 17
490
490
364
364
490
490
490
490
490
403
364
429
348
300
260
300
N/A
170
260
348
184
168
168
168
168
168
189
176
176
136
160
152
189
168
160
192
152
192
160
160
119
119
119
119
K4
K4
P3
P3
P3
P3
P3
P3
P3
K4
K4
K4
K4
K4
K4
K4
K4
P3
P3
K4
P3
K4
K4
K4
K4
K4
K4
K4
K4
K4
K4
K4
K4
P3
K4
K4
K4
K4
P3
K4
K4
K4
K4
K4
–
652316PO
607973PO0A
610538PO
421994PO
480926PO
463062PO0A
6439789PO
411115PO
437557PO
568933PO
568993PO
684126PO
358233PO
488013PO
607179PO
670744PO
468833PO
476666PO
638236PO
443458PO
464793PO
344519PO
438402PO
–
715264PO
617598PO
679034PO
583696PO
606183PO
585453PO
408392PO
613853PO
339265PO
434097PO
360006PO
359715PO
548093PO
452287PO
481847PO
751666PO
446695PO
465801PO
473925PO
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
fcCSP
fcCSP
Sample
*Simulated Results @ 100 MHz
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • June 2016
8
fcCSP Packages (Cont.)– Nominal Package Dimensions (mm)
Body Size
Lead
Count
BGA Size
Ball Count
Package Height
Ball Pitch
Tray
Matrix
Units
Per Tray
Factory
Package Outline
Drawing #
Data
Sheet #
15 x 15
15 x 15
15 x 15
15 x 15
16 x 16
17 x 17
195
484
990
992
536
358
0.6
0.4
N/A
N/A
0.3
0.46
195
484
990
992
536
358
1.8
1.22
N/A
N/A
1.35
1.7
1
0.65
0.40 (0.50)
0.4
0.5
0.8
7 x 18
7 x 17
7 x 18
7 x 17
6 x 15
N/A
126
119
126
119
90
N/A
K4
K4
K4
K4
K4
K4
607829PO
617815PO
–
–
637699PO
358903PO
DS577
DS577
DS577
DS577
DS577
DS577
Data
Sheet #
fcCSP
fcCSP
Sample
*Simulated Results @ 100 MHz
Sample
Body Size
Lead
Count
BGA Size
Ball Count
Package Height
Ball Pitch
Tray
Matrix
Units
Per Tray
Factory
Package Outline
Drawing #
N/A
2.5 x 2.5
6x6
9x9
10 x 10
36
121
256
324
0.25
0.30
0.30
0.30
36
121
256
324
0.82
0.90
0.90
0.90
0.40
0.50
0.50
0.50
14 x 35
14 x 35
10 x 26
8 x 21
490
490
260
168
P3
P3
P3
P3
676854PO
613913PO
613775PO
613735PO
fcCSP – CuBOL
fcCSP – CuBOL
fcCSP Packages – Copper Bond on Lead (CuBOL) Technology – Nominal Package Dimensions (mm)
*Simulated Results @ 100 MHz
Sample
Body Size
Lead
Count
BGA Size
Ball Count
Package Height
Ball Pitch
Tray
Matrix
Units
Per Tray
Factory
Package Outline
Drawing #
Data
Sheet #
N/A
9.9 x 5.9
12 x 12
12 x 12
14 x 14
17.25 x 17.10
180
569
745
31
272
0.25
0.25
0.27/0.25
0.25/0.25
N/A
180
569
745
031
272
0.68
1.15
0.78
0.728
0.82
0.5
0.4
0.40/0.566
0.40/0.40
0.772
9 x 32
9 x 21
8 x 21
8 x 19
6 x 15
288
189
168
152
90
K4
K4
K4
K4
K4
595217PO
438336PO
452573PO
740428PO
528556PO
–
–
–
–
–
fcTMV®
fcTMV®
fcTMV® Packages – Nominal Package Dimensions (mm)
*Simulated Results @ 100 MHz
Sample
Body Size
Lead
Count
BGA Size
Ball Count
Package Height
Ball Pitch
Tray
Matrix
Units
Per Tray
Factory
Package Outline
Drawing #
Data
Sheet #
N/A
15 x 15.2
15.6 x 15
15.6 x 15
994
44
994
N/A
N/A
N/A
994
1044
994
N/A
N/A
N/A
0.27 (0.50)
0.27 (0.50)
0.40 (0.27)
7 x 17
7 x 17
7 x 17
119
119
119
K4
K4
K4
–
–
–
–
–
–
FPFCMEP
FPFCMEP
FPFCMEP Packages – Nominal Package Dimensions (mm)
*Simulated Results @ 100 MHz
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • June 2016
9
Sample
Body Size
Lead
Count
BGA Size
Ball Count
Package Height
Ball Pitch
Tray
Matrix
Units
Per Tray
Factory
Package Outline
Drawing #
Data
Sheet #
N/A
2 x 2.8
2x4
4.2 x 3.3
5x5
5x6
5x7
5.3 x 5.25
5.4 x 6.2
6x6
6x6
6 x 6.6
6.5 x 6.5
6.6 x 5.8
6.6 x 6.6
6.8 x 6.2
6.9 x 7.8
7x7
7x7
7x7
7x7
7x7
7x7
7 x 7.5
7x9
7x9
7.4 x 8.2
7.5 x 7.5
7.5 x 7.5
7.5 x 8.5
7.8 x 7.8
8x8
8x8
8.1 x 8.1
8.5 x 10.5
8.5 x 11
8.6 x 7.7
8.8 x 8.8
9.5 x 7.5
24
32
44
64
102
136
36
152
105
121
364
144
56
195
90
326
64
64
64
191
196
256
277
208
252
302
221
221
324
251
69
188
157
479
269
76
176
314
0.3
0.3
0.3
0.3
0.3
0.3
LGA
0.3
0.3
0.3
N/A
0.3
0.5
0.3
0.3
0.2
0.5
0.5
0.5
0.3
0.3
0.3
0.3
0.3
0.3
0.2
0.3
0.3
0.3
0.3
0.8
0.3
0.3
0.2
0.3
0.4
0.3
0.3
24
32
44
64
102
136
36
152
105
121
N/A
144
56
195
90
326
64
64
64
191
196
256
277
208
252
302
221
221
324
251
69
188
157
479
269
76
176
314
0.17
0.17
0.93
0.88
0.74
0.88
0.72
0.9
0.92
0.73
1
1
1.17
0.8
0.88
0.82
1.596
1.506
1.11
0.95
0.88
0.93
0.82
1
0.92
0.79
0.82
0.82 ± 0.1
0.82
0.88
2.91
0.9
0.99
0.8
0.84
0.94
0.88
0.84 ± 0.10
0.4
0.4
0.4
0.7
0.5
0.4
0.5
0.4
0.5
0.5
N/A
0.5
0.8
0.4
0.7
0.4
0.8
0.8
0.8
0.4
0.5
0.4
0.4
0.4
0.5
0.4
0.4
0.4
0.4
0.4
0.8
0.5
0.5
0.4
0.5
0.8
0.7
0.4
14 x 35
14 x 35
14 x 26
N/A
N/A
14 x 26
N/A
14 x 26
14 x 35
14 x 35
14 x 26
N/A
12 x 28
N/A
10 x 26
10 x 26
N/A
N/A
N/A
10 x 26
10 x 26
N/A
12 x 29
N/A
13 x 25
10 x 26
10 x 26
10 x 26
10 x 26
10 x 26
10 x 26
N/A
10 x 26
22 x 10
10 x 21
12 x 28
10 x 26
10 x 21
490
490
364
N/A
N/A
364
N/A
364
490
490
364
N/A
336
N/A
260
260
N/A
N/A
N/A
260
260
N/A
348
N/A
325
260
260
260
260
260
260
N/A
260
220
210
336
26
210
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
P3
C3
C3
C3
C3
C3
C3
C3
744167PO0C
718064PO0B
N7170-1
500693PO0B
434380PO0A
VN041-1
477833PO0A
637713PO
VN346-1
412011PO
N9650-1
429130PO0A
656455PO
442617PO0A
481017PO0A
742710PO
495076PO
496907PO
487086PO
VK575-1
577133PO
429501PO0A
438217PO
445259PO0A
675144PO
757705PO
409303PO
409303PO0A
562538PO
N2703-1
87180PO
492338PO
604909PO
647400PO
497854PO
559715PO
NT90-Y5378-1
472295PO0D
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Ceramic CSP
Ceramic CSP
Ceramic CSP Packages – Nominal Package Dimensions (mm)
*Simulated Results @ 100 MHz
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • June 2016
10
Sample
Body Size
Lead
Count
BGA Size
Ball Count
Package Height
Ball Pitch
Tray
Matrix
Units
Per Tray
Factory
Package Outline
Drawing #
Data
Sheet #
N/A
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10.5
10.9 x 10.9
10.9 x 10.9
