RClamp3324P Low Capacitance RailClamp® 4-Line Surge and ESD Protection PROTECTION PRODUCTS Description Features RailClamp® 3324P provides ESD protection for highspeed data interfaces. It features a high maximum ESD withstand voltage of ±17kV contact and ±20kV air discharge per IEC 61000-4-2. RClamp3324P is designed to minimize both the ESD peak clamping and the TLP clamping. Package inductance is reduced at each pin resulting in lower peak ESD clamping voltage. The dynamic resistance is among the industry’s lowest at 0.15 Ohms (typical). Maximum capacitance on each line to ground is 0.65pF allowing the RClamp3324P to be used in applications operating in excess of 5GHz without signal attenuation. Each device will protect up to four lines (two high-speed pairs) and are qualified to AEC-Q100, Grade 1 (-40 to +125 oC) for automotive applications. . • Transient Protection to IEC 61000-4-2 (ESD) 20kV (Air), 17kV (Contact) IEC 61000-4-4 (EFT) 4kV (5/50ns) IEC 61000-4-5 (Lightning) 4.5A (8/20µs) ISO-10605 (ESD) 15kV (Air), 12kV (Contact) • Qualified to AEC-Q100, Grade 1 • Package design optimized for high speed layout • Protects four high-speed data lines • Working Voltage: 3.3V • Low Capacitance: 0.65 pF maximum (I/O to GND) • Dynamic Resistance: 0.15 Ohms (Typ) • Solid-State Silicon-Avalanche Technology RClamp3324P is in a 10-pin SGP2510P8 package measuring 2.5 x 1.0mm with a nominal height of 0.60mm. The leads have a nominal pin-to-pin pitch of 0.50mm. Flow- through package design simplifies PCB layout and maintains signal integrity on high-speed lines. The combination of low peak ESD clamping, low dynamic resistance, and innovative package design enables this device to provide the highest level of ESD protection for applications such as USB 3.0, eSATA, and DisplayPort. Nominal Dimension Mechanical Characteristics • • • • • • • SGP2510P8 Package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 2.5 x 1.0 x 0.60 mm Lead Finish: NiPdAu Molding Compound Flammability Rating: UL 94V-0 Marking : Marking Code + Date Code Packaging : Tape and Reel Applications • • • • • • USB 3.0 Automotive Applications Industrial Equipment Digital Visual Interface LVDS Interfaces eSATA Functional Schematic 2.50 1 2 1.00 0.50 BSC 0.60 Nominal Dimensions in mm RClamp3324P Final Datasheet Revision date Rev 6 June 9, 2015 Device Schematic www.semtech.com 1 of 8 Semtech Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Current (tp = 8/20µs) IPP 4.5 A ESD per IEC 61000-4-2 (Contact)(1) ESD per IEC 61000-4-2 (Air)(1) VESD ±17 ±20 kV ESD per ISO-10605 (Contact)(2) ESD per ISO-10605 (Air)(2) VESD ±12 ±15 kV Operating Temperature TJ -40 to +125 O Storage Temperature TSTG -55 to +150 O C C Electrical Characteristics (T=25OC unless otherwise specified) Parameter Symbol Conditions Min. Reverse Stand-Off Voltage VRWM -40OC to 125OC Any I/O pin to GND Trigger Voltage V TRIG tp = 0.2/100ns (TLP) Any I/O pin to GND Typ. Max. 3.3 8 V μA 0.150 μA 2.5 3.5 V IPP = 4.5A, tp = 8/20µs, Any I/O pin to GND 3.5 4.5 V VC IPP = 4A, tp = 0.2/100ns (TLP) Any I/O pin to GND 3.5 V ESD Clamping Voltage(4) VC IPP = 16A, tp = 0.2/100ns (TLP) Any I/O pin to GND 5.3 V Dynamic Resistance(4), (5) RDYN tp = 0.2/100ns (TLP) Any I/O pin to GND 0.15 Ohms VR = 0V, f = 1MHz Any I/O pin to GND 0.60 0.65 pF VR = 0V, f = 1MHz Between I/O Pins 0.30 0.40 pF Reverse Leakage Current IR Clamping Voltage(3) VC IPP = 1A, tp = 8/20µs, Any