AN5569 Standard Waveforms Application Note AN5569-1.1 JULY 2005 ( LN24023) SINGLE PHASE Circuit and output voltage waveform across a - b Fig. 1 : Half wave Fig. 2 : Full wave centre tap Fig. 3 : Full wave bridge Current Ratios Fundamental Ripple Frequency IRMS/IDCA IAV /IDC Voltage Ratios IPK/IDCB IPK/IDCC R L R L R L ERMS/EDCD ERMS/EDCE EPK/EDCF Half Wave 1f 1.0 1.57 - 3.14 - 1.57 - 2.22 1.57 3.14 Half Wave Centre Tap 2f 0.5 0.785 0.707 1.57 1.0 0.785 0.707 1.11 2.22 1.57 Full Wave Bridge 2f 0.5 0.785 0.707 1.57 1.0 1.11 1.0 1.11 1.11 1.57 NOTES R = Resistive load. L = Inductive load. A = Ratio of RMS current to DC output current. Arm fuses are rated for this RMS current. B = Ratio of peak device current to DC output current. C = Ratio of secondary RMS line current from supply to DC output current. Line fuses are rated for this RMS current. D = Ratio of no load RMS line to line voltage to no load DC voltage. E = Ratio of RMS phase voltage to DC voltage. F = Ratio of peak phase voltage to DC voltage. 1 /4 www.dynexsemi.com AN5569 Application Note THREE PHASE Circuit and output voltage waveform across a - b Fig. 4 : Half wave Fig. 5 : Bridge Fig. 6: Double star Current Ratios Fundamental Ripple Frequency IRMS/IDCA IAV /IDC Voltage Ratios IPK/IDCB IPK/IDCC R L R L R L ERMS/EDCD ERMS/EDCE EPK/EDCF Half Wave 3f 0.33 0.588 0.577 1.21 1.0 0.588 0.577 1.48 0.855 2.1 Bridge 6f 0.33 0.588 0.577 1.05 1.0 0.816 0.816 0.74 0.427 1.05 Double Star 6f 0.167 0.293 0.289 0.525 0.5 0.293 0.289 1.48 0.855 2.42 NOTES R = Resistive load. L = Inductive load. A = Ratio of RMS current to DC output current. Arm fuses are rated for this RMS current. B = Ratio of peak device current to DC output current. C = Ratio of secondary RMS line current from supply to DC output current. Line fuses are rated for this RMS current. D = Ratio of no load RMS line to line voltage to no load DC voltage. E = Ratio of RMS phase voltage to DC voltage. F = Ratio of peak phase voltage to DC voltage. 2 /4 www.dynexsemi.com AN5569 Application Note SIX PHASE Circuit and output voltage waveform across a - b Fig. 7 : 5 Star limb core Fig. 8 : Series bridges Fig. 9 : Star delta with IPT Current Ratios Fundamental Ripple Frequency IRMS/IDCA IAV /IDC Voltage Ratios IPK/IDCB IPK/IDCC R L R L R L ERMS/EDCD ERMS/EDCE EPK/EDCF 5 Star Limb Core 6f 0.167 0.408 0.408 1.05 0.5 0.408 0.408 1.48 0.74 2.1 Series Bridges 12f 0.33 0.588 0.577 1.05 1.0 0.816 0.816 0.37 - 1.05 Star Delta with IPT 12f 0.167 0.293 0.289 0.525 0.5 0.408 0.408 0.74 - 1.05 NOTES R = Resistive load. L = Inductive load. A = Ratio of RMS current to DC output current. Arm fuses are rated for this RMS current. B = Ratio of peak device current to DC output current. C = Ratio of secondary RMS line current from supply to DC output current. Line fuses are rated for this RMS current. D = Ratio of no load RMS line to line voltage to no load DC voltage. E = Ratio of RMS phase voltage to DC voltage. F = Ratio of peak phase voltage to DC voltage. 3 /4 www.dynexsemi.com AN5569 Application Note POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks, which have been, designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer Services. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln Lincolnshire, LN6 3LF. United Kingdom. Fax: +44(0)1522 500550 CUSTOMER SERVICE Tel: +44(0)1522 502753 / 502901. Fax: +44(0)1522 500020 Tel: +44(0)1522 500500 Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN UNITED KINGDOM. Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hand corner of the front page, to indicate product status. The annotations are as follows:- Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company’s conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 4 /4 www.dynexsemi.com