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Datasheet
Pressure Sensor series
Pressure Sensor IC
BM1383GLV
General Description
Key Specifications





BM1383GLV is piezo-resistive pressure sensor.
BM1383GLV does temperature compensation for MEMS
inside chip, so it’s very easy to get pressure information.
Pressure Range:
300hPa to 1100hPa
Relative Pressure Accuracy:
±0.12hPa(Typ)
Absolute Pressure Accuracy:
±1hPa(Typ)
Average Current Consumption:
5.0μA (Typ)
Operating Temperature Range:
-40°C to +85°C
Features





Piezo-resistive pressure sensor.
Pressure range is from 300hPa to 1100hPa.
Built-in temperature compensation
function.
2
I C interface.
Small package.
Package
W(Typ) x D(Typ) x H(Max)
2.50mm x 2.50mm x 1.00mm
CLGA12V025M
Applications
 Smartphone, Healthcare, mobile device (e.g. game).
Typical Application Circuit
TOUT
BM1383GLV
TIN
LDO
Memory
DREG
VDD
VSS
Pressure Sensor
MUX
ADC
SDA
Signal
Processing
I2 C
SCL
INT
Temperature
Sensor
HOST
NC1
NC0
Clock
TEST1
TEST0
〇Product structure : Silicon monolithic integrated circuit
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〇This product has no designed protection against radioactive rays
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Contents
General Description ...................................................................................................................................................................... 1
Features ......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................. 1
Key Specifications ........................................................................................................................................................................ 1
Package ......................................................................................................................................................................................... 1
Typical Application Circuit ........................................................................................................................................................... 1
Pin Configuration .......................................................................................................................................................................... 3
Pin Description ............................................................................................................................................................................. 3
Block Diagram............................................................................................................................................................................... 4
Absolute Maximum Ratings ......................................................................................................................................................... 5
Recommended Operating Conditions ........................................................................................................................................ 5
Electrical Characteristics ............................................................................................................................................................. 5
2
I C bus Timing Chart .................................................................................................................................................................... 6
Register Map ................................................................................................................................................................................. 7
2
I C bus communication .............................................................................................................................................................. 13
Interrupt function ........................................................................................................................................................................ 14
Control sequence ....................................................................................................................................................................... 15
Application Example .................................................................................................................................................................. 19
I/O equivalent circuit .................................................................................................................................................................. 20
Operational Notes ....................................................................................................................................................................... 21
Ordering Information .................................................................................................................................................................. 23
Marking Diagrams ....................................................................................................................................................................... 23
Physical Dimension, Tape and Reel Information ..................................................................................................................... 24
Revision History ......................................................................................................................................................................... 25
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BM1383GLV
Pin Configuration
Top View
(pads not visible)
1PIN MARK
Bottom View
(pads visible)
HOLE
3
4
5
5
4
3
VSS
TIN
TOUT
TOUT
TIN
VSS
2
6
6
2
VDD
TEST1
TEST1
VDD
1
7
7
1
DREG
NC0
NC0
DREG
12
8
8
12
TEST0
NC1
NC1
TEST0
11
10
9
9
10
11
INT
SDA
SCL
SCL
SDA
INT
Pin Description
Pin No.
Pin Name
In/Out
Function
(Note 1)
1
DREG
-
Logic voltage pin
2
VDD
-
power voltage pin
3
VSS
-
GND pin
4
TIN
In
Test pin (connect to TOUT)
5
TOUT
Out
6
TEST1
In
Test pin (connect to GND)
7
NC0
-
Non connect pin
8
NC1
-
Non connect pin
9
SCL
In
I C serial bus clock pin
10
SDA
In/Out
I C serial bus data pin
11
INT
Out
12
TEST0
In
(Note 2)
Test pin (connect to TIN)
2
2
INT pin
Test pin (connect to GND)
(Note 1) Please place a bypass capacitor between DREG and VSS in the proximity of the terminals.
Please set a bypass capacitor of 1.0uF between DREG and VSS.
(Note 2) Please do not use DREG as power supply for other device because DREG should be only used to Logic.
(Note 3) Please place a bypass capacitor between VDD and VSS in the proximity of the terminals.