I/O pin to GND Clamping Voltage(3) VC ESD Clamping Voltage(4) Junction Capacitance CJ 0.01 V 0.05 VRWM = 3.3V T = 25OC Units T = 125 C O Notes: (1): ESD Gun return path to Ground Reference Plane (GRP) (2): ESD Gun return path to Horizontal Coupling Plane (HCP); Test conditions: 150pF, 330pF, 330W. (3): Measured using an 8/20us constant current source. (4): Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and V TLP averaging window: t1 = 70ns to t2 = 90ns. (5): Dynamic resistance calculated from ITLP = 4A to ITLP = 16A RClamp3324P Final Datasheet Revision Date Rev 6 June 9, 2015 www.semtech.com 2 of 8 Semtech Typical Characteristics ESD Clamping (-8kV Contact per IEC 61000-4-2) ESD Clamping (+8kV Contact per IEC 61000-4-2) 80 70 10 60 Clamping Voltage - VC (V) Clamping Voltage - VC (V) 20 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. 50 40 30 20 10 -10 -20 -30 -40 -50 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. -60 0 -10 0 -10 0 10 20 30 40 50 60 70 80 -70 90 -10 0 10 20 30 Time (ns) 80 Clamping Voltage ‐ VC (V) Clamping Voltage - VC (V) P8KV_330 ohm_330pF P8KV_330 Ohm_2k 30 20 10 0 ‐10 N8KV_330 ohm_330pF N8KV_330 Ohm_2k ‐20 ‐30 ‐50 -10 -10 0 10 20 30 40 50 60 70 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. Tested per ISO‐10605 ‐60 80 ‐10 0 10 20 Time (ns) TLP Curve (Positive Pulse) 30 40 Time (ns) 50 60 70 80 TLP Curve (Negative Pulse) 0 30 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns 25 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns ‐5 TLP Current (A) 20 TLP Current (A) 90 ‐40 0 -20 80 10 60 40 70 20 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. Tested per ISO‐10605 50 60 ESD Clamping (-8kV Contact per ISO-10605) ESD Clamping (+8kV Contact per ISO-10605) 70 40 50 Time (ns) 15 10 5 ‐10 ‐15 ‐20 ‐25 0 ‐30 ‐5 0 2 4 6 8 10 RClamp3324P Final Datasheet Revision Date Rev 6 June 9, 2015 ‐6 ‐5 ‐4 ‐3 ‐2 ‐1 0 DUT Voltage (V) DUT Voltage (V) www.semtech.com 3 of 8 Semtech Typical Characteristics (Continued) Clamping Voltage vs. Peak Pulse Current (tp-8/20us) Reverse Leakage Current (IR) vs. Temperature 8 5.0 VR = 3.3V TA = 25OC tp = 8x20us Any I/O to GND 4.5 4.0 7 6 Leakage Current ‐ IR (nA) Peak Clamping Voltage ‐ VC (V) 3.5 3.0 2.5 2.0 1.5 5 4 3 2 1.0 1 0.5 0 1 2 3 4 Peak Pulse Current ‐ IPP (A) RC3324P_AR_IR 0 RC3324P_AR_8_20 Surge 0.0 5 0 6 20 Capacitance vs. Reverse Voltage 140 0.9 0.6 0.8 0.5 Junction Capacitance - CJ (pF) Junction Capacitance ‐ CJ (pF) 120 1.0 f = 1MHz 0.4 0.3 0.2 CJ Line to GND 0.1 CJ Line to Line RC33_AR_CJ RC3324P_AR_CJ 0.0 0 0.5 1 1.5 2 Voltage (V) 2.5 3 0.7 0.6 0.5 0.4 0.3 0.2 f = 1MHz VR = 0V Between any I/O and GND 0.1 0.0 3.5 -75 -50 -25 0 25 50 75 100 125 150 Temperature (OC) Insertion Loss - S21 Analog Crosstalk 0 0 -1 -10 -2 -20 Insertion Loss - IL (dB) -3 Insertion Loss - IL (dB) 60 80 100 Temperature (OC) Capacitance vs. Temperature 0.7 -4 -5 -6 -7 -8 -30 -40 -50 -60 -70 -9 -10 40 -80 0 1 10 10 RClamp3324P Final Datasheet Revision Date Rev 6 June 9, 2015 100 1000 10000 Frequency (MHz) Frequency (GHz) www.semtech.com 4 of 8 Semtech Application Information USB Interface Protection For USB 3.0 applications, RClamp3324P is recommended for protecting the 5Gb/s SuperSpeed line pairs. Figure 1 below shows an example of protecting a USB 3.0 Type-A interfaces (host side shown). Lines are routed through each device entering at pins 1, 2, 4, and 5 and exiting at pins 10, 9, 7, and 6 