Hall IC Series Omnipolar Detection Hall ICs (Polarity detection for both S and N features dual outputs) No.10045EDT01 BU52004GUL, BU52014HFV ●Description The BU52004GUL and BU52014HFV are bipolar Hall ICs incorporating a polarity determination circuit that enables operation (output) on both the S- and N-poles, with the polarity judgment based on the output processing configuration. These Hall IC products can be in with movie, mobile phone and other applications involving crystal panels to detect the (front-back) location or determine the rotational direction of the panel. ●Features 1) Omnipolar detection (polarity detection for both S and N features dual outputs) 2) Micropower operation (small current using intermittent operation method) 3) Ultra-compact CSP4 package(BU52004GUL) 4) Small outline package (BU52014HFV) 5) Line up of supply voltage For 1.8V Power supply voltage (BU52014HFV) For 3.0V Power supply voltage (BU52004GUL) 6) Polarity judgment and output on both poles (OUT1: S-pole output; OUT2: N-pole output) 7) High ESD resistance 8kV(HBM) ●Applications Mobile phones, notebook computers, digital video camera, digital still camera, etc. ●Product Lineup Product name BU52004GUL BU52014HFV Supply voltage (V) 2.40～3.30 1.65～3.30 Operate point (mT) +/-3.7 +/-3.0 ※ ※ Hysteresis (mT) Period (ms) 0.8 0.9 50 50 Supply current (AVG. ) (μA) 8.0 5.0 Output type Package CMOS CMOS VCSP50L1 HVSOF5 ※Plus is expressed on the S-pole; minus on the N-pole ●Absolute Maximum Ratings BU52004GUL (Ta=25℃) PARAMETERS Power Supply Voltage Output Current Power Dissipation Operating Temperature Range Storage Temperature Range SYMBOL VDD IOUT Pd Topr Tstg LIMIT -0.1 ~ +4.5※1 ±1 420※2 -40 ~ +85 -40 ~ +125 UNIT V mA mW ℃ ℃ SYMBOL VDD IOUT Pd Topr Tstg LIMIT -0.1 ~ +4.5※3 ±0.5 536※4 -40 ~ +85 -40 ~ +125 UNIT V mA mW ℃ ℃ ※1. Not to exceed Pd ※2. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃ (mounted on 50mm×58mm Glass-epoxy PCB) BU52014 HFV (Ta=25℃) PARAMETERS Power Supply Voltage Output Current Power Dissipation Operating Temperature Range Storage Temperature Range ※3. Not to exceed Pd ※4. Reduced by 5.36mW for each increase in Ta of 1℃ over 25℃ (mounted on 70mm×70mm×1.6mm Glass-epoxy PCB) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/11 2010.01 - Rev.D Technical Note BU52004GUL, BU52014HFV ●Magnetic, Electrical Characteristics BU52004GUL (Unless otherwise specified, VDD＝3.0V, Ta＝25℃) LIMIT PARAMETERS SYMBOL MIN TYP Power Supply Voltage VDD 2.4 3.0 MAX 3.3 UNIT V BopS - 3.7 5.5 BopN -5.5 -3.7 - BrpS 0.8 2.9 - BrpN - -2.9 -0.8 Period BhysS BhysN Tp 0.8 0.8 50 100 Output High Voltage VOH VDD -0.4 - - V Output Low Voltage VOL - - 0.4 V IDD(AVG) IDD(EN) IDD(DIS) - 8 4.7 3.8 12 - μA mA μA mT Operate Point mT Release Point Hysteresis Supply Current Supply Current During Startup Time Supply Current During Standby Time CONDITIONS OUTPUT：OUT1 (respond the south pole) OUTPUT：OUT2 (respond the north pole) OUTPUT：OUT1 (respond the south pole) OUTPUT：OUT2 (respond the north pole) mT ms ※5 BrpN<B<BrpS IOUT =-1.0mA ※5 B<BopN, BopS<B IOUT =+1.0mA Average During Startup Time Value During Standby Time Value ※5. B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. BU52014HFV (Unless otherwise specified, VDD＝1.80V, Ta＝25℃) LIMIT PARAMETERS SYMBOL MIN TYP Power Supply Voltage VDD 1.65 1.80 MAX 3.30 UNIT V BopS - 3.0 5.0 BopN -5.0 -3.0 - BrpS 0.6 2.1 - BrpN - -2.1 -0.6 Period BhysS BhysN Tp 0.9 0.9 50 100 Output High Voltage VOH VDD -0.2 - - V Output Low Voltage VOL - - 0.2 V Supply Current 1 IDD1(AVG) - 5 8 μA Supply Current During Startup Time 1 IDD1(EN) - 2.8 - mA Supply Current During Standby Time 1 IDD1(DIS) - 1.8 - μA Supply Current 2 IDD2(AVG) - 8 12 μA Supply Current During Startup Time 2 IDD2(EN) - 4.5 - mA Supply Current During Standby Time 2 IDD2(DIS) - 4.0 - μA mT Operate Point Release Point Hysteresis CONDITIONS mT OUTPUT：OUT1 (respond the south pole) OUTPUT：OUT2 (respond the north pole) OUTPUT：OUT1 (respond the south pole) OUTPUT：OUT2 (respond the north pole) mT ms 6 ※ BrpN<B<BrpS IOUT =-0.5mA ※6 B<BopN, BopS<B IOUT =+0.5mA VDD=1.8V, Average VDD=1.8V, During Startup Time Value VDD=1.8V, During Standby Time Value VDD=2.7V, Average VDD=2.7V, During Startup Time Value VDD=2.7V, During