11 x 11
11 x 11
11 x 8
11.7 x 11.6
11.7 x 11.7
12 x 12
12 x 12
12 x 12
12 x 12
12 x 14
12 x 14
12.1 x 13.3
13 x 13
13.3 x 12.1
13.3 x 12.1
13.3 x 12.1
13.8 x 13.8
14 x 12
14 x 12
14 x 12
14 x 14
69
116
144
235
297
391
521
268
469
469
361
576
300
539
492
424
424
425
488
821
821
597
357
570
570
600
288
720
727
760
625
1.0
0.3
0.5
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.4
0.3
0.3
0.3
0.5
0.3
0.3
0.3
0.3
69
116
144
235
297
391
521
268
469
469
361
576
300
539
492
424
424
425
488
821
821
597
357
570
570
600
288
720
727
760
625
2.91
1.05
1.4
0.86 ± 0.10
1
1
0.86 ± 0.10
0.86 ± 0.10
0.9
0.9
0.89
1.05
0.84
0.9
0.9
1.05
1.05
1.05
0.96
0.94
0.91
0.9
1.62
0.9
0.9
0.9
1.62
0.15
0.15
0.96
0.98
1.0
0.8
0.8
0.5
0.5
0.4
0.4
0.5
0.4
0.4
0.5
0.4
0.4
0.4
0.4
0.5
0.5
0.5
0.4
0.4
0.4
0.4
0.7
0.4
0.4
0.4
0.7
0.4
0.4
0.4
0.5
8 x 23
N/A
8 x 23
8 x 23
8 x 21
8 x 23
8 x 21
8 x 20
8 x 21
8 x 21
8 x 22
8 x 22
N/A
9 x 21
9 x 21
9 x 21
9 x 21
N/A
8 x 21
7 x 20
7 x 20
7 x 17
7 x 17
7 x 20
7 x 20
7 x 20
7 x 17
8 x 17
8 x 17
8 x 17
7 x 17
184
N/A
184
184
168
184
168
160
168
168
176
176
N/A
189
189
189
189
N/A
168
140
140
117
119
140
140
140
119
136
136
136
119
P3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
C3
303399PO
406269PD0A
686544PO
431863PO0A
N3944-1
611696PO
451777PO0B
461677PO0A
636373PO
710371PO
695725PO
N2970-1
439355PO0A
558280PO
640560PO
VB699-2
VB699-5
491076PO
697685PO
685510PO
N/A
629993PO
500908PO0C
591657PO
654178PO
710373PO
NT90-NH568-1
769163PO0A
NT90-P1720-1-rev-A
700025PO
751921PO
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Ceramic CSP
Ceramic CSP
Ceramic CSP Packages (Cont.)– Nominal Package Dimensions (mm)
*Simulated Results @ 100 MHz
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • June 2016
11
Leadframe Packages
Leadframe packages been an industry standard for many years. Two of Amkor’s most popular traditional leadframe package types are Small Outline Integrated Circuit (SOIC) and
Quad Flat Package (QFP), also commonly known as “dual” and “quad” products, respectively, based upon the number of sides from which the leads extend.
Leadframe packages use wirebond or flip chip technology to interconnect a die to a leadframe package carrier. Leadframe packages are used in many electronic devices and
remain the most practical and cost-effective solution for many low to medium pin count applications.
Dual packages are common in memory, analog ICs and microcontrollers found in consumer and automotive products. They provide an assortment of packaging capabilities,
especially in low pin count devices, at competitive manufacturing costs.
Quad packages are extensively used in ASICs, DSPs, microcontrollers and memory ICs. A wide range of open and closed tools in quad packages offer low cost and reliable
solutions for moderate and low pin count ICs.
PowerSOP® 3 (PSOP3) Packages – Nominal Package Dimensions (mm)
Body
Width
Body
Length
Body
Thickness
20
11.0
15.9
24
11.0
30
Electrical Performance*
Self
Resistance
(mΩ)
30.6
9.42
–
Package
Outline
Drawing #
Data
Sheet #
P1
41013
DS320
–
Bulk
Capacitance
(pF)
1.990
0.604
–
Factory
Longest
Shortest
–
Self
Inductance
(nH)
3.130
1.540
–
P1
41013
DS320
MO-166
–
–
–
–
–
P1
41013
DS320
14.2
MO-166
–
–
–
–
–
P1
41013
DS320
14.2
MO-166
–
–
–
–
–
P1
41013
DS320
Package
Outline
Drawing #
Data
Sheet #
MTPL
DS330
Standoff
Overall
Height
Lead
Pitch
Tip-to-Tip
JEDEC
Pad Size
(mm)
Lead
3.15
0.20
3.35
1.27
14.2
MO-166
7.5 x 7.9
15.9
3.15
0.20
3.35
1.00
14.2
MO-166
11.0
15.9
3.15
0.20
3.35
0.80
14.2
36
11.0
15.9
3.15
0.20
3.35
0.65
44
11.0
15.9
3.15
0.20
3.35
0.65
PSOP3
PSOP3
Sample
Lead
Count
*Simulated Results @ 100 MHz
TSOP Package – Nominal Package Dimensions (mm)
Body
Width
Body
Length
Body
Thickness
48
12.00
18.40
1.0
Electrical Performance
Standoff
Overall
Height
Lead
Pitch
Tip-to-Tip
JEDEC
Pad Size
(mm)
Lead
–
1.1
0.50
20.00
MO-142
–
–
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Self
Bulk
Self
Factory
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
–
–
–
C3
Amkor Product Line Card • June 2016
12
TSOP 1
TSOP 1
Sample
Lead
Count
TSSOP/MSOP Packages – Nominal Package Dimensions (mm)
MSOP
Body
Width
Body
Length
Body
Thickness
Standoff
Overall
Height
Lead
Pitch
Tip-to-Tip
JEDEC
Pad Size
(mm)
Lead
8
4.4
3.0
0.90
0.10
1.00
0.65
6.4
MO-153
–
14
16
20
24
4.4
4.4
4.4
4.4
5.0
5.0
6.5
7.8
0.90
0.90
0.90
0.90
0.10
0.10
0.10
0.10
1.00
1.00
1.00
1.00
0.65
0.65
0.65
0.65
6.4
6.4
6.4
6.4
MO-153
MO-153
MO-153
MO-153
–
–
–
–
28
4.4
9.7
0.90
0.10
1.00
0.65
6.4
MO-153
–
38
48
4.4
6.1
9.7
12.5
0.90
0.90
0.10
0.10
1.00
1.00
0.50
0.50
6.4
8.1
MO-153
MO-153
–
–
56
6.1
14.0
0.90
0.10
1.00
0.50
8.1
MO-153
–
8
10
3.0
3.0
3.0
3.0
0.85
0.85
0.10
0.10
0.95
0.95
0.65
0.50
5.0
5.0
MO-187
MO-187
–
–
Longest
Shortest
–
–
–
–
Longest
Shortest
–
–
Longest
Shortest
–
–
SSOP/QSOP Packages – Nominal Package Dimensions (inches unless otherwise specified)
Body
Length
Body
Thickness
14/16
5.3 mm (209 mil)
6.2 mm
20
5.3 mm (209 mil)
24
5.3 mm (209 mil)
28
Data
Sheet #
38118
DS350
38118
38118
38118
38118
DS350
DS350
DS350
DS350
38118
DS350
38118
38119
DS350
DS350
38119
DS350
37830
37830
DS350
DS350
Factory
Package
Outline
Drawing #
Data
Sheet #
Electrical Performance*
Standoff
Overall
Height
Lead
Pitch
Tip-to-Tip
JEDEC
Pad Size
(mm)
Lead
1.73 mm
0.13 mm
1.86 mm
0.65 mm
7.80 mm
MO-150
–
0.13 mm
1.86 mm
0.65 mm
7.80 mm
MO-150
3.9 x 5.4
P1
32289
DS360
1.73 mm
0.13 mm
1.86 mm
0.65 mm
7.80 mm
MO-150
–
P1
32289
DS360
5.3 mm (209 mil)
10.2 mm
1.73 mm
0.13 mm
1.86 mm
0.65 mm
7.80 mm
MO-150
3.9 x 5.1