respectively (Figure 2). Each trace should run under the device and connect the pins together. Ground connection is made at the center tabs (pins 3, and 8 ). Traces should be kept the same length to avoid impedance mismatch. The differential impedance of each pair can be controlled for USB 3.0 (85 Ohms +/-15%) while maintaining a minimum trace-to-trace and trace-to-pad spacing. Individual PCB design constraints may necessitate different spacing or trace width. Both ground pads should be connected for optimal performance. Ground connection is made using filled via-inpad. RClamp0512TQ is be used to protect D+ and D- lines. These lines are routed through RClamp0512TQ at pin1 and pin 2. Pin 3 is connected to the ground plane. RClamp0512TQ is qualified to AEC-Q100. Additional information may be found on the device data sheet. Figure 1 - USB 3.0 Type-A Protection Example Figure 2 - Trace Routing Single line devices such as uClamp0571P are recommended for surge and ESD protection of the VBus line. This device features high surge and ESD capability and may be used on 5V power rails. In power delivery (PD) applications, higher working voltage TVS device may be needed. Options exist for ESD and surge protection up to 24V. Device Placement Placement of the protection component is a critical element for effective ESD suppression. TVS diodes should be placed as close to the connector as possible. This helps reduce transient coupling to nearby traces. USB 3.0 - Type A Host Connector Line 1 In RClamp0512TQ SSRX- Line 1 Out to IC 1 Line 2 In Line 2 Out to IC GND D+ Via to Ground Landing Pad Device Outline Trace SSRX+ GND SSTX- RClamp3324P SSTX+ Ground Line 3 In Line 3 Out to IC Line 4 In Line 4 Out to IC D- VBus Trace Land Pattern Device Via uClamp0571P RClamp3324P Final Datasheet Revision Date Rev 6 June 9, 2015 www.semtech.com 5 of 8 Semtech Outline Drawing - SGP2510P8 A D B DIM E PIN 1 INDICATOR (LASER MARK) A SEATING PLANE aaa C A A1 b b1 D E e L N aaa bbb DIMENSIONS MILLIMETERS MIN NOM MAX 0.57 0.60 0.63 0.00 0.03 0.05 0.15 0.20 0.25 0.35 0.40 0.45 2.45 2.50 2.575 0.95 1.00 1.075 0.50 BSC 0.28 0.33 0.38 8 0.08 0.10 C A1 2xb1 bbb R0.125 1 2 LxN (0.025-0.075) 2X 0.075 7 Places C A B N E/2 bxN e bbb C A B D/2 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SGP2510P8 P DIMENSIONS (C) G Z Y X DIM C G P X X1 Y Z MILLIMETERS (0.825) 0.20 0.50 0.20 0.40 0.625 1.45 X1 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. RClamp3324P Final Datasheet Revision Date Rev 6 June 9, 2015 www.semtech.com 6 of 8 Semtech Marking Code 3324P YYWW Notes: Dot indicates pin 1 location Tape and Reel Specification Carrier Tape, 4mm Pitch Option YYWW 3324P YYWW 3324P YYWW 3324P YYWW 3324P Pin 1 Location (Towards Sprocket Holes) Carrier Tape, 2mm Pitch Option Device Orientation in Tape Ordering Information Part Number Qty per Reel Pocket Pitch Reel Size RClamp3324P.TCT RClamp3324P.TNT 3,000 10,000 4mm 2mm 7” 7” RailClamp and RClamp are registered trademarks of Semtech Corporation RClamp3324P Final Datasheet Revision Date Rev 6 June 9, 2015 www.semtech.com 7 of 8 Semtech IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. 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Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2015 Contact Information Semtech Corporation 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com RClamp3324P Final Datasheet Revision date 6 June 9, 2015 8 of 8 Semtech