CDST-19-G

SMD Switching Diodes
CDST-19-G/20-G
-
High Speed
RoHS Device
+
Features
SOT-23
- Fast switching diode.
- Surface mount package ideally for automatic
insertion.
- For general purpose switching applications.
- High conductance.
0.119 (3.00)
0.110 (2.80)
3
0.056 (1.40)
0.047 (1.20)
1
2
0.083 (2.10)
0.066 (1.70)
Mechanical data
0.006 (0.15)
0.003 (0.08)
- Case: SOT-23
0.041 (1.05)
0.035 (0.90)
- Terminals: Solder plated, solderable per
MIL-STD-750, Method 2026.
0.103 (2.60)
0.086 (2.20)
- Weight: 0.008 gram.
0.006 (0.15) max
0.020 (0.50)
0.012 (0.30)
0.007 (0.20) min
Circuit Diagram
3
Dimensions in inches and (millimeters)
1
2
Maximum Rating (at Ta=25°C unless otherwise noted)
Symbol
CDST-19-G
CDST-20-G
Unit
Non-Repetitive peak reverse voltage
VRM
100
150
V
DC blocking voltage
VR
100
150
V
Average rectified output current
IO
200
mA
Power dissipation
PD
250
mW
RθJA
500
TJ
150
O
-65 ~ +150
O
Parameter
Thermal resistance-Junction to ambient air
Junction temperature
Storage temperature range
TSTG
O
C/W
C
C
Electrical Characteristics (at TA=25°C unless otherwise noted)
Symbol
Parameter
Test Conditions
Min
Max
100
150
Unit
Reverse breakdown voltage
CDST-19-G
CDST-20-G
VBR
IR=100uA
Reverse leakage current
CDST-19-G
CDST-20-G
IR
VR=100V
VR=150V
0.1
UA
Forward voltage
VF
IF=100mA
IF=200mA
1
1.25
V
Junction capacitance
CJ
VR=0V, f=1MHZ
5
pF
Reverse recovery time
trr
IF=IR=30mA, Irr=0.1XIR
50
nS
V
Company reserves the right to improve product design , functions and reliability without notice.
REV:B
Page 1
QW-B0021
Comchip Technology CO., LTD.
SMD Switching Diodes
Characteristic Curves (CDST-19-G/20-G)
Fig.1 - Forward Characteristics
Fig.2 - Leakage Current vs
Junction Temperature
1000
100
O
IR, Leakage Current (uA)
IF, Forward Current (mA)
TJ=25 C
100
10
1
0.1
0.01
10
1
0.1
0.01
0
1
VF, Forward Voltage (V)
2
0
100
TJ, Junction Temperature (°C)
Company reserves the right to improve product design , functions and reliability without notice.
200
REV:B
Page 2
QW-B0021
Comchip Technology CO., LTD.
SMD Switching Diodes
Reel Taping Specification
P1
XXX
B
F
E
d
P0
12
o
0
D2
D1 D
W1
SOT-23
SOT-23
SYMBOL
A
B
C
d
D
D1
D2
(mm)
3.15 ± 0.10
2.77 ± 0.10
1.22 ± 0.10
1.50 + 0.10
178 ± 2.00
54.40 ± 1.00
13.00 ± 1.00
(inch)
0.124 ± 0.004
0.109 ± 0.004
0.048 ± 0.004
0.059 + 0.004
7.008 ± 0.079
2.142 ± 0.039
0.512 ± 0.039
SYMBOL
E
F
P
P0
P1
W
W1
(mm)
1.75 ± 0.10
3.50 ± 0.10
4.00 ± 0.10
4.00 ± 0.10
2.00 ± 0.10
8.00 + 0.30 /–0.10
12.30 ± 1.0
(inch)
0.069 ± 0.004
0.138 ± 0.004
0.157 ± 0.004
0.157 ± 0.004
0.079 ± 0.004 0.315 + 0.012 /–0.004 0.484 ± 0.039
Company reserves the right to improve product design , functions and reliability without notice.
REV:B
Page 3
QW-B0021
Comchip Technology CO., LTD.
SMD Switching Diodes
Marking Code
3
Part Number
Marking Code
CDST-19-G
JP
CDST-20-G
JR
XX
1
2
xx = Product type marking code
Suggested PAD Layout
E
SOT-23
SIZE
(mm)
(inch)
A
0.80
0.031
B
1.90
0.075
C
2.02
0.080
D
2.82
0.111
A
C
D
B
E
0.80
0.031
Standard Packaging
REEL PACK
Case Type
SOT-23
REEL
Reel Size
( pcs )
(inch)
3,000
7
Company reserves the right to improve product design , functions and reliability without notice.
REV:B
Page 4
QW-B0021
Comchip Technology CO., LTD.
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