CDSL4448-G

Small Signal Switching Diodes
CDSL4148-G/4448-G
Reverse Voltage: 75 Volts
Power Dissipation: 500 mW
RoHS Device
Features
MiniMELF (SOD-80)
-Design for mounting on small surface.
-High speed switching.
-High mounting capability, strong surge
withstand, high reliability.
0.020(0.50)
0.012(0.30)
-Also available in other standard case:
CDSF4148/4448 - SOD323F(1005) size
CDSU4148/4448 - SOD523F(0603) size
0.063(1.60)
0.055(1.40)
Mechanical data
0.146(3.70)
0.134(3.40)
-Case: MiniMELF, glass case.
-Terminals: solderable per MIL-STD-750,
method 2026.
-Polarity: indicated by cathode band.
-Approx. weight: 0.05 grams
Dimensions in inches and (millimeter)
Maximum Ratings and Electrical Characteristics
(at Ta=25°C unless otherwise noted)
Parameter
Repetitive peak reverse voltage
Symbol
Conditions
CDSL4148-G
CDSL4448-G
Units
VRRM
75
V
Reverse voltage
VR
75
V
Forward current
IFM
Averaged forward current
IO
Peak surge forward current
IFSM
Power dissipation
PD
300
T=1.0 μS
@IF=5mA
@IF=10mA
@IF=100mA
500
mA
150
mA
2
A
500
mW
1
-
0.72
1
V
Maximum forward voltage
VF
Maximum reverse current
IR
Maximum reverse recovery time
Trr
IF=10mA, RL=50Ω, VR=6V
4
nS
Typical diode capacitance
CJ
VR=0V, f=1.0MHz
4
pF
Maximum junction temperature
TJ
175
°C
TSTG
-65 to +175
°C
Storage temperature
@VR=75V
2.5
@VR=25V
0.025
μA
REV:B
Page 1
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Comchip Technology CO., LTD.
Small Signal Switching Diodes
RATING AND CHARACTERISTIC CURVES (CDSL4148-G/4448-G)
Fig.1 - Forward Characteristics
Fig.2 - Reverse Characteristics
10μ
100
TA=150°C
TA=-40°C
TA=75°C
10
TA=25°C
100n
TA=75°C
10n
TA=25°C
1n
1
TA=-40°C
0.1n
0
0.5
1.0
1.5
20
0
40
80
60
Forward Voltage, (V)
Reverse Voltage, (V)
Fig.3 - Capacitance Between Terminals
Characteristics
Fig.4 - Power Derating Curve
2
100
600
Mounted on glass
epoxy PCBs
TJ=25°C
f=1MHz
Power Dissipation, (mW)
Capacitance Between Terminals, (pF)
TA=125°C
1μ
Reverse Current, (A)
Forward Current, (mA)
1000
1
500
400
300
200
100
0
0
0
10
20
30
40
50
0
25
50
75
100
125
150
175
Ambient Temperature, (°C)
Reverse Voltage, (V)
REV:B
Page 2
QW-B0012
Comchip Technology CO., LTD.
Small Signal Switching Diodes
Reel Taping Specification
d
P0
T
P1
E
Index hole
F
W
B
C
P
A
12
o
0
D2
D1 D
W1
Trailer
.......
.......
End
Device
.......
.......
Leader
.......
.......
10 pitches (min)
.......
.......
Start
10 pitches (min)
Direction of Feed
Mini-MELF
Mini-MELF
SYMBOL
A
B
C
d
D
(mm)
2.00 Max.
3.90 Max.
2.00 Max.
1.55 ± 0.10
178 ± 1
50.0 Min.
13.0 ± 0.20
(inch)
0.079 Max.
0.154 Max.
0.079 Max.
0.061 ± 0.004
7.008 ± 0.04
1.969 Min.
0.512 ± 0.008
SYMBOL
E
F
P
P0
P1
W
W1
(mm)
1.75 ± 0.10
3.50 ± 0.05
4.00 ± 0.10
4.00 ± 0.10
2.00 ± 0.05
8.00 ± 0.30
14.4 Max.
(inch)
0.069 ± 0.004
0.138 ± 0.002
0.157 ± 0.004
0.157 ± 0.004
0.079 ± 0.002
0.315 ± 0.012
0.567 Max.
D1
D2
REV:B
Page 3
QW-B0012
Comchip Technology CO., LTD.
Small Signal Switching Diodes
Suggested PAD Layout
Mini-MELF
SIZE
(mm)
(inch)
A
3.40
0.134
B
1.30
0.051
C
1.70
0.067
D
4.70
0.185
E
2.10
0.083
D
A
E
C
B
Standard Packaging
REEL PACK
Case Type
Mini-MELF
REEL
Reel Size
( pcs )
(inch)
2,500
7
REV:B
Page 4
QW-B0012
Comchip Technology CO., LTD.
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