Standby Time Value ※6. B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/11 2010.01 - Rev.D Technical Note BU52004GUL, BU52014HFV ●Figure of measurement circuit Tp Bop/Brp VDD VDD VDD VDD OUT 100μF GND Oscilloscope Fig.2 Bop,Brp measurement circuit Tp measurement circuit Product Name VDD IOUT BU52004GUL 1.0mA BU52014HFV 0.5mA OUT 100μF GND Fig.3 GND The period is monitored by Oscilloscope. VOH VDD OUT V Bop and Brp are measured with applying the magnetic field from the outside. Fig.1 200Ω IOUT V VOH measurement circuit VOL Product Name VDD VDD IOUT BU52004GUL 1.0mA BU52014HFV 0.5mA OUT 100μF GND V IOUT VOL measurement circuit Fig.4 IDD A 2200μF VDD VDD OUT GND Fig.5 IDD measurement circuit www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 3/11 2010.01 - Rev.D Technical Note BU52004GUL, BU52014HFV ●Technical (Reference) Data BU52004GUL (VDD=2.4V～3.3V type) 8.0 Bop S 2.0 Brp S 0.0 -2.0 Brp N -4.0 Bop N -6.0 -8.0 -60 -40 -20 0 Ta = 25°C 2.0 Brp S 0.0 -2.0 Brp N -4.0 Bop N -6.0 -8.0 2.0 20 40 60 80 100 2.4 Fig.6 Bop,Brp – Ambient temperature Ta = 25°C PERIOD [ms] 80 70 60 50 40 30 20 10 0 2.4 2.8 3.2 SUPPLLY VOLTAGE[V] 3.2 3.6 VDD=3.0V -60 -40 -20 0 Fig.8 TP– Ambient temperature 20.0 20.0 18.0 VDD=3.0V 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 -60 -40 -20 0 3.6 20 40 60 80 100 AMBIENT TEMPERATURE [℃] Fig.7 Bop,Brp – Supply voltage AVERAGE SUPPLY CURRENT [µA] 100 2.0 2.8 100 95 90 85 80 75 70 65 60 55 50 45 40 SUPPLY VOLTAGE ［V］ AMBIENT TEMPERATURE [℃] 90 Bop S 4.0 PERIOD [ms] VDD=3.0V 4.0 6.0 AVERAGE SUPPLY CURRENT [µA] 6.0 MAGNETIC FLUX DENSITY [mT] MAGNETIC FLUX DENSITY [mT] 8.0 18.0 16.0 Ta = 25°C 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 20 40 60 80 100 2.0 2.8 3.2 3.6 Fig.11 IDD – Supply voltage Fig.10 IDD – Ambient temperature Fig.9 TP – Supply voltage 2.4 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [℃] BU52014HFV (VDD=1.65V～3.3V type) 8.0 Bop S 4.0 2.0 Brp S 0.0 Brp N -2.0 -4.0 Bop N -6.0 -8.0 -60 -40 -20 0 20 40 60 80 100 2.0 Brp N -2.0 -4.0 90 Ta = 25°C PERIOD [ms] 80 70 60 50 40 30 20 10 0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 SUPPLY VOLTAGE [V] Fig.15 TP– Supply voltage www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. VDD=1.8V 80 Brp S 0.0 Bop N 70 60 50 40 30 20 -6.0 10 -8.0 0 1.4 1.8 2.2 2.6 3.0 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] 3.4 SUPPLY VOLTAGE ［V］ Fig.13 AVERAGE SUPPLY CURRENT [µA] 100 Bop S 4.0 AMBIENT TEMPERATURE [℃] Fig.12 Bop,Brp – Ambient temperature 90 Ta = 25°C PERIOD [ms] VDD=1.8V 100 6.0 20.0 18.0 16.0 Fig.14 TP– Ambient temperature Bop,Brp – Supply voltage AVERAGE SUPPLY CURRENT [µA] 6.0 MAGNETIC FLUX DENSITY [mT] MAGNETIC FLUX DENSITY [mT] 8.0 VDD=1.8V 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] Fig.16 IDD – Ambient temperature 4/11 20.0 18.0 Ta = 25°C 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 1.4 1.8 2.2 2.6 3.0 3.4 SUPPLY VOLTAGE[V] Fig.17 IDD – Supply voltage 2010.01 - Rev.D Technical Note BU52004GUL, BU52014HFV ●Block Diagram BU52004GUL VDD A1 0.1µF Adjust the bypass capacitor value as TIMING LOGIC necessary, according to LATCH voltage noise conditions, etc. HALL connection to the PC, with no external pull-up GND resistor required. VDD LATCH × The CMOS output terminals enable direct SAMPLE & HOLD DYNAMIC OFFSET CANCELLATION ELEMENT B1 OUT1 B2 OUT2 A2 GND Fig.18 PIN No. PIN NAME FUNCTION A1 VDD POWER SUPPLY A2 GND GROUND B1 OUT1 OUTPUT( respond the south pole) B2 OUT2 OUTPUT( respond the north pole) A1 COMMENT A2 B1 B2 Surface A2 A1 B2 B1 Reverse BU52014HFV VDD 4 0.1μF LATCH TIMING LOGIC GND The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required. VDD LATCH × SAMPLE & HOLD ELEMENT DYNAMIC OFFSET CANCELLATION HALL Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. 5 OUT1 1 OUT2 2 GND Fig.19 PIN No. PIN NAME FUNCTION 1 OUT2 OUTPUT ( respond the north pole) 2 GND GROUND 3 N.C. 4 VDD POWER SUPPLY 5 OUT1 OUTPUT ( respond the south pole) COMMENT 5 4 4 1 2 3 Surface 3 5 OPEN or Short to GND. