Datasheet

Type Y - Water Cooled Heatsink
Type Y
Water Cooled Heatsink
Advance Information
Replaces January 2000 version, DS4390-3.0
DS4390-4.0 November 2002
FEATURES
These heatsinks are designed for use in Dynex Semiconductor
high current, high power assemblies such as single, three or six
phase bridges or AC controllers. Complete bridges of up to 6
devices can be constructed.
Dynex Semiconductor have suitable clamps to build these
assemblies and also a comprehensive range of devices to suit a
variety of output requirements.
See Outline Details for further information.
Fig. 1: Heatsink outline
APPLICATIONS
The type Ywater cooled heatsink is designed to efficiently cool
NOTE: Where connectors are screwed into the heatsink
50mm and smaller diameter thyristors, and diodes. It has a 'U'
stainless steel is normally used principally for de-ionised water
internal waterway system for heat extraction.
unless otherwise requested. For brazed in connectors, copper
or brass will be used.
WATER CONNECTIONS
S
Plain tube with swaged end brazed into heatsink.
Where brazing is used, the braze material is a silver/copper
T
Plain tube with swaged end screwed into heatsink.
eutectic which is suitable for use with de-ionised water supplies
P
Fir Tree connector brazed into heatsink.
with copper water connectors.
F
Fir Tree connector screwed into heatsink.
G
Screwed termination for hose screwed into heatsink.
H
Screw termination for hose brazed into heatsink.
THERMAL RATINGS
Water Flow
Ltr/min
2
4
6
Thermal Resistance
2 Heatsinks for Double Side Cooling
Heatsink - Water in ˚C/W
2 Devices and 3 Heatsink Assembly
Junction - Water in ˚C/W
Dynex Disc Outline Code
Dynex Disc Outline Code
T
E
D, F, G
D
F
G
0.0420
0.0350
0.0320
0.0370
0.0295
0.0268
0.0300
0.0218
0.0195
0.0540
0.0432
0.0406
0.0550
0.0442
0.0416
0.0540
0.0432
0.0406
1/3
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Type Y - Water Cooled Heatsink
0.06
G outline
F outline
P outline
0.07
0.06
0.05
0.04
0.03
0.02
DC thermal resistance (junction to water)- (˚C/W)
DC thermal resistance (junction to water)- (˚C/W)
0.08
T outline
E outline
G, F outline
0.05
0.04
0.03
0.02
0.01
0.01
0
1.0
2.0
3.0
3.0
Water flow - (L/min)
5.0
6.0
Fig. 2: DC thermal resistance junction to water inlet with
water flow - 2x devices and 3x heatsinks
0
1.0
2.0
3.0
3.0
Water flow - (L/min)
5.0
6.0
Fig. 3: Thermal resistance with water flow double side
cooled - heatsink to water inlet
OUTLINE DETAILS
For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE.
12.5
50
32
OD 10
50
Fig. 3: Heatsink outline details
2/3
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POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic
semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages
and current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today.
The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
Solution (PACs).
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to
optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow
rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or
Customer Services.
http://www.dynexsemi.com
e-mail: [email protected]
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: +44-(0)1522-500500
Fax: +44-(0)1522-500550
CUSTOMER SERVICE
Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020
SALES OFFICES
Benelux, Italy & Switzerland: Tel: +33 (0)1 64 66 42 17. Fax: +33 (0)1 64 66 42 19.
France: Tel: +33 (0)2 47 55 75 52. Fax: +33 (0)2 47 55 75 59.
Germany, Northern Europe, Spain & Rest Of World: Tel: +44 (0)1522 502753 / 502901.
Fax: +44 (0)1522 500020
North America: Tel: (440) 259-2060. Fax: (440) 259-2059. Tel: (949) 733-3005. Fax: (949) 733-2986.
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN
UNITED KINGDOM
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Advance Information: The product design is complete and final characterisation for volume production is well in hand.
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