DIM600DCM17-A

16
DS5491-5 March 2011 (LN26753)
14
±0.2
±0.2
Replaces DS5491-4.2
IGBT Chopper Module
11.5
DIM600DCM17-A000
FEATURES
±0.2

10µs Short Circuit Withstand

High Thermal Cycling Capability

Non Punch Through Silicon

Isolated AlSiC Base With AlN Substrates

Lead Free Construction
55.2 ± 0.3
APPLICATIONS
11.85 ±0.2

High Reliability Inverters

Motor Controllers

Traction Drives
The Powerline range of high power modules includes
half bridge, chopper, dual, single and bi-directional
switch configurations covering voltages from 600V to
3300V and currents up to 2400A.
The DIM600DCM17-A000 is a 1700V, n-channel
enhancement mode, insulated gate bipolar transistor
(IGBT) chopper module. The IGBT has a wide reverse
bias safe operating area (RBSOA) plus 10μs short
circuit withstand. This device is optimised for traction
drives and other applications requiring high thermal
cycling capability.
28 ±0.5
KEY PARAMETERS
6 x O7
VCES
VCE(sat) * (typ)
IC
(max)
IC(PK)
(max)
1700V
2.7V
screwing depth
600A
max 8
1200A
* Measured at the power busbars, not the auxiliary terminals
1(E)
2(C)
3(C)
4(E)
5(E)
6(G)
7(C)
Fig. 1 Circuit configuration
The module incorporates an electrically isolated base
plate and low inductance construction enabling circuit
designers to optimise circuit layouts and utilise
grounded heat sinks for safety.
ORDERING INFORMATION
Order As:
DIM600DCM17-A000
Note: When ordering, please use the complete part
number
Outline type code: D
(See Fig. 11 for further information)
Fig. 2 Package
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures
www.dynexsemi.com
1 /8
DIM600DCM17-A000
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. In
extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package.
Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect
device reliability.
Tcase = 25°C unless stated otherwise
Symbol
Parameter
VCES
Collector-emitter voltage
VGES
Gate-emitter voltage
IC
Test Conditions
VGE = 0V
Max.
Units
1700
V
±20
V
Continuous collector current
Tcase = 75°C
600
A
IC(PK)
Peak collector current
1ms, Tcase = 110°C
1200
A
Pmax
Max. transistor power dissipation
Tcase = 25°C, Tj = 150°C
5200
W
120
kA s
120
kA s
4000
V
10
pC
2
2
Diode I t value (IGBT arm)
It
VR = 0, tp = 10ms, Tj = 125ºC
2
Diode I t value (Diode arm)
Visol
Isolation voltage – per module
Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
QPD
Partial discharge – per module
IEC1287, V1 = 1800V, V2 = 1300V, 50Hz RMS
2
2
THERMAL AND MECHANICAL RATINGS
Internal insulation material:
AlN
Baseplate material:
AlSiC
Creepage distance:
20mm
Clearance:
10mm
CTI (Comparative Tracking Index):
350
Symbol
Parameter
Test Conditions
Rth(j-c)
Thermal resistance – transistor (per arm)
Thermal resistance – diode (IGBT arm)
Rth(j-c)
Rth(c-h)
Tj
Tstg
Typ.
Max
Units
-
-
24
°C/kW
-
-
40
°C/kW
40
°C/kW
Thermal resistance – diode (Diode arm)
Continuous dissipation –
junction to case
Thermal resistance – case to heatsink
(per module)
Mounting torque 5Nm
(with mounting grease)
-
-
8
°C/kW
Transistor
-
-
150
°C
Diode
-
-
125
°C
-40
-
125
°C
Mounting – M6
-
-
5
Nm
Electrical connections – M4
-
-
2
Nm
Electrical connections – M8
-
-
10
Nm
Junction temperature
Storage temperature range
Screw torque
2/8
Continuous dissipation –
junction to case
Min
-
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
DIM600DCM17-A000
ELECTRICAL CHARACTERISTICS
Tcase = 25°C unless stated otherwise.
Symbol
Max
Units
VGE = 0V, VCE = VCES
1
mA
VGE = 0V, VCE = VCES, Tcase = 125°C
20
mA
Gate leakage current
VGE = ± 20V, VCE = 0V
4
μA
Gate threshold voltage
IC = 40mA, VGE = VCE
5.5
6.5
V
