CPDUR9V0LP-HF

Low Capacitance SMD ESD Protection Diode
CPDUR9V0LP-HF
RoHS Device
Halogen Free
Features
0603/SOD-523F
- Bi-directional ESD protection.
0.071(1.80)
0.063(1.60)
- Surface mount package.
- Low leakage current.
0.039(1.00)
0.031(0.80)
- High component density.
Mechanical data
0.033(0.85)
0.027(0.70)
- Case: 0603/SOD-523F standard package,
molded plastic.
0.020(0.50)
0.016(0.40)
- Terminals: Gold plated, solderable per
MIL-STD-750,method 2026.
- Marking Code: E9P
- Mounting position: Any.
0.030(0.75)
0.026(0.65)
- Weight: 0.003 grams(approx.).
Dimensions in inches and (millimeter)
Circuit Diagram
Electrical Characteristics (at TA=25°C unless otherwise noted)
Parameter
Conditions
Reverse stand-off voltage
Symbol
Min
Typ
VRWM
Max
Unit
9.0
V
14.4
V
Breakdown voltage
IR = 5mA
VBD
Leakage current
VR = 9V
IR
100
nA
Clamping voltage
IPP=0.1A , tp=8/20us
IPP=0.5A , tp=8/20us
VC
16
19
V
Peak pulse power
tp= 8/20
PPK
ESD capability
IEC 61000-4-2(air)
IEC 61000-4-2(contact)
ESD
Junction capacitance
VR = 0V, f =1MHz
Operation temperature range
Storage temperature range
9.6
8.5
W
15
8
pF
1.0
CT
kV
Tj
-55
150
°C
TSTG
-55
150
°C
Company reserves the right to improve product design , functions and reliability without notice.
REV:B
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Comchip Technology CO., LTD.
Low Capacitance SMD ESD Protection Diode
RATING AND CHARACTERISTIC CURVES (CPDUR9V0LP-HF)
Fig.2 - Power Rating Derating Curve
Fig.1 - 8/20us Peak Pulse Current Wave
Form Acc. IEC 61000-4-5
120%
Percentage Of Ipp
100%
Peak Valur Ipp
e-t
80%
60%
40%
Mounting on glass epoxy PCBs
100
Power Rating, (%)
Ta=25°C
120
Test Waveform
parameters
tf=8us
td=20us
td= t Ipp/2
80
60
40
20
20%
0
0%
0
5
10
15
20
25
0
30
Capacitance Between Terminals, (PF)
Clamping Voltage,VC (V)
21
18
15
12
8/20us waveform
9
0.4
0.6
0.8
75
100
125
150
Fig.4 - Capacitance Between
Terminals Characteristics
Fig.3 - Clamping Voltage Vs.
Peak Pulse Current
0.2
50
Ambient Temperature, ( °C )
Time, (us)
0
25
1.0
1.2
2.0
f=1MHz
TA=25°C
1.8
1.6
1.4
1.2
1.0
0.8
0
3
6
9
Reverse Voltage, (V)
Peak Pulse Current,IPP (A)
Company reserves the right to improve product design , functions and reliability without notice.
REV:B
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Comchip Technology CO., LTD.
SMD ESD Protection Diode
Reel Taping Specification
d
P0
P1
T
E
Index hole
F
W
B
P
C
A
12
o
0
D2
D1 D
W1
Trailer
Device
.......
.......
End
.......
.......
Leader
.......
.......
.......
.......
10 pitches (min)
Start
10 pitches (min)
Direction of Feed
0603
(SOD-523)
0603
(SOD-523)
SYMBOL
A
B
C
d
D
D1
D2
(mm)
1.00 ± 0.10
1.85 ± 0.10
1.00 ± 0.10
1.55 ± 0.05
178 ± 1.00
60.0 MIN.
13.0 ± 0.20
(inch)
0.039 ± 0.004
0.073 ± 0.004
0.039 ± 0.004
0.061 ± 0.002
7.008 ± 0.04
2.362 MIN.
0.512 ± 0.008
SYMBOL
E
F
P
P0
P1
T
W
W1
(mm)
1.75 ± 0.10
3.50 ± 0.05
4.00 ± 0.10
4.00 ± 0.10
2.00 ± 0.05
0.23 ± 0.05
8.00 ± 0.20
13.50 MAX.
(inch)
0.069 ± 0.004
0.138 ± 0.002
0.157 ± 0.004
0.157 ± 0.004
0.079 ± 0.002
0.009 ± 0.002
0.315 ± 0.008
0.531 MAX.
Company reserves the right to improve product design , functions and reliability without notice.
REV:B
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Comchip Technology CO., LTD.
SMD ESD Protection Diode
Marking Code
Part Number
Marking Code
CPDUR9V0LP-HF
E9P
E9P
Suggested PAD Layout
0603/SOD-523F
SIZE
(mm)
(inch)
A
1.25
0.049
B
0.60
0.024
C
1.00
0.039
D
1.85
0.073
E
0.65
0.026
D
A
E
C
B
Standard Packaging
Case Type
0603/SOD-523F
Qty Per Reel
Reel Size
(Pcs)
(inch)
4,000
7
Company reserves the right to improve product design , functions and reliability without notice.
REV:B
QW-G7061
Page 4
Comchip Technology CO., LTD.
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