SMD ESD Protection Diode CPDV3-5V0U-HF RoHS Device Halogen Free Features SOT-323 -IEC61000-4-2 Level 4 ESD protection. 0.087(2.20) 0.079(2.00) -Surface mount package. 3 -High component density. 0.053(1.35) 0.045(1.15) Mechanical data 1 2 0.055(1.40) -Case: SOT-323 Standard package, molded plastic. 0.047(1.20) -Terminals: Solderable per MIL-STD-750, method 2026. 0.006(0.15) 0.003(0.08) 0.039(1.00) 0.096(2.45) 0.035(0.90) -Marking code: E5U 0.085(2.15) -Mounting position: Any. 0.004(0.10) 0.000(0.00) 0.016(0.40) -Weight: 0.0055 gram (approx.). 0.018(0.46) 0.010(0.26) 0.008(0.20) Circuit diagram Dimensions in inches and (millimeter) Maximum Rating and Electrical Characteristics (at TA=25°C unless otherwise noted) Parameter Diode breakdown voltage Symbol Conditions VBD IR = 1mA Leakage current IL VR = 3V Forward voltage VF IF =10mA Junction capacitance CT VR = 0V,f = 1MHz ESD capability ESD Min Typ Max Unit 6.1 V 0.1 60 1.0 uA 1.2 V 80 pF IEC 61000-4-2(air) 15 IEC 61000-4-2(contact) 8 IPP = 1A,TP=8/20us 8 IPP = 8A,TP=8/20us 10 kV Clamping voltage VC Peak pulse power PPP 80 W TJ 125 °C 150 °C Operation temperature Storage temperature TSTG -55 Company reserves the right to improve product design , functions and reliability without notice. V REV:B Page 1 QW-JP010 Comchip Technology CO., LTD. SMD ESD Protection Diode RATING AND CHARACTERISTIC CURVES (CPDV3-5V0U-HF) Fig. 1 - 8/20us Peak pulse current waveform acc. IEC 61000-4-5 120% 100% Peak Valur Ipp Mounting on glass epoxy PCBs 100 e-t 80% Percentage of Ipp 120 Test Waveform parameters tf=8us td=20us Power rating (%) Ta=25°C Fig. 2 - Power rating derating curve 60% 40% td= t Ipp/2 80 60 40 20 20% 0 0% 0 5 10 15 20 25 0 30 25 50 75 100 125 150 Ambient temperature , (°C) Time, (us) Fig. 3 - Clamping voltage vs. peak pulse current Fig. 4 - Capacitance between terminals characteristics Capacitance between terminals, (PF) 100 8/20us waveform Clamping voltage,VC, (V) 12 10 8 6 4 2 0 f=1MHz TA=25°C 80 60 40 20 0 0 2 4 6 8 0 Peak pulse current,IPP (A) 1 2 3 4 5 Reverse voltage, (V) Company reserves the right to improve product design , functions and reliability without notice. REV:B Page 2 QW-JP010 Comchip Technology CO., LTD. SMD ESD Protection Diode Reel Taping Specification P1 d T F E P0 W B 3 XXX 1 2 C A P 12 o 0 D2 D1 D W1 SOT-323 SOT-323 SYMBOL A B C d D D1 D2 (mm) 2.25 ± 0.05 2.55 ± 0.05 1.19 ± 0.05 1.55 ± 0.10 178 ± 2.00 54.40 ± 1.00 13.00 ± 1.00 (inch) 0.089 ± 0.002 0.100 ± 0.002 0.047 ± 0.002 0.061 ± 0.004 7.008 ± 0.079 2.142 ± 0.039 0.512 ± 0.039 SYMBOL E F P P0 P1 W W1 (mm) 1.75 ± 0.10 3.50 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.10 8.00 + 0.30 /–0.10 12.30 ± 1.00 (inch) 0.069 ± 0.004 0.138 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.004 0.315 + 0.012 /–0.004 0.484 ± 0.039 Company reserves the right to improve product design , functions and reliability without notice. REV:B Page 3 QW-JP010 Comchip Technology CO., LTD. SMD ESD Protection Diode Marking Code 3 Part Number Marking Code CPDV3-5V0U-HF E5U E5U 1 2 Suggested PAD Layout B SOT-323 SIZE (mm) (inch) A 0.80 0.031 B 0.50 0.020 C 1.30 0.051 D 2.20 0.087 A D C Standard Packaging REEL PACK Case Type SOT-323 REEL Reel Size ( pcs ) (inch) 3,000 7 Company reserves the right to improve product design , functions and reliability without notice. REV:B Page 4 QW-JP010 Comchip Technology CO., LTD.