P1
32289
DS360
16
0.150
0.194
0.058
0.006
0.064
0.0250
0.236
MO-137
–
–
19.0
9.10
–
21.5
9.57
–
DS360
1.73 mm
–
0.395
0.209
–
0.463
0.206
–
32289
8.2 mm
–
2.260
0.958
–
2.510
0.928
–
P1
7.2 mm
–
Longest
Shortest
–
Longest
Shortest
–
P1
32864
DS360
20
0.150
0.342
0.058
0.006
0.064
0.0250
0.236
MO-137
2.4 x 3.6
–
–
–
–
P1
32864
DS360
24
0.150
0.342
0.058
0.006
0.064
0.0250
0.236
MO-137
–
0.058
0.006
0.064
0.0250
0.236
MO-137
2.4 x 4.8
–
21.5
9.57
DS360
0.391
–
0.463
0.206
32864
0.150
–
2.510
0.928
P1
28
–
Longest
Shortest
P1
32864
DS360
*Simulated Results @ 100 MHz
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Self
Bulk
Self
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
Amkor Product Line Card • June 2016
13
QSOP
QSOP
Body
Width
Package
Outline
Drawing #
SSOP
SSOP
Sample
Lead
Count
Self
Bulk
Self
Factory
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
1.470
0.224
13.7
P1
0.725
0.177
7.5
–
–
–
P1
–
–
–
P1
–
–
–
P1
–
–
–
P1
2.100
0.368
16.1
P1
0.713
0.180
6.8
–
–
–
P1
–
–
–
P1
4.040
0.631
36.5
P1
1.380
0.213
16.2
–
–
–
P1
–
–
–
P1
MSOP
*Simulated Results @ 100 MHz
Electrical Performance*
Lead
Count
TSSOP
TSSOP
Sample
SOIC Packages – Nominal Package Dimensions (inches)
Body
Width
Body
Length
Body
Thickness
Standoff
Overall
Height
Lead
Pitch
Tip-to-Tip
JEDEC
Pad Size
(mm)
Lead
Package
Outline
Drawing #
Data
Sheet #
8
0.150
0.194
0.058
0.006
0.064
0.050
0.236
MS-012
–
–
–
–
–
P1
00019
DS370
0.150
0.342
0.058
0.006
0.064
0.050
0.236
MS-012
–
–
–
–
–
P1
00019
DS370
16
0.150
0.391
0.058
0.006
0.064
0.050
0.236
MS-012
–
–
1.25
0.718
–
–
0.263
0.218
–
–
8.2
5.1
–
P1
00019
DS370
P1
336420
DS370
P1
00020
DS370
8
0.208
0.208
0.071
0.004
0.075
0.050
0.311
N/A
3.6 x 2.3
16
0.300
0.407
0.092
0.009
0.101
0.050
0.406
MS-013
–
–
Longest
Shortest
–
18
0.300
0.456
0.092
0.009
0.101
0.050
0.406
MS-013
–
–
–
–
–
P1
00020
DS370
20
0.300
0.505
0.092
0.009
0.101
0.050
0.406
MS-013
–
–
–
–
–
P1
00020
DS370
24
0.300
0.607
0.092
0.009
0.101
0.050
0.406
MS-013
–
0.092
0.009
0.101
0.050
0.406
MS-013
6.4 x 4.8
–
28.7
8.04
DS370
0.706
–
1.09
0.345
00020
0.300
–
5.05
1.42
P1
28
–
Longest
Shortest
P1
00051
DS370
Factory
Package
Outline
Drawing #
Data
Sheet #
DS397
PDIP Packages – Nominal Package Dimensions (mils)
Electrical Performance
Lead
Count
Shoulder
Width
Body
Width
Body
Length
Standoff
Lead
Pitch
JEDEC
Pad Size
(mm)
Lead
8
300
252
8
300
248
130
15
100
MS-001
–
–
–
–
–
P1
00290
129.9
–
100
–
–
–
–
–
–
JKM
–
14
300
252
–
130
15
100
MS-001
–
–
–
–
–
P1
00291
DS397
16
300
252
16
300
252
750
130
15
100
MS-001
–
–
–
–
–
P1
30170
DS397
757.9
137.8
–
100
–
–
–
–
–
–
JFO
–
18
300
252
–
900
130
15
100
MS-001
–
–
–
–
–
P1
00292
DS397
18
300
20
300
252
968.5
137.8
–
100
–
–
–
–
–
–
JFO
–
–
252
1030
130
15
100
MS-001
–
–
–
–
–
P1
00293
DS397
20
20
300
248
944.9
129.9
–
100
–
–
–
–
–
–
JKM
–
–
300
259.8
748
129.9
–
70
–
–
–
–
–
–
JKM
–
–
22
400
340
1095
150
15
100
MS-010
–
–
–
–
–
P1
30125
DS397
24
300
252
1250
130
15
100
MS-001
–
–
–
–
–
P1
30124
DS397
24
600
540
1250
150
15
100
MS-011
–
–
–
–
–
P1
00289
DS397
24
300
252
–
–
–
70
–
–
–
–
–
–
JHD
–
–
24
300
252
866.1
137.8
–
70
–
–
–
–
–
–
JFO
–
–
28
300
288
1365
130
20
100
MO-095
–
–
–
–
–
P1
30791
DS397
28
400
339
–
–
–
70
–
–
–
–
–
–
JHD
–
–
28
600
540
1450
150
15
100
MS-011
–
–
–
–
–
P1
00286
DS397
–
30
Body
Thickness
365
348
750
Self
Bulk
Self
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
448.8
1291.3
138.8
–
70
–
–
–
–
–
–
JFO
–
32
400
339
–
–
–
70
–
–
–
–
–
–
JHD
–
–
40
600
540
2060
150
15
100
MS-011
–
–
–
–
–
P2
00284
DS397
42
400
339
–
–
–
70
–
–
–
–
–
–
JHD
–
–
48
600
540
2430
160
15
100
MS-011
–
–
–
–
–
P3
30123
DS397
64
750
700.8
2263.8
157.5
–
70
–
–
–
–
–
–
JFO
–
–
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • June 2016
14
PDIP
PDIP
Factory
14
*Simulated Results @ 100 MHz
Sample
Self
Bulk
Self
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
SOIC Wide
SOIC Wide
Electrical Performance*
Lead
Count
SOIC Narrow
SOIC Narrow
Sample
ePad TSSOP/MSOP/SOIC/SSOP Packages – Nominal Package Dimensions (mm)
ePad SSOP ePad SOIC ePad MSOP
Body
Width
Body
Length
Body
Thickness
Standoff
Overall
Height
Lead
Pitch
Tip-to-Tip
JEDEC
Pad Size
(mm)
Center
Inductance
(nH)
Corner
Inductance
(nH)
Factory
Package
Outline
Drawing #
Data
Sheet #
8
14
16
20
24
28
38
48
56
4.4
4.4
4.4
4.4
4.4
4.4
4.4
6.1
6.1
3.0
5.0
5.0
6.5
7.8
9.7
9.7
12.5
14.0
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.00
0.65
0.65
0.65
0.65
0.65
0.65
0.50
0.50
0.50
6.40
6.40
6.4 0
6.40
6.40
6.40
6.40
8.10
8.10
MO-153
MO-153
MO-153
MO-153
MO-153
MO-153
MO-153
MO-153
MO-153
–
–
3.0 x 3.0
3.0 x 4.2
–
3.0 x 5.5
–
–
–
–
–
1.58
1.68
–
1.70
–
–
–
–
–
2.28
2.45
–
2.65
–
–
–
P1
P1
P1
P1
P1
P1
P1
P1
P1
38118
38118
38118
38118
38118
38118
38118
38119
38119
DS571
DS571
DS571
DS571
DS571
DS571
DS571
DS571
DS571
8
3.0
3.0
0.85
0.10
0.95
0.65
5.00
MO-187
1.73 x 2.39
1.50
2.20
P1
37830
DS571
10
3.0
3.0
0.85
0.10
0.95
0.50
5.00
MO-187
–
–
–
P1
37830
DS571
8
3.9
4.9
1.47
0.05
1.52
1.27
6.00
MS-012
–
–
–
P1
50396
DS571
16
3.9
9.9
1.47
0.05
1.52
1.27
6.00
MS-012
–
–
–
P1
50396
DS571
36
7.6
10.3
2.28
0.05
2.45
0.50
10.40
MO-271
–
–
–
P1
469970
DS571
ePad MSOP ePad SOIC ePad SSOP
N/A
Electrical Performance*
Lead
Count
ePad TSSOP
ePad TSSOP
Sample
*Simulated Results @ 100 MHz
SOT-23/TSOT Packages – Nominal Package Dimensions (mm)
TSOT (TSOP)
Body
Width
Body
Length
Body
Thickness
Overall
Height
Lead
Pitch
Tip-to-Tip
JEDEC/EIAJ
Factory
Package Outline
Drawing #
Data
Sheet #
3
4
5
6
8
3
5
6
8
1.3
1.3
1.6
1.6
1.6
1.6
1.6
1.6