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BM1383GLV
Block Diagram
TOUT
TIN
BM1383GLV
LDO
Memory
DREG
VDD
VSS
Pressure Sensor
MUX
ADC
Signal
Processing
I2 C
SDA
SCL
INT
Temperature
Sensor
NC1
NC0
Clock
TEST1
TEST0
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BM1383GLV
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Power Supply
Input Voltage
Symbol
Rating
Unit
VDD
0 to +4.5
V
VIN
-0.3 to VDD+0.3
V
Operating Temperature
Topr
-40 to +85
°C
Storage Temperature
Tstg
-40 to +125
°C
Pressure
Povr
20000
hPa
Power Dissipation
Pd
0.43
(Note 1)
W
(Note 1) Derating in done 4.3 mW/°C for operating above Ta≧25°C (Mount on 4-layer 114.3×76.2×1.6mm board)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta= -40°C to +85°C)
Parameter
Power Supply
2
I C clock Input Frequency
Symbol
Rating
Unit
VDD
1.7 to 3.6
V
fSCL
MAX 400
kHz
Electrical Characteristics (Unless otherwise specified VDD=1.8V Ta=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Idd
-
5.0
-
µA
OneShotMode(Single Measurement)
Operating Mode
Current Consumption
Iddp
-
650
1000
µA
during Pressure measurement
Iddt
-
650
1000
µA
Power Down Mode Current
Iss
-
1
10
µA
during Temperature measurement
PWR_DOWN=0
RSTB=0
L Input Voltage
VIL
GND
-
0.3 *
VDD
V
SDA, SCL
H Input Voltage
VIH
-
VDD
V
SDA, SCL
L Input Current
IIL
0.7 *
VDD
-10
-
0
μA
VIL= GND (SDA, SCL)
H Input Current
IIH
0
-
μA
VIH= VDD (SDA, SCL)
L Output Voltage 1
VOL1
GND
-
V
IL= -0.3mA (INT)
L Output Voltage 2
VOL2
GND
-
10
0.2 *
VDD
0.2 *
VDD
V
IL= -3mA (SDA)
PR
300
-
1100
hPa
Prel
-
±0.12
-
hPa
Absolute Pressure Accuracy
Pabs
-
±1
-
hPa
Temperature Accuracy
Tabs
-
±2
-
°C
25°C to 85°C
Measurement Time
Tmeas
-
3
-
ms
OneShotMode(Single Measurement)
Current Consumption
Average Current Consumption
(data rate 1Hz)
Logic
Pressure characteristics
Pressure Detection Range
Relative Pressure Accuracy
(Note 1)
950hPa to 1050hPa
AVE_NUM=001
1000hPa
(Note 1) Target values
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2
I C bus Timing Chart (Unless Otherwise VDD=1.8V Ta=25°C)
SDA
t BUF
t SU;DAT
t HD;STA
SCL
t HD;STA
t LOW
t HD;DAT
Parameter
t HIGH
t SU;STA
t SU;STO
Symbol
Min
Typ
Max
Unit
2
fSCL
0
-
400
kHz
2
I C SCL Frequency
I C ‘L’ Period of SCL
tLOW
1.3
-
-
µs
2
tHIGH
0.6
-
-
µs
2
tSU;STA
0.6
-
-
µs
tHD;STA
0.6
-
-
µs
tSU;DAT
100
-
-
ns
I C ‘H’ Period of SCL
I C Setup Time for START Condition
2
I C Hold Time for (Repeated) START
Condition
2
I C Data Setup Time
2
tHD;DAT
0
-
-
µs
2
tSU;STO
0.6
-
-
µs
tBUF
1.3
-
-
µs
I C Data Hold Time
I C Setup Time For STOP Condition
Conditions
2
I C Bus Free Time Between STOP and
START Condition
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Register Map
Address Register name
RW
D7
D6
D5
D4
D3
D2
D1
D0
10h
ID
R
0
0
1
1
0
0
0
1
11h
RESET_CONTROL
W
SW_
RESET
INT_
RESET
0
0
0
0
0
0
12h
POWER_DOWN
RW
0
0
0
0
0
0
0
PWR_
DOWN
13h
RESET
RW
0
0
0
0
0
0
0
RSTB
14h
MODE_CONTROL
RW
0
T_AVE
15h
16h
17h
18h
INT_H_TH_MSB
(Upper 8bit)
INT_H_TH_LSB
(Lower 8bit)
INT_L_TH_MSB
(Upper 8bit)
INT_L_TH_LSB
(Lower 8bit)
AVE_NUM
RW
PDTH_H[15:8]
RW
PDTH_H[7:0]
RW
PDTH_L[15:8]
RW
PDTH_L[7:0]
INT_L_S
TATUS
INT_H_
EN
INT_L_E
N
INT_PU
_EN
INT_CONTROL
1Ah
Reserved
R
Reserved
1Bh
Reserved
R
Reserved
R
PRESS_OUT[15:8]
R
PRESS_OUT[7:0]
1Ch
1Dh
1Eh
PRESSURE_MSB
(Upper 8bit)
PRESSURE_LSB
(Lower 8bit)
PRESSURE_LSB
(Least 6bit)
RW
INT_H_
STATUS
19h
R
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MODE
0
INT_
MODE
INT_EN
0
0
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BM1383GLV
○ID(10h)
Field
Manufacturer ID
Part ID
Bit
7:4
3:0
TYPE
R
R
Description
0011
0001
default value 31h
○RESET_CONTROL(11h)
This register can be accessed only in the case of PWR_DOWN=1 and RSTB=1.