Collector-emitter saturation
voltage
VGE = 15V, IC = 600A
2.7
3.2
V
VGE = 15V, IC = 600A, Tj = 125°C
3.4
4.0
V
IF
Diode forward current
DC
600
A
IFM
Diode maximum forward current
tp = 1ms
1200
A
2.2
2.5
V
2.2
2.5
V
2.3
2.6
V
2.3
2.6
V
ICES
VGE(TH)
VF
Test Conditions
Min
Typ
Collector cut-off current
IGES
VCE(sat)
Parameter
†
†
Diode forward voltage
(IGBT arm)
Diode forward voltage
(Diode arm)
Diode forward voltage
(IGBT arm)
Diode forward voltage
(Diode arm)
4.5
IF = 600A
IF = 600A, Tj = 125°C
Cies
Input capacitance
VCE = 25V, VGE = 0V, f = 1MHz
45
nF
Qg
Gate charge
±15V
6.8
μC
Cres
Reverse transfer capacitance
VCE = 25V, VGE = 0V, f = 1MHz
LM
Module inductance – per arm
20
nH
RINT
Internal transistor resistance –
per arm
270
μ
2400
A
nF
Tj = 125°C, VCC = 1000V
SCData
Short circuit current, ISC
tp ≤ 10μs, VGE ≤ 15V
*
VCE (max) = VCES – L x dI/dt
IEC 60747-9
Note:
†
Measured at the power busbars, not the auxiliary terminals
*
L is the circuit inductance + LM
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures
www.dynexsemi.com
3 /8
DIM600DCM17-A000
ELECTRICAL CHARACTERISTICS
Tcase = 25°C unless stated otherwise
Symbol
td(off)
tf
Parameter
Test Conditions
Min
Turn-off delay time
IC = 600A
Fall time
Typ.
Max
Units
1200
ns
140
ns
VGE = ±15V
EOFF
Turn-off energy loss
VCE = 900V
190
mJ
td(on)
Turn-on delay time
RG(ON) = 3.3
250
ns
250
ns
220
mJ
150
μC
350
A
100
mJ
tr
RG(OFF) = 3.3
Rise time
LS ~ 100nH
EON
Turn-on energy loss
Qrr
Diode reverse recovery charge
Irr
Diode reverse recovery current
Erec
Diode reverse recovery energy
Diode arm
IF = 600A
VCE = 900V
dIF/dt = 3000A/μs
Tcase = 125°C unless stated otherwise
Parameter
Symbol
td(off)
tf
Test Conditions
Turn-off delay time
IC = 600A
Fall time
Min
Typ.
Max
Units
1500
ns
170
ns
VGE = ±15V
EOFF
Turn-off energy loss
VCE = 900V
270
mJ
td(on)
Turn-on delay time
RG(ON) = 3.3
400
ns
250
ns
350
mJ
250
μC
400
A
150
mJ
tr
RG(OFF) = 3.3
Rise time
LS ~ 100nH
EON
Turn-on energy loss
Qrr
Diode reverse recovery charge
Irr
Diode reverse recovery current
Erec
Diode reverse recovery energy
4/8
Diode arm
IF = 600A
VCE = 900V
dIF/dt = 3000A/μs
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
DIM600DCM17-A000
Fig. 3 Typical output characteristics
Fig. 4 Typical output characteristics
Fig. 5 Typical switching energy vs collector current
Fig. 6 Typical switching energy vs gate resistance
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures
www.dynexsemi.com
5 /8
DIM600DCM17-A000
6/8
Fig. 7 Diode typical forward characteristics
Fig. 8 Reverse bias safe operating area
Fig. 9 Diode reverse bias safe operating area
Fig. 10 Transient thermal impedance
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
DIM600DCM17-A000
PACKAGE DETAILS
For further package information, please visit our website or contact Customer Services.
All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
130±0.5
114 ±0.1
29.2 ±0.5
57 ±0.25
57 ±0.25
screwing depth
max 16
11.5 ±0.2
6 x M4
6 x Ø7
16 ±0.2 18 ±0.2
40 ±0.2
53 ±0.2
14 ±0.2
35 ±0.2
140 ±0.5
124 ±0.25
30 ±0.2
5.25±0.3
4 x M8
screwing depth
max 8
44 ±0.2
57 ±0.2
55.2 ±0.3
11.85 ±0.2
1(E)
2(C)
3(C)
4(E)
5(E)
+1.5
-0.0
6(G)
38
7(C)
Nominal Weight:
900g
Module Outline Type Code:
D
Fig. 11 Module outline drawing
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures
www.dynexsemi.com
7 /8
DIM600DCM17-A000
IMPORTANT INFORMATION:
This publication is provided for information only and not for resale.
The products and information in this publication are intended for use by appropriately trained technical personnel.
Due to the diversity of product applications, the information contained herein is provided as a general guide only and does not