1.6
2.9
2.9
2.9
2.9
2.9
2.9
2.9
2.9
2.9
0.90
0.90
1.15
1.15
1.15
0.88
0.88
0.88
0.88
0.98
0.98
1.23
1.23
1.23
0.96
0.96
0.96
0.96
0.95/1.9
1.92
0.95/1.9
0.95
0.65
0.95/1.9
0.95
0.95
0.65
2.40
2.40
2.80
2.80
2.80
2.75
2.75
2.75
2.75
SOT346/TO-236/SC-59
SOT143/TO-253
MO-178
MO-178
MO-178
N/A
MO-193
MO-193
MO-193
P1
P1
P1
P1
P1
P1
P1
P1
P1
471228
471228
471229
471229
471229
353251/41211
353251/41211
353251/41211
353251/41211
DS581
DS581
DS581
DS581
DS581
DS581
DS581
DS581
DS581
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • June 2016
TSOT (TSOP)
Lead
Count
SOT-23
SOT-23
Sample
15
TQFP/LQFP Packages – Nominal Package Dimensions (mm)
Lead
Count
Body
Thickness
Lead
Pitch
Lead
Form
Standoff
Foot
Length
5x5
5x5
32
40
1
1
0.5
0.4
7x7
32
1.00/1.40
7x7
36
1.4
JEDEC
Tray
Matrix
Units
Per Tray
Tip-to-Tip
1
1
0.1
0.1
0.6
0.6
7
7
MS-026
MS-026
12 x 30
12 x 30
0.8
1
0.1
0.6
9
MS-026
0.8
1
0.1
0.6
9
–
Self
Bulk
Self
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
Pad Size
(mm)
Lead
360
360
–
–
10 x 25
250
5x5
–
–
Longest
Shortest
10 x 25
250
5x5
–
–
–
1.110
0.962
0.225
0.200
–
–
0.904
0.799
–
–
0.211
0.202
–
–
9.2
7.8
Factory
Package Outline Data
Drawing #
Sheet #
P1
P1
P1, JHD,
JKM, JUK
40138
–
32780
DS230
DS230
DS230
DS232
DS230
DS232
DS230
DS232
DS230
DS232
DS230
DS232
DS230
DS232
DS230
DS232
DS230
DS232
DS230
DS232
DS230
DS232
DS230
DS232
DS230
DS232
DS230
DS232
DS230
DS232
DS230
DS232
DS230
DS232
DS320
DS320
DS232
DS232
DS230
DS232
DS230
DS232
DS232
32770/34604
–
JKM
–
13.8
12.0
32770/34604
32780
DS232
32780
DS232
P1, JMG, JUK
34514
DS232
P1, JMG, JUK
34514
DS232
7x7
48
1.00/1.40
0.5
1
0.1
0.6
9
MS-026
10 x 25
250
5x5
Longest
Shortest
7x7
64
1.00/1.40
0.4
1
0.1
0.6
9
MS-026
10 x 25
250
–
–
–
–
–
P1, JFO, JHD,
JKM, JUK
P1, JFO, JHD,
JKM, JUK
10 x 10
44
1.00/1.40
0.8
1
0.1
0.6
12
MS-026
8 x 20
160
–
–
–
–
–
P1, JUK
32772/34607
10 x 10
48
1.4
0.65
1
0.1
0.6
12
–
8 x 20
160
–
–
–
–
–
JHD
–
10 x 10
52
1.00/1.40
0.65
1
0.1
0.6
12
MS-026
8 x 20
160
–
–
–
–
–
P1, JUK
32772/34607
32772/34607
32770/34604
10 x 10
64
1.00/1.40
0.5
1
0.1
0.6
12
MS-026
8 x 20
160
–
–
–
–
–
P1, JHD,
JKM, JUK
10 x 10
80
1.00/1.40
0.4
1
0.1
0.6
12
MS-026
8 x 20
160
–
–
–
–
–
P1, JKM
32772/34607
12 x 12
64
1.4
0.65
1
0.1
0.6
14
MS-026
7 x 17
119
–
–
–
–
–
JUK
–
32774/51023
0.5
1
0.1
0.6
14
MS-026
7 x 17
119
–
–
–
–
–
P1, JHD,
JKM, JUK
1.00/1.40
1
1
0.1
0.6
16
MS-026
6 x 15
90
–
–
–
–
–
P1
–
1.00/1.40
0.8
1
0.1
0.6
16
MS-026
6 x 15
90
–
–
–
–
–
P1
473943/473945
80
1.00/1.40
0.65
1
0.1
0.6
16
MS-026
6 x 15
90
–
–
–
–
–
P1, JUK
473943/473945
14 x 14
100
1.00/1.40
0.5
1
0.1
0.6
16
MS-026
6 x 15
90
8x8
Longest
Shortest
2.300
1.520
0.419
0.322
26.3
17.8
473943/473945
14 x 14
120/128
1.00/1.40
0.40/0.40
1
0.1
0.6
16
MS-026
6 x 15
90
–
–
–
–
–
16 x 16
16 x 16
14 x 20
20 x 20
120
144
100/128
128
1.4
1
1.4
1.4
0.5
0.4
0.65/0.50
0.5
1
1
1
1
0.1
0.1
0.1
0.1
0.6
0.6
0.6
0.6
18
18
16.0 x 22.0
22
–
MS-026
MS-026
MS-026
6 X 15
6 x 15
6 x 12
5 x 12
90
90
72
60
–
–
–
–
20 x 20
144
1.00/1.40
0.5
1
0.1
0.6
22
MS-026
5 x 12
60
8.5 x 8.5
–
–
–
–
Longest
Shortest
–
–
–
–
6.430
4.230
–
–
–
–
1.100
1.070
–
–
–
–
62.9
52.6
20 x 20
176
1.00/1.40
0.4
1
0.1
0.6
22
MS-026
5 x 12
60
–
–
–
–
–
24 x 24
160
1.4
0.5
1
0.1
0.6
26
MS-026
4 x 10
40
–
24 x 24
176
1.4
0.5
1
0.1
0.6
26
MS-026
4 x 10
40
8x8
–
Longest
Shortest
–
9.510
5.200
–
1.270
1.340
–
89.0
64.0
24 x 24
216
1.4
0.4
1
0.1
0.6
26
MS-026
4 x 10
40
–
–
–
–
–
Longest
Shortest
–
9.670
6.190
–
1.380
1.210
–
86.2
64.8
–
P1, JHD,
JKM, JUK
P1, JHD,
JKM, JUK
JUK
P1, JUK
P1, JHD, JKM
P1
P1, JHD, JKM,
JMG, JUK
P1, JKM,
JMG, JUK
P1
P1, JKM,
JMG, JUK
P1, JKM,
JMG, JUK
12 x 12
80
1.00/1.40
14 x 14
52
14 x 14
64
14 x 14
28 x 28
208
1.4
0.5
1
0.1
0.6
30
MS-026
4x9
36
11 x 11
28 x 28
256
1.4
0.4
1
0.1
0.6
30
MS-026
4x9
36
–
473943/473945
–
335487
45373
473979/473996
473979/473996
473979/473996
*Simulated Results @ 100 MHz
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • June 2016
16
TQFP/LQFP
TQFP/LQFP
Sample
Electrical Performance*
Body
Size
ExposedPad TQFP/LQFP Packages – Nominal Package Dimensions (mm)
Electrical Performance*
Body
Size
Lead
Count
Body
Thickness
Lead
Pitch
Lead
Form
Standoff
Foot
Length
Tip-to-Tip
JEDEC
Tray
Matrix
Units
Per Tray
Pad Size
(mm)
Loop
Inductance (nH)
Center
Loop
Inductance (nH)
Corner
Factory
Package Outline
Drawing #
Data
Sheet #
5x5
7x7
7x7
7x7
10 x 10
10 x 10
10 x 10
10 x 10
12 x 12
14 x 14
14 x 14
32
32
48
64
44
52
64
80
80
52/64
80
1
1
1
1
1.00/1.40
1.00/1.40
1.00/1.40
1.00/1.40
1.00/1.40
1.00/1.40
1.00/1.40
0.5
0.8
0.5
0.4
0.8
0.65
0.5
0.4
0.5
1.00/0.80
0.65
1
1
1
1
1
1
1
1
1
1
1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
7
9
9
9
12
12
12
12
14
16
16
–
–
–
–
–
–
–
–
–
–
–
12 x 30
10 x 25
10 x 25
10 x 25
8 x 20
8 x 20
8 x 20
8 x 20
7 x 17
6 x 15
6 x 15
360
250
250
250
160
160
160
160
119
90
90
–
–
5x5
–
–
–
7.5 x 7.5
–
–
–
–
–
–
2.29
–
–
–
3.04
–
–
–
–
–
–
2.81
–
–
–
3.78
–
–
–
–
40579
32770
32770
32770
32772/430273
32772/430273
32772/430273
32772/430273
31026/51023
–
473943/473945
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
–
DS231
DS231
6 x 15
90
10.3 x 10.3
2.57
3.32
473943/473945
DS231
–
6 x 15
90
–
–
–
473943/473945
DS231
–
6 x 15
90
–
–
–
473943/473945
DS231
–
–
–
–
–
–
–
–
–
–
–
–
–
6 x 12
6 x 12
6 x 15
5 x 12
5 x 12
5 x 12
4 x 10
4 x 10
4 x 10
4x9
4x9
4x9
4x9
72
72
90
60
60
60
40
40
40
36
36
36
36
–
–
–
–
7x7
–
–
10 x 10
–
11 x 11
11 x 11
–
–
–
–
–
–
4
–
–
5
–
6
6
–
–
–
–
–
–
5
–
–
6
–
7
7
–
–
P1
K1, P1
K1, P1, JHD, JUK
K1
K1, P1, J1
K1
K1, JFO, JUK
K1
JFO
K1, P1