(In other case Write: Ignored, Read:FFh)
Field
Bit
TYPE Description
When reading “0” is read.
SW_RESET
7
W
0: Don’t execute software reset
1: execute software reset
When reading “0” is read.
INT_RESET
6
W
0: Keep INT terminal status.
1: INT terminal become inactive (high impedance)
Reserved
5:0
R
Write “000000”
default value 00h
○POWER_DOWN(12h)
Field
Bit
Reserved
7:1
PWR_DOWN
0
TYPE
R
RW
Description
Write “0”
0: power down
1: active
default value 00h
○RESET(13h)
Field
Reserved
RSTB
Bit
7:1
TYPE
R
0
RW
Description
Write “0”
0: Measurement control block is reset
1: Measurement control block is active.
default value 00h
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○MODE_CONTROL(14h)
This register can be accessed only in the case of PWR_DOWN=1 and RSTB=1.
(In other case Write: Ignored, Read: FFh)
Field
Bit
TYPE Description
Set the average number of measurement data
000: single
001: average of 2 times
010: average of 4 times
AVE_NUM
7:5
RW
011: average of 8 times
100: average of 16 times
101: average of 32 times
110: average of 64 times
Reserved
4
R
T_AVE
3
R/W
MODE
2:0
RW
Write “0”
Set the measurement number of temperature data
0: Temperature measurement is performed same times as average number.
1: Temperature measurement is performed once per 4 times pressure
measurements.
Set measurement mode. Please refer to the table below for the measurement
mode.
default value 00h
Measurement time and RMS noise against number of average (T_AVE=1)
Measurement
Number of measurement
RMS noise
AVE_NUM
time Tm
[hPa]
Pressure
Temperature
[ms]
000
1
1
3
0.090
001
2
1
5
0.063
010
4
1
10
0.045
011
8
2
19
0.032
100
16
4
37
0.023
101
32
8
74
0.016
110
64
16
147
0.011
When measurement time is over a set Continuous rate, measurement has priority.
RMS noise is calculated as standard deviation of 32 data points (1σ).
RMS noise is a reference value and it’s not the value with guarantee.
Measurement mode
MODE
Measurement mode
000
001
010
011
100
101
110
111
Stand by
One shot
Continuous(50ms)
Continuous(100ms)
Continuous(200ms)
Prohibition
Prohibition
Prohibition
Pressure and Temperature are measured at one rate
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BM1383GLV
Operation mode transition
Please refer to the below figure of operation mode transition.
Power down mode is the smallest current consumption mode due to circuit is OFF. Please set this mode when
reducing current consumption. Measurement is not available in this mode, so the measurement is performed after
switching mode to standby mode.
In Reset mode, LDO is active and Measurement control block is reset. Register is initialized in Reset mode.
Measurement command is acceptable when “1” is written in “RSTB”
There are 2 measurement modes. One shot mode and Continuous mode. They are switched from stand by mode.
Then, please set AVE_NUM and T_AVE register.
Please write “0x1400” when setting to standby mode again.
In one shot mode, a single measurement is performed when “001” is written in “MODE”. After the measurement is
performed, it is switched to standby mode automatically. When “0x1400” is written before end of measurement,
mode is switched to standby immediately but pressure value is not updated.
Transition to the other measurement mode during measurement in one shot mode is forbidden.