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 5/11 2 1 Reverse 2010.01 - Rev.D Technical Note BU52004GUL, BU52014HFV ● Description of Operations Micropower Operation (Small current using intermittent action) The dual output bipolar detection Hall IC adopts an intermittent operation method to save energy. At startup, the Hall elements, amp, comparator and other detection circuits power ON and magnetic detection begins. During standby, the detection circuits power OFF, thereby reducing current consumption. The detection results are held while standby is active, and then output. IDD Period 50ms Startup time Standby t Fig.20 Reference period: 50ms (MAX100ms) Reference startup time: 48μs (Offset Cancelation) VDD I B× ＋ Hall Voltage － GND Fig.21 The Hall elements form an equivalent Wheatstone (resistor) bridge circuit. Offset voltage may be generated by a differential in this bridge resistance, or can arise from changes in resistance due to package or bonding stress. A dynamic offset cancellation circuit is employed to cancel this offset voltage. When Hall elements are connected as shown in Fig. 21 and a magnetic field is applied perpendicular to the Hall elements, voltage is generated at the mid-point terminal of the bridge. This is known as Hall voltage. Dynamic cancellation switches the wiring (shown in the figure) to redirect the current flow to a 90˚ angle from its original path, and thereby cancels the Hall voltage. The magnetic signal (only) is maintained in the sample/hold circuit during the offset cancellation process and then released. (Magnetic Field Detection Mechanism) S N S S S N N Flux direction Flux direction Fig.22 The Hall IC cannot detect magnetic fields that run horizontal to the package top layer. Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 6/11 2010.01 - Rev.D Technical Note BU52004GUL, BU52014HFV OUT1 N S S N OUT 1[V] N S Flux Flux High High High Low B Brp S N-Pole 0 Magnetic flux density [mT] Fig.23 S-Pole Detection Bop S S-Pole The OUT1 pin detects and outputs for the S-pole only. Since it is unipolar, it does not recognize the N-pole. OUT2 N S N S S N OUT 2[V] Flux Flux High High High Low B Bop N Brp N N-Pole 0 Magnetic density [mT] S-Pole Fig.24 N-Pole Detection The OUT2 pin detects and outputs for the N-pole only. Since it is unipolar, it does not recognize the S-pole. The dual output Omnipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output mode, the distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.) This detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 7/11 2010.01 - Rev.D Technical Note BU52004GUL, BU52014HFV ●Intermittent Operation at Power ON Power ON VDD Startup time Standby time Standby time Startup time Supply current (Intermittent action) Indefinite OUT High (No magnetic field present) Indefinite OUT (Magnetic field present) Low Fig.25 The dual output Omnipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as shown in Fig. 25. It outputs to the appropriate terminal based on the detection result and maintains the output condition during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage. ●Magnet Selection Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume than ferrite, thereby enabling the highest degree of miniaturization, Thus, neodymium is best suited for small equipment applications. Fig. 26 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet (1mm, 2mm, and 3mm thick) and magnetic flux density. Fig. 27 shows Hall IC detection distance – a good guide for determining the proper size and detection distance of the magnet. Based on the BU52014HFV operating point max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and 10.4mm, respectively. To increase the magnet’s detection distance, either increase its thickness or sectional area. 10 Magnetic flux density[mT] 9 t=3mm 8 7 t=1mm t=2mm 6 5 4 3 2 1 7.6mm 0 0 2 4 6 9.2mm 10.4mm 8 10 12 14 16 18 20 Distance between magnet and Hall IC [mm] Fig.26 X t Y X=Y=4mm t=1mm,2mm,3mm Magnet size Magnet material: NEOMAX-44H (material) Maker: NEOMAX CO.,LTD. Magnet t L: Variable …Flux density measuring point Fig.27 Magnet Dimensions and Flux Density Measuring Point www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/11 2010.01 - Rev.D Technical Note BU52004GUL, BU52014HFV ●Position of the Hall Effect IC(Reference) HVSOF5 VCSP50L1 0.55 0.6 0.55 0.8 0.35 0.2 (UNIT：mm) ●Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition) VCSP50L1 HVSOF5 (UNIT：mm) Strings e b3 