K1, P1
K1, P1, JFO,
JHD, JKM
K1, P1
K1, P1,
JHD, JKM
P1
P1
P1
K1, P1
K1, P1, JMG
K1, JKM
K1
P1, JHD, JMG
P1, JMG
P1, JMG
JHD
P1
JHD
14 x 14
100
1.00/1.40
0.5
1
0.1
0.6
16
–
14 x 14
120
1
0.4
1
0.1
0.6
16
14 x 14
128
1.4
0.4
1
0.1
0.6
16
14 x 20
14 x 20
16 x 16
20 x 20
20 x 20
20 x 20
24 x 24
24 x 24
24 x 24
28 x 28
28 x 28
28 x 28
28 x 28
100
128
144
128
144
176
160
176
216
208
208
256
256
1.4
1.4
1
1.00/1.40
1.00/1.40
1.00/1.40
1.4
1.4
1.4
1.4
3.56
1.4
3.95
0.65
0.5
0.4
0.5
0.5
0.4
0.5
0.5
0.4
0.5
0.50
0.4
0.40
1
1
1
1
1
1
1
1
1
1
1.00
1
1.00
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.10
0.1
0.10
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.60
0.6
0.60
16.0 x 22.0
16.0 x 22.0
18
22
22
22
26
26
26
30
30.00
30
30.00
–
–
335487
473979/473996
473979/473996
473979/473996
32780
32780
32780
34514
–
34514
–
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
–
DS231
–
Units
Per Tray
Factory
Package
Outline
Drawing #
Data
Sheet #
P1
P1
P1
P1
–
–
–
–
DS195
DS195
DS195
DS195
P1
–
DS195
P1
–
DS195
P1
–
DS195
Exposed Pad LQFP/TQFP
Exposed Pad LQFP/TQFP
Sample
*JEDEC Standard Test Boards – Tested @ 1W with die attach pad soldered to PCB
MQFP PowerQuad® 4 Packages – Nominal Package Dimensions (mm)
Electrical Performance
Lead
Count
Body
Thickness
Lead
Pitch
Lead
Form
Standoff
Foot
Length
Tip-to-Tip
JEDEC
Tray
Matrix
28 x 28
28 x 28
28 x 28
28 x 28
120
128
144
160
3.37
3.37
3.37
3.37
0.80
0.80
0.65
0.65
1.30/1.60
1.30/1.60
1.30/1.60
1.30/1.60
0.13/0.33
0.13/0.33
0.13/0.33
0.13/0.33
0.56/0.88
0.56/0.88
0.56/0.88
0.56/0.88
30.6/31.2
30.6/31.2
30.6/31.2
30.6/31.2
MS-029/022
MS-029/022
MS-029/022
MS-029/022
3x8
3x8
3x8
3x8
28 x 28
208
3.37
28 x 28
256
3.37
0.50
1.30/1.60
0.13/0.33
0.56/0.88
30.6/31.2
MS-029/022
0.40
1.30/1.60
0.13/0.33
0.56/0.88
30.6/31.2
MS-029/022
32 x 32
240
3.40
0.50
1.30
0.38
0.56
34.6
MS-029
Pad Size
(mm)
Lead
24
24
24
24
–
–
–
–
3x8
24
9.5 x 9.5
3x8
24
–
3x8
24
10.6 x 10.6
–
–
–
–
Longest
Shortest
–
Longest
Shortest
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Self
Bulk
Self
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
–
–
–
–
12.000
6.850
–
15.72
12.12
–
–
–
–
1.730
1.470
–
2.123
1.841
–
–
–
–
95.5
81.0
–
227.0
205.7
Amkor Product Line Card • June 2016
17
MQFP PowerQuad® 4
MQFP PowerQuad® 4
Sample
Body
Size
MQFP Packages – Nominal Package Dimensions (mm)
Electrical Performance*
Body
Size
Lead
Count
Body
Thickness
Lead
Pitch
Lead
Form
Standoff
Tip-to-Tip
JEDEC
Tray
Matrix
Units
Per
Tray
Pad Size
(mm)
Lead
10 x 10
44
2.00
0.80
1.60
0.15
13.20
MS-022
6 x 16
96
7.4 x 7.4
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
12 x 12
14 x 14
52
64
44
52
64
80
52
2.00
2.00
2.00
2.00
2.00
2.70
2.00
0.65
0.50
0.80
0.65
0.50
0.50
1.00
1.60
1.60
1.95
1.95
1.95
–
1.60
0.15
0.15
0.15
0.15
0.15
–
0.15
13.20
13.20
13.90
13.90
13.90
–
17.20
MS-022
MS-022
MS-112
MS-112
MS-112
–
MS-022
6 x 16
6 x 16
6 x 16
6 x 16
6 x 16
–
6 x 14
96
96
96
96
96
–
84
–
–
–
–
–
–
–
14 x 14
64
2.00
0.80
1.60
0.15
17.20
MS-022
6 x 14
84
8.9 x 8.9
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
14 x 20
14 x 20
14 x 20
14 x 20
14 x 20
80
100
52
64
80
100
52
64
64
64
80
80
100
100
100
80
100
64
80
100
2.00
2.00
2.67
2.67
2.67
2.67
2.67
2.67
2.70
3.05
2.67
3.05
2.67
2.70
3.05
2.70
2.70
2.71
2.71
2.71
0.65
0.50
1.00
0.80
0.65
0.50
1.00
0.80
0.80
0.80
0.65
0.65
0.50
0.50
0.50
0.80
0.65
1.00
0.80
0.65
1.60
1.60
1.60
1.60
1.60
1.60
1.95
1.95
–
–
1.95
–
1.95
–
–
–
–
1.60
1.60
1.60
0.15
0.15
0.15
0.15
0.15
0.15
0.15
0.15
–
–
0.15
–
0.15
–
–
–
–
0.33
0.33
0.33
17.20
17.20
17.20
17.20
17.20
17.20
17.90
17.90
–
–
17.90
–
17.90
–
–
–
–
17.2 x 23.2
17.2 x 23.2
17.2 x 23.2
MS-022
MS-022
MS-022
MS-022
MS-022
MS-022
MS-112
MS-112
–
–
MS-112
–
MS-112
–
–
–
–
MS-022
MS-022
MS-022
6 x 14
6 x 14
6 x 14
6 x 14
6 x 14
6 x 14
6 x 14
6 x 14
6 x 14
6 x 14
6 x 14
6 x 14
6 x 14
6 x 14
6 x 14
6 x 11
6 x 11
6 x 11
6 x 11
6 x 11
84
84
84
84
84
84
84
84
84
84
84
84
84
84
84
66
66
66
66
66
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
14 x 20
128
2.71
0.50
1.60
0.33
17.2 x 23.2
MS-022
6 x 11
66
11.0 x 11.0
14 x 20
14 x 20
14 x 20
14 x 20
14 x 20
20 x 20
28 x 28
28 x 28
64
80
100
128
128
144
120/128
144/160
2.71
2.71
2.71
2.71
3.10
3.60
3.37
3.37
1.00
0.80
0.65
0.50
0.50
0.50
0.80/0.80
0.65/0.65
1.95
1.95
1.95
1.95
–
–
1.30
1.30
0.23
0.23
0.23
0.23
–
–
0.13
0.13
17.9 x 23.9
17.9 x 23.9
17.9 x 23.9
17.9 x 23.9
–
–
30.6
30.6
MS-112
MS-112
MS-112
MS-112
–
–
MS-029
MS-029
6 x 11
6 x 11
6 x 11
6 x 11
6 x 11
–
3x8
3x8
66
66
66
66
66
–
24
24
–
–
–
–
–
–
–
–
28 x 28
208
3.37
0.50
1.30
0.13
30.60
MS-029
3x8
24
–
28 x 28
28 x 28
28 x 28
256
120/128
144/160
3.37
3.37
3.37
0.40
0.80/0.80
0.65/0.65
1.30
1.30
1.30
0.13
0.33
0.33
30.60
30.6
30.6
MS-029
MS-029
MS-029
3x8
3x8
3x8
24
24
24
–
–
–
Longest
Shortest
–
–
–
–
–
–
–
Longest
Shortest
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Longest
Shortest
–
–
–
–
–
–
–
–
Longest
Shortest
–
–
–
Self
Bulk
Self
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
1.660
1.460
–
–
–
–
–
–
–
5.92
1.319
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
9.29
1.694
–
–
–
–
–
–
–
–
9.86
3.723
–
–
–
0.322
0.342
–
–
–
–
–
–
–
0.884
0.548
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
1.227
0.501
–
–
–
–
–
–
–
–
7.945
2.948
–
–
–
19.8
17.0
–
–
–
–
–
–
–
123.6
0.164
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
200.0
0.150
–
–
–
–
–
–
–
–
0.937
0.325
–
–
–
Factory
Package
Outline
Drawing #
Data
Sheet #
P1
–
DS232
P1
P1, JFO
P1
P1
P1
JFO
P1
–
–
–
–
–
–
–
DS232
DS232
DS232
DS232
DS232