In Continuous mode, when “MODE” is “010”, ”011” or ”100”, measurement starts and it continues until “0x1400” is
written.Transition to the other measurement mode from Continuous mode is forbidden.
Power Down
LDO:OFF
Processing:OFF
0x1201
0x1200
Reset
LDO:ON
Processing:OFF
0x1301
0x1400
0x1300
Stand by
LDO:ON
Processing:ON
0x14XA or
0x14XB or
0x14XC
0x14X9
Measurement time
Tm later
or
0x1400
0x1400
One Shot
Continuous
Prohibition
0x14XA or
0x14XB or
0x14XC
→ Prohibition
0x14X9
→ Prohibition
0xYYZZ (send command)
YY:Address
ZZ:Data
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○INT_H_TH_MSB(15h)
This register can be accessed only in the case of PWR_DOWN=1 and RSTB=1.
(In other case Write: Ignored, Read: FFh)
Field
Bit
TYPE Description
PDTH_H[15:8]
7:0
RW
The upper part of the high threshold value for pressure interrupt generation.
default value FFh
Threshold value of intrerrupt is pressure value. Integral part:11bit, Decimal part: 5bit
(Example) In case of setting 1000.5hPa.
5
Threshold value = 1000.5×2 = 32016 = 0x7D10
○INT_H_TH_LSB(16h)
This register can be accessed only in the case of PWR_DOWN=1 and RSTB=1.
(In other case Write: Ignored, Read: FFh)
Field
Bit
TYPE Description
PDTH_H[7:0]
7:0
RW
The lower part of the high threshold value for pressure interrupt generation.
default value FFh
○INT_L_TH_MSB(17h)
This register can be accessed only in the case of PWR_DOWN=1 and RSTB=1.
(In other case Write: Ignored, Read: FFh)
Field
Bit
TYPE Description
PDTH_L[15:8]
7:0
RW
The upper part of the low threshold value for pressure interrupt generation
default value 00h
○INT_L_TH_LSB(18h)
This register can be accessed only in the case of PWR_DOWN=1 and RSTB=1.
(In other case Write: Ignored, Read: FFh)
Field
Bit
TYPE Description
PDTH_L[7:0]
7:0
RW
The lower part of the low threshold value for pressure interrupt generation
default value 00h
○INT_CONTROL(19h)
This register can be accessed only in the case of PWR_DOWN=1 and RSTB=1.
(In other case Write: Ignored, Read: FFh)
Field
Bit
TYPE Description
Setting of INT_MODE is valid for status register. Even if INT_EN is “0”,
setting of INT_MODE is asserted.
INT_H_STATUS
7
R
0: Measurement data is not over ‘H’ threshold.
1: Measurement data is over ‘H’ threshold.
Setting of INT_MODE is valid for status register. Even if INT_EN is “0”,
setting of INT_MODE is asserted.
INT_L_STATUS
6
R
0: Measurement data is not below ‘L’ threshold.
1: Measurement data is below ‘L’ threshold.
0: High threshold(PDTH_H[15:0]) inactive Disable
INT_H_EN
5
RW
1: High threshold(PDTH_H[15:0]) inactive Enable
0: Low threshold(PDTH_L[15:0]) inactive Disable
INT_L_EN
4
RW
1: Low threshold(PDTH_L[15:0]) inactive Enable
0: enable Pull-up resister of INT terminal
INT_PU_EN
3
R/W
1: disable Pull-up resister of INT terminal
Reserved
2
R
Write 0
0: INT terminal is latched until interrupt is cleared (latch mode).
INT_MODE
1
RW
1: INT terminal is updated after each measurement (unlatch mode)
0: disable interrupt
INT_EN
0
RW
1: enable interrupt
default value 00h
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BM1383GLV
○Reserved (1Ah)
This register can be accessed only in the case of PWR_DOWN=1 and RSTB=1. (In other case Read: FFh)
Field
Bit
TYPE Description
Reserved
7:0
R
Reserved
default value 00h
○Reserved (1Bh)
This register can be accessed only in the case of PWR_DOWN=1 and RSTB=1.