constitute any guarantee of suitability for use in a specific application.The user must evaluate the suitability of the product and
the completeness of the product data for the application. The user is responsible for product selection and ensuring all safety
and any warning requirements are met. Should additional product information be needed please contact Customer Service.
Although we have endeavoured to carefully compile the information in this publication it may contain inaccuracies or
typographical errors. The information is provided without any warranty or guarantee of any kind.
This publication is an uncontrolled document and is subject to change without notice. When referring to it please ensure that it
is the most up to date version and has not been superseded.
The products are not intended for use in applications where a failure or malfunction may cause loss of life, injury or damage to
property. The user must ensure that appropriate safety precautions are taken to prevent or mitigate the consequences of a
product failure or malfunction.
The products must not be touched when operating because there is a danger of electrocution or severe burning. Always use
protective safety equipment such as appropriate shields for the product and wear safety glasses. Even when disconnected any
electric charge remaining in the product must be discharged and allowed to cool before safe handling using protective gloves.
Extended exposure to conditions outside the product ratings may affect reliability leading to premature product failure. Use
outside the product ratings is likely to cause permanent damage to the product. In extreme conditions, as with all
semiconductors, this may include potentially hazardous rupture, a large current to flow or high voltage arcing, resulting in fire or
explosion. Appropriate application design and safety precautions should always be followed to protect persons and property.
Product Status & Product Ordering:
We annotate datasheets in the top right hand corner of the front page, to indicate product status if it is not yet fully approved for
production. The annotations are as follows:Target Information:
This is the most tentative form of information and represents a very preliminary specification.
No actual design work on the product has been started.
Preliminary Information:
The product design is complete and final characterisation for volume production is in progress.
The datasheet represents the product as it is now understood but details may change.
No Annotation:
The product has been approved for production and unless otherwise notified by Dynex any
product ordered will be supplied to the current version of the data sheet prevailing at the
time of our order acknowledgement.
All products and materials are sold and services provided subject to Dynex’s conditions of sale, which are available
on request.
Any brand names and product names used in this publication are trademarks, registered trademarks or trade
names of their respective owners.
HEADQUARTERS OPERATIONS
CUSTOMER SERVICE
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln, Lincolnshire, LN6 3LF,
United Kingdom
Fax:
+44(0)1522 500550
Tel:
+44(0)1522 500500
Web:
http://www.dynexsemi.com
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln, Lincolnshire, LN6 3LF,
United Kingdom
Fax:
+44(0)1522 500020
Tel:
+44(0)1522 502753 / 502901
Email: [email protected]
 Dynex Semiconductor Ltd. 2001
Technical Documentation – Not for resale.
8/8
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
Similar pages