–
DS232
P1
–
DS232
P1
P1
P1
P1
P1
P1
P1
P1
JFO
JHD
P1
JHD
P1
JFO
JHD
JUK
JFO, JUK
P1
P1
P1
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
DS232
DS232
DS232
DS232
DS232
DS232
DS232
DS232
–
–
DS232
–
DS232
–
–
–
–
DS232
DS232
DS232
P1
–
DS232
P1
P1
P1
P1
JHD
JFO
P1
P1
–
–
–
–
–
–
–
–
DS232
DS232
DS232
DS232
–
–
DS232
DS232
P1
–
DS232
P1
P1
P1
–
–
–
DS232
DS232
DS232
*Simulated Results @ 100 MHz
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • June 2016
18
MQFP
MQFP
Sample
MQFP Packages – Nominal Package Dimensions (mm)
Electrical Performance*
Body
Size
Lead
Count
Body
Thickness
Lead
Pitch
Lead
Form
Standoff
Tip-to-Tip
JEDEC
Tray
Matrix
Units
Per
Tray
Pad Size
(mm)
Lead
Self
Inductance
(nH)
Bulk
Capacitance
(pF)
Self
Resistance
(mΩ)
Factory
Package
Outline
Drawing #
Data
Sheet #
28 x 28
28 x 28
28 x 28
28 x 28
28 x 28
28 x 28
208
256
136
168
208
256
3.37
3.37
3.56
3.56
3.56
3.95
0.50
0.40
0.80
0.65
0.50
0.40
1.60
1.60
–
–
–
–
0.33
0.33
–
–
–
–
31.20
31.20
–
–
–
–
MS-022
MS-022
–
–
–
–
3x8
3x8
3x8
3x8
3x8
3x8
24
24
24
24
24
24
-
0.50
1.30
0.38
34.60
MS-029
3x8
24
12.7 x 12.7
P1
–
DS232
32 x 32
240
3.40
0.50
1.30
0.32
34.60
MS-029
3x8
24
-
217.5
0.543
-
DS232
DS232
–
–
–
–
3.40
9.480
1.513
-
–
–
–
–
–
–
240
16.84
7.87
-
P1
P1
JHD
JHD
JHD
JHD
32 x 32
Longest
Shortest
-
P1
–
DS232
MQFP
MQFP
Sample
*Simulated Results @ 100 MHz
PLCC Packages – Nominal Package Dimensions (inches unless otherwise specified)
Pkg
Type
Sample
Body
Size
(inches)
Body
Thickness
(inches)
Lead
Pitch
(inches)
JEDEC
Qty
Per Tube
20
8.9 x 8.9
.352 x .352
0.152
0.05
MS-018
28
11.5 x 11.5
.452 x .452
0.152
0.05
44
16.6 x 16.6
.652 x .652
0.152
52
68
–
–
.752 x .752
.952 x .952
84
29.3 x 29.3
32
–
Rectangular
Pad Size
(mm)
Lead
Self
Inductance
(nH)
Bulk
Capacitance
(pF)
Self
Resistance
(mΩ)
Factory
Package
Outline
Drawing #
Data
Sheet #
46
3.7 x 3.7
P1
00060
DS232
0.05
MS-018
26
8.89 x 8.89
P1
00060
DS232
0.152
0.150
0.05
0.05
MS-018
MS-018
23
18
–
–
P1
P1
00060
00060
DS232
DS232
1.152 x 1.152
0.150
0.05
MS-018
15
10.8 x 10.8
P1
00060
DS232
.452 x .552
0.109
0.05
MS-016
30
–
13.5
11.1
–
17.8
13.7
–
–
57.6
43.2
–
DS232
6.6 x 6.6
0.596
0.583
–
0.893
0.681
–
–
1.780
1.750
–
00060
37
2.110
1.780
–
2.900
2.140
–
–
10.900
6.840
–
P1
MS-018
Longest
Shortest
–
Longest
Shortest
–
–
Longest
Shortest
–
P1
00061
DS232
Factory
Package
Outline
Drawing #
Data
Sheet #
P1
P1
–
–
DS587
DS587
P1
–
DS587
P1
P1
P1
–
–
–
DS587
DS587
DS587
PLCC
Body
Size
(mm)
Square
PLCC
Electrical Performance*
Lead
Count
*Simulated Results @ 100 MHz
FusionQuad® Packages – Nominal Package Dimensions (mm)
Total Max IO Number Possible
Dual Row Land
Single Row Land
Peripheral Lead
Max Die Pad Size (mm)
Electrical Performance*
0.4 pitch
0.5 pitch
0.4 pitch
0.5 pitch
0.4 pitch
0.5 pitch
0.4 pitch
0.5 pitch
Pkg
Pad Size
(mm)
10 x 10
12 x 12
164
200
132
164
148
176
116
140
88
108
64
80
5.3
6.5
5.3
6.5
–
–
–
–
14 x 14
228
192
204
168
128
100
7.3
7.5
176 ld
6.5 x 6.5
16 x 16
20 x 20
24 x 24
264
316
356
224
264
296
236
280
320
196
228
260
148
184
224
120
144
176
8.5
9.7
9.7
8.7
10
10
–
–
–
–
–
–
*Simulated Results @ 100 MHz
Note: Above are estimates only.
Detailed designs have not yet been implemented for all options.
Actual pin counts are pad size dependent.
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Lead
–
–
Longest
Shortest
–
–
–
Self
Bulk
Self
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
–
–
5.99
1.42
–
–
–
–
–
0.82
0.23
–
–
–
–
–
209
81
–
–
–
Amkor Product Line Card • June 2016
19
FusionQuad®
FusionQuad®
Sample
Body
Size
MicroLeadFrame® MLF®/QFN/SON/DFN Packages – Nominal Package Dimensions (mm)
Body
Size
MLF®/QFN/
SON/DFN
Leads
Pitch (mm)
Dual Row
Lead Count
Pitch (mm)
1x1
1x1
2x2
2x2
2x2
2x2
3x3
3x3
3x3
3x3
4
6
6
8
10
12
4
6
8
10
0.35, 0.65
0.35, 0.65
0.50, 0.65
0.50, 0.65
0.50, 0.65
0.50, 0.65
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
–
–
–
–
–
–
–
–
–
3x3
12
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
3x3
3x3
3x3
4x4
4x4
4x4
4x4
4x4
4x4
4x4
4x4
4x4
5x5
5x5
5x5
5x5
5x5
5x5
5x5
5x5
5x5
6x5
6x5
6x5
6x5
6x6
6x6
6x6
6x6
6x6
6x6
6x6
6x6
6x6
16
20
24
8
10
12
16
20
24
28
32
40
8
16
20
28
32
36
40
44
52
18
24
36
42
16
28
30
32
36
40
44
48
56
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
–
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.65, 0.5, 0.4, 0.35
1.00, 0.65, 0.5, 0.4, 0.35
1.00, 0.65, 0.5, 0.4, 0.35
1.00, 0.65, 0.5, 0.4, 0.35
1.00, 0.65, 0.5, 0.4, 0.35
1.00, 0.65, 0.5, 0.4, 0.35
1.00, 0.65, 0.5, 0.4, 0.35
1.00, 0.65, 0.5, 0.4, 0.35
1.00, 0.65, 0.5, 0.4, 0.35
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
0.5
0.5
–
–
–
–
–
–
–
–
–
–
0.5
–
–
Electrical Performance*
Lead
Self
Inductance
(nH)
Bulk
Capacitance
(pF)
Self
Resistance
(mΩ)
Factory
Package
Outline
Drawing #
Data
Sheet #
–
–
–
–
–
.052
–
.460
–
–
.078
–
.134
–
–
2.4
–
2.0
–
–
–
–
–
–
Longest
Shortest
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
0.564
0.531
–
–
–
–
–
.044
–
–
–
–
–
–
–
–
.048
–
–
–
–
–
–
–
–
–
–
–
–
–
–
.052
–
–
–
–
–
–
–
–
0.203
0.220
–
–
–
–
–
.189
–
–
–
–
–
–
–
–
.144
–
–
–
–
–
–
–
–
–
–
–
–
–
–
.175
–
–
–
–
–
–
–
–
141.8
138.9
–
–
–
–
–
1.9
–
–
–
–
–
–
–
–
2.2
–
–
–
–
–
–
–
–
–
–
–
–
–
–
2.5
–
–
–
–
K1, P3
K1, P3
K1, P3
K1, P3
K1, P3
K1, P3
K1, P1, P3
K1, P3
K1, P1, P3
K1, P1, P3
–
–
–
–
–
–
–
–
–
–
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
K1, P1, P3
–
DS572
K1, P1, P3
K1, P1, P3
K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
*Simulated Results @ 12 GHz. Values dependent on specific die and wire configurations.