(In other case Write: Ignored, Read: FFh)
Field
Bit
TYPE Description
Reserved
7:0
R
Reserved
default value 00h
○PRESSURE_MSB(1Ch)
This register can be accessed only in the case of PWR_DOWN=1 and RSTB=1. (In other case Read: FFh)
Field
Bit
TYPE Description
The upper part of pressure data
PRESS_OUT[15:8]
7:0
R
By setting “1” to “SW_RESET” the register value is reset.
default value 00h
○PRESSURE_LSB(1Dh)
This register can be accessed only in the case of PWR_DOWN=1 and RSTB=1. (In other case Read: FFh)
Field
Bit
TYPE Description
The lower part of pressure data
PRESS_OUT[7:0]
7:0
R
By setting “1” to “SW_RESET” the register value is reset.
default value 00h
○PRESSURE_LSB(Least 6bit) ( 1Eh )
This register can be accessed only in the case of PWR_DOWN=1 and RSTB=1. (In other case Read: FFh)
Field
Bit
TYPE Description
PRESS_OUT_XL
Pressure data output (decimal extension 6bit)
7:2
R
[5:0]
By setting “1” to “SW_RESET” the register value is reset.
Reserved
1:0
R
“00”
default value 00h
PRESS_OUT[15:5]
PRESS_OUT[4:0], PRESS_OUT_XL[5:0]
: integer part of pressure value(11bit)
: decimal part of pressure value(11bit)
Conversion to pressure value is like below.
Pressure value[hPa] = { PRESS_OUT[15:8], PRESS_OUT[7:0], PRESS_OUT_XL[5:0] } / 2048
Reading data of one measurement should be done continuously (burst read).
If reading data of one measurement is done individualy, data is updated at the timming of measurement completion.
And data might be mixed up with the data of different measurement.
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2
I C bus communication
1. Slave address : “1011101”
2. Write format
(1) Case of indicating only register address
ST
(2)
W
0
Slave Address
ACK
Indicate register address
ACK
SP
Case of writing data register after indicating register address
ST
W
0
Slave Address
Data specified at register
address field
ACK
ACK ・・・・・・ ACK
Indicate register address
Data specified at register
address field + N
ACK
ACK
SP
3. Read format
(1) Case of reading data after indicating register address (Master issues restart condition)
ST
ST
W
0
Slave Address
R
1
Slave Address
Data specified at register
address field + 1
ACK
ACK
ACK
・・・・・・ ACK
Indicate register address
ACK
Data specified at register
address field
ACK
Data specified at register
address field + N
NACK
SP
(2) Case of reading data
ST
R
1
Slave Address
Data specified at register
address field + 1
ACK
ACK
・・・・・・ ACK
from master to slave
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Data specified at register
address field
Data specified at register
address field + N
ACK
NACK
SP
from slave to master
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Interrupt function
Interrupt function compares measured pressure value and ‘H’ threshold register (PDTH_H[15:0]) and/or ‘L’ threshold
register (PDTH_L[15:0]). If the measured pressure value exceeds 'H' threshold register value or the measured pressure
value falls below 'L' threshold register value, interrupt occurs. The interrupt of 'H' threshold and 'L' threshold can be
individually set enable. The below figure shows the case of 'H' and ‘L’ threshold enable.
There are two kinds of the interrupt function, one is a latch mode (INT_MODE=0), and another is unlatch mode
(INT_MODE=1).
The latch mode keeps the state of INT terminal until interrupt is cleared, once interrupt occurs.
The unlatch mode judges the measured pressure data and the threshold register at each measurement.
When disabling interrupt function (DREN=0). Please do it after clearing interrupt.
single
measurement
clear
interrupt
clear
interrupt
clear
interrupt
clear
interurpt
Pressure Data
PDTH_H[15:0]
PDTH_L[15:0]
time
[INT terminal]
latch mode
unlatch mode
INT terminal is L at state of interrupt, and H by built-in pull-up resister at state of non-interrupt.
When INT terminal is not used, built-in pull-up resister should be ON (INT_PU_EN=0) and the terminal should be open.
VDD
VDD
INT_PU_EN
INT
INT Output
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Control sequence
1. Power supply start-up sequence
2
Please do the command control by I C after power is supplied.
VDD
1.7V
1.3V
0.4V
> Tris
> 0.1ms
I2C
command
Write : 0x1201
command
Write : 0x1301
command
> 1ms
Tris
[μs]
40
55
65
Conditions
-25 to 85℃
-35 to 85℃
-40 to 85℃
2. Power supply end sequence
1.7V
VDD
0.4V
> 0ms
I2C
command
Write : 0x1300
> 1ms
command
Write : 0x1200
> 0ms
3.PWR_DOWN control
When removing PowerDown mode(PWR_DOWN=1) after setting to PowerDown mode(PWR_DOWN=0), please keep
PoweDown state more than 1S like below figure.