SD SE Size(Typ) 0.50 0.25 0.25 0.25 ●Terminal Equivalent Circuit Diagram OUT1, OUT2 VDD Because they are configured for CMOS (inverter) output, the output pins require no external resistance and allow direct connection to the PC. This, in turn, enables reduction of the current that would otherwise flow to the external resistor during magnetic field detection, and supports overall low current (micropower) operation. GND Fig.28 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 9/11 2010.01 - Rev.D Technical Note BU52004GUL, BU52014HFV ●Operation Notes 1) Absolute maximum ratings Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in excess of absolute rating limits. 2) GND voltage Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower than the potential of all other pins. 3) Thermal design Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted together, or if shorts occur between the output pin and supply pin or GND. 5) Positioning components in proximity to the Hall IC and magnet Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design. Magnet Flux Slide d Hall IC L Fig.29 A B S Flux N Fig.30 Magnetic fux density[mT] 6) Slide-by position sensing Fig.29 depicts the slide-by configuration employed for position sensing. Note that when the gap (d) between the magnet and the Hall IC is narrowed, the reverse magnetic field generated by the magnet can cause the IC to malfunction. As seen in Fig.30, the magnetic field runs in opposite directions at Point A and Point B. Since the dual output Omnipolar detection Hall IC can detect the S-pole at Point A and the N-pole at Point B, it can wind up switching output ON as the magnet slides by in the process of position detection. Fig. 31 plots magnetic flux density during the magnet slide-by. Although a reverse magnetic field was generated in the process, the magnetic flux density decreased compared with the center of the magnet. This demonstrates that slightly widening the gap (d) between the magnet and Hall IC reduces the reverse magnetic field and prevents malfunctions. 10 8 6 4 2 0 -2 -4 -6 -8 -10 Reverse 0 1 2 3 4 5 6 7 8 9 10 Horizontal distance from the magnet [mm] Fig.31 7) Operation in strong electromagnetic fields Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause the IC to malfunction. 8) Common impedance Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example, employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or capacitor. 9) GND wiring pattern When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components. 10) Exposure to strong light Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and fluorescent light sources was shown to have no significant effect on the IC. 11) Power source design Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under examine adequate evaluations when designing the power source. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/11 2010.01 - Rev.D Technical Note BU52004GUL, BU52014HFV ●Ordering part number B U 5 Part No. 2 0 0 4 G Part No. 52004 52014 U L Package GUL: VCSP50L1 HFV: HVSOF5 - E 2 Packaging and forming specification E2: Embossed tape and reel (VSCP50L1) TR: Embossed tape and reel (HVSOF5) VCSP50L1(BU52004GUL) 1.10±0.1 <Tape and Reel information> 1.10±0.1 Tape Embossed carrier tape Quantity 3000pcs Direction of feed 0.55MAX 0.10±0.05 1PIN MARK E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) S A 0.30±0.1 2 0.50 0.08 S 4-φ0.25±0.05 0.05 A B B B A 1 0.30±0.1 Direction of feed 1pin 0.50 Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. HVSOF5 1.0±0.05 3000pcs 4 4 (0.91) 5 0.2MAX Embossed carrier tape Quantity (0.05) Tape (0.3) 5 (0.41) 1.6±0.05 (0.8) Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 3 2 1 1 2 3 1pin 0.13±0.05 S +0.03 0.02 –0.02 0.6MAX 1.2±0.05 (MAX 1.28 include BURR) <Tape and Reel information> 1.6±0.05 0.1 S 0.5 0.22±0.05 0.08 Direction of feed M Reel (Unit : mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 11/11 ∗ Order quantity needs to be multiple of the minimum quantity. 2010.01 - Rev.D Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). 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The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. 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