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • June 2016
20
MicroLeadFrame® MLF®/QFN/SON/DFN
MicroLeadFrame® MLF®/QFN/SON/DFN
Sample
MicroLeadFrame® MLF®/QFN/SON/DFN Packages – Nominal Package Dimensions (mm)
Body
Size
MLF®/QFN/
SON/DFN
Leads
Pitch (mm)
Dual Row
Lead Count
Pitch (mm)
6x6
6x6
6x6
6x6
7x7
7x7
60
60
64
68
32
36
1.00, 0.65, 0.5, 0.4, 0.35
–
1.00, 0.65, 0.5, 0.4, 0.35
–
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
0.5
–
0.5
–
–
7x7
44
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
7x7
7x7
7x7
7x7
7x7
7x7
8x8
8x8
8x8
8x8
8x8
8x8
8x8
8x8
8x8
8x8
8x8
8x8
8x8
9x9
9x9
9x9
9x9
9x9
9x9
9x9
9x9
9x9
9x9
9x9
9x9
10 x 10
10 x 10
10 x 10
48
56
68
76
80
84
4
16
32
36
40
52
56
68
76
84
88
92
100
36
44
48
60
64
76
88
100
104
108
104
116
44
52
56
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
2.00, 1.42, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
2.00, 1.42, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
2.00, 1.42, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
2.00, 1.42, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
2.00, 1.42, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
2.00, 1.42, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
–
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
–
–
0.5
–
0.5
–
–
–
–
–
–
–
–
–
0.5
–
0.5
0.5
–
–
–
–
–
–
–
0.5
–
0.5
–
0.5
–
–
–
10 x 10
64
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
*Simulated Results @ 12 GHz. Values dependent on specific die and wire configurations.
Electrical Performance*
Lead
Self
Inductance
(nH)
Bulk
Capacitance
(pF)
Self
Resistance
(mΩ)
Factory
Package
Outline
Drawing #
Data
Sheet #
–
–
–
–
–
–
Longest
Shortest
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Longest
Shortest
–
–
–
–
–
–
1.766
1.194
–
–
–
–
–
–
–
–
–
–
–
–
.049
–
–
–
–
–
–
–
–
–
–
–
.051
–
–
–
–
–
–
–
–
–
2.179
1.475
–
–
–
–
–
–
0.326
0.289
–
–
–
–
–
–
–
–
–
–
–
–
.137
–
–
–
–
–
–
–
–
–
–
–
.129
–
–
–
–
–
–
–
–
–
0.518
0.409
–
–
–
–
–
–
315.1
234.5
–
–
–
–
–
–
–
–
–
–
–
–
2.3
–
–
–
–
–
–
–
–
–
–
–
2.4
–
–
–
–
–
–
–
–
–
337.5
250.8
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
–
–
–
–
–
–
DS572
DS572
DS572
DS572
DS572
DS572
C3, K1, P1, P3
–
DS572
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
C3, K1, P1, P3
–
DS572
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • June 2016
21
MicroLeadFrame® MLF®/QFN/SON/DFN
MicroLeadFrame® MLF®/QFN/SON/DFN
Sample
MicroLeadFrame® MLF®/QFN/SON/DFN Packages – Nominal Package Dimensions (mm)
Body
Size
MLF®/QFN/
SON/DFN
Leads
Pitch (mm)
Dual Row
Lead Count
Pitch (mm)
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
68
72
88
100
116
124
132
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
–
–
–
–
–
–
11 x 11
132
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
11 x 11
11 x 11
12 x 12
12 x 12
12 x 12
12 x 12
12 x 12
12 x 12
12 x 12
12 x 12
140
148
48
60
84
88
100
108
124
144
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
–
–
–
–
–
–
–
–
–
12 x 12
148
0.65, 0.5
0.5
12 x 12
156
0.65, 0.5
0.5
12 x 12
164
–
0.5
13 x 13
164
0.65, 0.5
0.5
13 x 13
13 x 13
172
180
–
–
0.5
0.5
Electrical Performance*
Lead
Self
Inductance
(nH)
Bulk
Capacitance
(pF)
Self
Resistance
(mΩ)
Factory
Package
Outline
Drawing #
Data
Sheet #
–
–
–
–
–
–
–
Longest
Shortest
–
–
–
–
–
–
–
–
–
–
Longest
Shortest
Longest
Shortest
–
Longest
Shortest
–
–
–
–
–
–
–
–
–
0.766
0.277
–
–
–
–
–
–
–
–
–
–
0.802
0.279
0.787
0.276
–
0.497
0.208
–
–
–
–
–
–
–
–
–
0.462
0.342
–
–
–
–
–
–
–
–
–
–
0.479
0.342
0.468
0.332
–
0.325
0.318
–
–
–
–
–
–
–
–
–
28.4
9.4
–
–
–
–
–
–
–
–
–
–
30.5
9.4
30.4
9.8
–
20.0
7.7
–
–
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
–
–
–
–
–
–
–
DS572
DS572
DS572
DS572
DS572
DS572
DS572
C3, K1, P1
–
DS572
C3, K1, P1
C3, K1, P1
C3, K1, P1
C3, K1, P1
C3, K1, P1
C3, K1, P1
C3, K1, P1
C3, K1, P1
C3, K1, P1
C3, K1, P1
–
–
–
–
–
–
–
–
–
–
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
C3, K1, P1
–
DS572
C3, K1, P1
–
DS572
C3, K1, P1
–
DS572
C3, K1, P1
–
DS572
C3, K1, P1
C3, K1, P1
–
–
DS572
DS572
*Simulated Results @ 12 GHz. Values dependent on specific die and wire configurations.
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • June 2016
22
MicroLeadFrame® MLF®/QFN/SON/DFN
MicroLeadFrame® MLF®/QFN/SON/DFN
Sample
Power Packages
Amkor’s portfolio of power packages serves diversified markets and applications, including automotive, communications and industrial.
Optimized for power sensitive and mobile applications, Amkor’s high performance power devices use a leadframe as the package carrier and primarily use wirebond interconnect
technology. A majority of packages will use a Cu clip interconnect, which provides the best known electrical properties for power devices. With technology focused on electrical
and thermal improvement, products include advanced power packaging, advance copper clip attached and modules.
Power Packages – Nominal Package Dimensions (mm)
Package
Lead
Count
Body
Width
Body
Length
Body
Thickness
Overall
Height
Lead
Pitch
Tip-to-Tip
JEDEC/JEITA
Factory
Package Outline
Drawing #
Data
Sheet #
PSMC
2
4.4
6.1
1.1
1.1
-
6.5
–
ATM
–
DS616
PSMC
3
4.4
6.1
1.1
1.1
2.13
6.5
–
ATM
–
DS617
SOD123-FL
2
1.6
2.6
0.98
0.98
–
3.5
–
ATM
–
DS614
SOD128-FL
2
2.4
3.8
0.98
0.98
–
4.7
–
ATM
–
DS613
SOD323-FL
2
1.25
1.9
0.6
0.6
–
2.5
–
ATM
–
DS615
TO-220
3
10
9.6
4.6
–
2.54
28.2
–
JFI
–
–
TO-220F
3
10
15
4.5
–
2.54
28.5
–
JFI
–
–
TO-220FP
3
10
15
4.5
-
2.54
28
-
ATM
–
DS610
TO-220SMD
3
10.2
8.5
4.6
–
2.54
12.5
–
JFI
–
–
TO-251
3
6.5
5.5
2.3
–
2.3
13.7
–
JFI
–
–
TO-252JEDEC
3
6.5
6.1
2.3
–
2.3
9.8
JEDEC
JFI
–
–
TO-252JEITA
3
6.5
5.5
2.3
–
2.3
9.5
JEITA
JFI
–
–
TO-263
3
10
9.15
4.45
–
2.04/3.04
15.25
–
JFI
–
–
SO8-FL
6
4.9
5.75
1
1
1.27
6.1
JEDEC
ATM
–
–
TO-263 (7-pin)
7
10
8.5
4.8
–
1.27
12.5
–
JFI
–
–
HSON8
8
5
5.4
1.45
1.45
1.27
5.15 x 6
–
JFI
–
–
HVSON
(8-pin mini)
8
3.15
3
0.9
0.9
0.65
3.3 x 3.3
–
JFI
–
–
HVSON (8-pin)
8
5
5.4
1
1
1.27
5.15 x 6
–
JFI
–
–
SO8-FL
8
5
5
0.95
0.95
1.27
6
JEITA
ATM
–
DS611
SO8-FL
8
4.9
5.75
1
1
1.27
6.1
JEDEC
ATM
–
DS611
TSON8-FL
8
3.1
3.1
0.85
0.85
0.65
3.3
JEDEC
ATM
–
DS612
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • June 2016
Power
Power
Sample
23
Test Services
Amkor Technology provides a complete range of semiconductor testing services including wafer testing, various types of final testing, system level testing, strip testing and
complete end-of-line services up to and including final shipping. We offer a full range of test software, hardware, integration and product engineering services, and we support a
range of business models and test capabilities.
We test a variety of device types across all of our package families including radio frequency, analog and mixed signal, digital, power management, memory and various
combinations such as application-specific integrated circuits (ASICs), multichip modules (MCMs), System-in-Package (SiP) and 3D stacked packaging. We also test biometric
devices, accelerometers, gyrometers, haptics, pressure sensors and other types of microelectromechanical systems MEMS devices.
Major Testers Platform
Manufacturer
Advantest
Teradyne
Xcerra
Tester Model
T2000
T5XXX (Memory)
T65XX (Logic)
93000 Series
Eagle Series
U Flex/Flex Series
J750 Series
Magnum
X-Series, Diamond
Application
Digital
Mixed
RF











–
–
–








–
Memory
–

–
–
–



–


–
–
Wafer Prober
Wafer Size
200 mm
300 mm
Prober
Pin to Pad
Accuracy
Temp Range
(°C)
Min.