I2C
command
Write : 0x1200
command
Write : 0x1201
> 1s
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4. Starting sequence
power supply
wait for more
than 0.1ms
POWER_DOWN setting
Write : 0x1201
: release Power down
wait for more
than 1ms
RESET setting
Write : 0x1301
: release Reset mode
Completion of
starting sequence
5. Measurement sequence: One Shot Mode
Starting sequence
yes
Enable INT?
no
INT setting
Write : 0x1500, 0x1600, 0x1921
H
:
MODE_CONTROL setting
Write : 0x14X9
MODE_CONTROL setting
Write : 0x14X9
INT terminal
wait for the end of
measurement
L
INT terminal is used as Information for end
of measurement
to set INT H threshold registers and INT
control register.
: measurement mode setting
no
: wait interrupt(INT='L') or measurement end
yes
read INT_CONTROL
Read : 0x19
: check interrupt factor
clear interrupt
Write : 0x1140
:
read PRESSURE
Read : 0x1C~0x1E
clear interrupt
INT terminal is set to 'H' by writing.
: read Pressure data
Measurement
complestion
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6. Measurement sequence: Continuous Mode (50ms/100ms/200ms)
Starting sequence
yes
Enable INT?
no
INT setting
Write : 0x15XX~0x19XX
:
MODE_CONTROL setting
Write:0x14XA or 0x14XB or 0x14XC
'H'
MODE_CONTROL setting
Write:0x14XA or 0x14XB or 0x14XC
wait for the end of
measurement
INT terminal
'L'
no
set INT H/L threshold registers
and INT control register
: measurement mode setting
: wait interrupt(INT='L') or measurement end
yes
read INT_CONTROL
Read : 0x19
: check interrupt factor
clear interrupt
Write : 0x1140
:
read PRESSURE
Read : 0x1C~0x1E
yes
clear interrupt
INT terminal is set to 'H' by writing.
: read Pressure data
measurement
stop?
: End judgement of Continuous mode.
no
yes
Enable INT?
no
MODE_CONTROL setting
Write : 0x1400
: shift to Stand-by mode.
Measurement
complestion
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7. Ending sequence
Measurement
complestion
RESET setting
Write : 0x1300
: Reset
POWER_DOWN setting
Write : 0x1200
: power down
VDD OFF
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Application Example
TOUT
BM1383GLV
TIN
LDO
Memory
DREG
VDD
0.1µF
1.0µF
VSS
Pressure Sensor
MUX
ADC
SDA
Signal
Processing
I2 C
SCL
INT
Temperature
Sensor
HOST
NC1
NC0
Clock
TEST1
TEST0
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I/O equivalent circuit
Pin name
Equivalent Circuit Diagram
SCL
VDD
Pin name
Equivalent Circuit Diagram
SDA
VDD
VDD
INT
VDD
TIN
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DREG
TOUT
TEST0
TEST1
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins
when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the
input pins have voltages within the values specified in the electrical characteristics of this IC.
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Absolute Maximum Ratings
Operate the IC such that the output voltage, output current, and power dissipation are all within the Absolute
Maximum Ratings.
15. Disturbance light
In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due
to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip
from being exposed to light.
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Ordering Information
B
M
1
3
8
3
Part Number
G
L
V
Package
GLV: CLGA12V025M
-
Z
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
CLGA12V025M
(TOP VIEW)
1 PIN MARK
Part Number Marking
B
M
1
LOT Number
3
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Physical Dimension, Tape and Reel Information
Package Name
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BM1383GLV
Revision History
Date
Revision
29.Jan.2015
001
3.Apr.2015
002
15.May.2015
003
5.Jun.2015
004
Changes
New Release
P9 Modify notice of RMS noise
P10 Modify Operation mode transition
P1 Modify Typical Application Circuit
P4 Modify Block Diagram
P5 Modify Electrical Characteristics
P7 Modify Register Map
P9 Modify MODE_CONTROL
P10 Modify Operation mode transition
P12 Modify Reading data
Delete TEMPERATURE
P14 Modify Interrupt function
P15 Modify Control sequence
P19 Modify Application Example
P5 Modify Absolute Maximum Ratings
P16,17 Measurement sequence
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
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product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
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Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
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Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
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All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
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3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
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manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
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Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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