Pad Size/Pitch
Comments
TEL P8XL
TEL Precio Octo
± 4 µm
± 2 µm
Ambient ~ 150°C
Ambient ~ 150°C
Z-force 20 kg
Z-force 40 kg
EG 4090µ, 4090µ+
± 4 µm/± 3 µm
Ambient ~ 130°C
TSK UF200/200A
± 4 µm
TEL P12XLn+
± 1.8 µm
38 µm/58 µm
Max Z-force 100 kg
TEL Precio/
Precio Nano
EG 6000
± 1.8 µm/
± 0.8 µm
± 2.5 µm
27 µm/41 µm
45 µm/67 µm
Max Z-force 200 kg/
Max Z-force 300 kg
Max Z-force 150 kg
TSK UF3000ex
± 1 µm
30 µm/45 µm
Max Z-force 200 kg
Semics OPUS3/
OPUS3 SP
± 1.5 µm/
± 1.0 µm
Ambient ~ 160°C
Ambient ~ 150°C
(*-55°C ~ 150°C)
Ambient ~ 150°C
(*-55°C ~ 150°C)
Ambient ~ 150°C
Ambient ~ 150°C
(*-55°C ~ 200°C)
Ambient ~ 150°C
(*-40°C ~ 150°C)
50 µm/75 µm
40 µm/60 µm
50 µm/75 µm,
48 µm/72 µm
50 µm/75 µm
37 µm/56 µm
30 µm/45 µm
Max Z-force 300 kg
Max Z-force 450 kg
18 kg
–
*Direct docking, cold test is optional
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • June 2016
24
Conventional Handler
Type
of Handler
Manufacturer
Pkg Size (mm)
Pkg Type
Temp
Input/Output
Docking
55 x 72
BGA/LGA/CSP/POP/
TSV/MLF®/TQFP
Ambient/
Hot/Cold
Tray
Direct or
Soft Dock
2x2
21 x 21
TQFP/SOIC/
TSSOP/MLF®
Ambient/
Hot/Cold
1 x 0.6
12 x 12
BGA/QFP/
SOIC/MLF®
Ambient/
Hot
Min
Max
Pick & Place
Hontech
Seiko Epson,
MT/Delta (cold)
Advantest, Techwing
3.0 x 3.0
Gravity
MT, Rasco
Xceltron
Turret
Ismeca, SRM
ASM
Strip Test
MCT, Rasco
Film Frame
MCT
Not limited; below 1 mm with
130 µm pad size & 0.25 mm pitch
Ambient/
Hot/Cold
Ambient
Leaded Pkg
sMLF®
Tube,
Bowl/Tube,
TNR
Bulk,
Bowl/Canister,
TNR
Direct or
Soft Dock
Soft Dock
Strip/Singulated
Direct
Film Frame
Direct
Strip Test/Film Frame Handler
Assembly
Format
Std Leadframe
(MCT SH5000/
Rasco SO3000)
Film Frame
(FH1200)
Handler
Temp Range
(°C)
Contact Force
Packages
-50 to +150 (± 3)
77 kgf
(option 194 kgf)
TQFP up to 64 lead, 10 x 10 mm
SOIC-N 150 mil, SOIC-W 300 mil,
SOIC std 208 mil
TSSOP up to 28 lead
(3.0 and 4.4 mm body sizes)
PDIP up to 8 lead
Ambient
77 kgf
(option 120 kgf)
Saw MLF® up to 7 x 7 mm
MCT H5000
Rasco SO3000
MCT FFC
(Film Frame)
FH1200
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • June 2016
25
Wafer Test Roadmap
Available
2015
2016
2017
Max. Wafer Size (mm)
300
300
300
450
Parallelism (# of sites)
128
256
256
256
Max. Chuck Force (kgf)
450
500
500
500
Overall Accuracy (µm)
X,Y: ± 0.8
X,Y: ± 0.8
X,Y: ± 0.8
X,Y: ± 0.8
Temperature Range (°C)
Min. Pitch (µm)
Pad Wafer (In-Line)
Bump Full Array
WLCSP
Min. Pad Size (µm)
-55 ~ 200
-55 ~ 200
-55 ~ 200
-55 ~ 200
40
75
250
30 x 30
40
60
225
30 x 30
35
60
200
25 X 25
30
50
200
25 x 25
Available
2015
2016
2017
16
32
32
32
Memory product excluded
PackageTest Roadmap – PnP
Parallelism (# of sites) - P&P
Max. Contact Force (kgf)
520
650
650
650
Min/Max Package Size (mm) - P&P
3.0*3.0/55*72
3.0*3.0/55*72
2.5*2.5/55*72
2.5*2.5/55*72
Package Thickness (µm)
350
300
250
250
Temperature Range (°C)
-55 ~ 175
-55 ~175
-55 ~175
-55 ~175
Contactor Min. Pitch (mm)
FCBGA/QFP/MLF®(QFN)
CSP/vfBGA//PoP/TMV®
0.35
0.35
0.3
0.3
0.3
0.3
0.25
0.25
Contact Method
Direct/Chamber
Direct/Chamber
Direct/Chamber
Direct/Chamber
Memory product excluded
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • June 2016
26
Amkor Technology by the Numbers
26,700+
Founded
1968
3,000+
Number of Employees
Package
Portfolio
Assembly
$3.7B
10%
Automotive
Amkor + J-Devices
22
%
2,464
Number of Patents
Test
End
Market
Distribution
Computing
7%
Design
Communications
46
16
ü
Networking
NET SALES
Top
Turnkey
Services
%
Consumer
15%
Bumping
8,000,000+
Sales & Customer
Support Centers
Square Foot
Manufacturing
Space
22
Assembly
& Test Facilities
Amkor Worldwide Sales Offices
CORPORATE HEADQUARTERS
Tempe, AZ
2045 E. Innovation Circle
Tempe, AZ 85284
USA
Tel: 480-821-5000
Fax: 480-821-8276
US MAIN SALES OFFICE
San Jose, CA
25 Metro Drive
Suite #700
San Jose, CA 95110
Tel: 408-496-0303
Fax: 408-496-0392
Irvine, CA
3 Corporate Park
Suite 230
Irvine, CA 92606
Tel: 949-724-9370
Fax: 949-724-8925
San Diego, CA
5465 Morehouse Drive
Suite 210
San Diego, CA 92121
Tel: 858-320-6280
Fax: 858-622-1841
Austin, TX
8140 N. Mopac
Suite 150
Austin, TX 78759
Tel: 512-953-0701
Fax: 512-953-0717
Dallas, TX
1101 Central Expressway South
Suite 215
Allen, TX 75013
Tel: 469-342-9964
Fax: 469-342-9956
Boston, MA
105 Central Street
Suite 2300
Stoneham, MA 02180
Tel: 781-438-7800
Fax: 781-438-8414
EUROPEAN SALES OFFICE
JAPAN SALES OFFICE
Amkor Technology Euroservices s.a.s
Archamps Technopole
60 Avenue Marie Curie
74160 Archamps
France
Tel: 33-4-50-31-88-00
Fax: 33-4-50-31-88-01
Shibakoen Front Tower 14F
2-6-3, Shibakoen
Minoto-Ku, Tokyo 105-0011
Japan
Tel: 81-3-5425-2830
Fax: 81-3-5425-2831
GERMANY SALES OFFICE (Munich)
Amkor Technology Holding B.V., Germany
Werner-Eckert-Straße 14,
81829 Munich
Germany
Tel: +49 (0)89-1241498-40
Fax: +49 (0)89-1241498-49
CHINA SALES OFFICE (Shanghai)
Zhangjiang Hi Tech Park
2889 Jinke Road, Room #504
Bldg. E, Chamtime Square
Pudong, Shanghai 201203
China
Tel: 8621-5064-4590 ext. 2340 or 2344
Fax: 8621-5048-2522
SE ASIA SALES OFFICE
Amkor Technology Singapore Holding Pte. Ltd.
491B River Valley Road, #15-02/04
Valley Point Office Tower
Singapore 248373
Tel: 65-6211-3333
Fax: 65-6211-3388
TAIWAN SALES OFFICE
Amkor Technology Taiwan, Inc.
3F-1, No.1, Tai Yuen 2nd St.
Zhubei City, Hsinchu County
Taiwan 302
Tel: 886-3-598-2000
Fax: 886-3-560-1269
CHINA SALES OFFICE (Beijing)
Room 3-2-308,
Zhujiang Moore International Center,
No. 1 Beiqing Road, Changping District,
Beijing, China
CHINA SALES OFFICE (Shenzhen)
Room 2907, Building A,
Xinghe Century Mansion,
Caitian Road, Futian District,
Shenzhen, China
KOREA SALES OFFICE
Site K1 - Main Plant
151, Dongil-ro, Seongdong-gu
Seoul 04799
Korea
Tel: 822-460-5114
Fax: 822-460-6007
Visit Amkor Technology online for locations and
to view the most current product information.
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor
shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend
or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without
notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2016, Amkor Technology Incorporated.
All Rights Reserved. 6/16
Questions? Contact us: [email protected]
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