LT3012 - 250mA, 4V to 80V Low Dropout Micropower Linear Regulator

LT3012
250mA, 4V to 80V
Low Dropout
Micropower Linear Regulator
DESCRIPTION
FEATURES
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Wide Input Voltage Range: 4V to 80V
Low Quiescent Current: 40μA
Low Dropout Voltage: 400mV
Output Current: 250mA
No Protection Diodes Needed
Adjustable Output from 1.24V to 60V
1μA Quiescent Current in Shutdown
Stable with 3.3μF Output Capacitor
Stable with Aluminum, Tantalum or Ceramic
Capacitors
Reverse-Battery Protection
No Reverse Current Flow from Output to Input
Thermal Limiting
Thermally Enhanced 16-Lead TSSOP and
12-Pin (4mm × 3mm) DFN Packages
APPLICATIONS
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The LT®3012 is a high voltage, micropower low dropout
linear regulator. The device is capable of supplying 250mA of
output current with a dropout voltage of 400mV. Designed
for use in battery-powered or high voltage systems, the low
quiescent current (40μA operating and 1μA in shutdown)
makes the LT3012 an ideal choice. Quiescent current is
also well controlled in dropout.
Other features of the LT3012 include the ability to operate
with very small output capacitors. The regulator is stable
with only 3.3μF on the output while most older devices
require between 10μF and 100μF for stability. Small ceramic capacitors can be used without any need for series
resistance (ESR) as is common with other regulators.
Internal protection circuitry includes reverse-battery
protection, current limiting, thermal limiting and reverse
current protection.
The device is available with an adjustable output with a
1.24V reference voltage. The LT3012 regulator is available
in the 16-lead TSSOP and 12 pin low profile (0.75mm)
(4mm × 3mm) DFN packages with an exposed pad for
enhanced thermal handling capability.
Low Current High Voltage Regulators
Regulator for Battery-Powered Systems
Telecom Applications
Automotive Applications
L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
TYPICAL APPLICATION
5V Supply with Shutdown
Dropout Voltage
400
VIN
5.4V TO
80V
LT3012
1μF
VOUT
5V
250mA
OUT
SHDN
GND
750k
3.3μF
ADJ
249k
3012 TA01
VSHDN
<0.3V
>2.0V
OUTPUT
OFF
ON
350
DROPOUT VOLTAGE (mV)
IN
300
250
200
150
100
50
0
0
50
100
150
200
OUTPUT CURRENT (mA)
250
3012 TA02
3012fd
1
LT3012
ABSOLUTE MAXIMUM RATINGS
(Note 1)
IN Pin Voltage .........................................................±80V
OUT Pin Voltage ......................................................±60V
IN to OUT Differential Voltage .................................±80V
ADJ Pin Voltage ........................................................±7V
SHDN Pin Input Voltage ..........................................±80V
Output Short-Circuit Duration .......................... Indefinite
Storage Temperature Range
TSSOP Package ................................. –65°C to 150°C
DFN Package...................................... –65°C to 125°C
Operating Junction Temperature Range
(Notes 3, 10, 11)
LT3012E ............................................. –40°C to 125°C
LT3012HFE......................................... –40°C to 140°C
Lead Temperature (FE16 Soldering, 10 sec) ......... 300°C
PIN CONFIGURATION
TOP VIEW
TOP VIEW
GND
1
16 GND
NC
1
12 NC
NC
2
15 NC
OUT
2
11 IN
OUT
3
14 IN
OUT
3
10 IN
OUT
4
ADJ
4
9
NC
ADJ
5
GND
5
8
SHDN
GND
6
11 SHDN
NC
7
10 NC
GND
8
9
NC
13
6
7
NC
DE PACKAGE
12-LEAD (4mm × 3mm) PLASTIC DFN
TJMAX = 125°C, θJA = 40°C/W, θJC = 16°C/W
EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB
17
13 IN
12 NC
GND
FE PACKAGE
16-LEAD PLASTIC TSSOP
TJMAX = 140°C, θJA = 40°C/W, θJC = 16°C/W
EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
TAPE AND REEL
PART MARKING
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LT3012EDE#PBF
LT3012EDE#TRPBF
3012
12-Lead (4mm × 3mm) Plastic DFN
–40°C to 125°C
LT3012EFE#PBF
LT3012EFE#TRPBF
3012EFE
16-Lead Plastic TSSOP
–40°C to 125°C
LT3012HFE#PBF
LT3012HFE#TRPBF
3012HFE
16-Lead Plastic TSSOP
–40°C to 140°C
LEAD BASED FINISH
TAPE AND REEL
PART MARKING
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LT3012EDE
LT3012EDE#TR
3012
12-Lead (4mm × 3mm) Plastic DFN
–40°C to 125°C
LT3012EFE
LT3012EFE#TR
3012EFE
16-Lead Plastic TSSOP
–40°C to 125°C
LT3012HFE
LT3012HFE#TR
3012HFE
16-Lead Plastic TSSOP
–40°C to 140°C
Consult LTC Marketing for parts specified with wider operating temperature ranges.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
3012fd
2
LT3012
ELECTRICAL CHARACTERISTICS
(LT3012E)
The l denotes the specifications which apply over the –40°C to 125°C operating temperature range, otherwise specifications are at TJ = 25°C.
PARAMETER
CONDITIONS
MIN
TYP
4
4.75
V
1.225
1.2
1.24
1.24
1.255
1.28
V
V
l
Minimum Input Voltage
ILOAD = 250mA
ADJ Pin Voltage (Notes 2, 3)
VIN = 4V, ILOAD = 1mA
4.75V < VIN < 80V, 1mA < ILOAD < 250mA
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Line Regulation
ΔVIN = 4V to 80V, ILOAD = 1mA (Note 2)
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Load Regulation (Note 2)
VIN = 4.75V, ΔILOAD = 1mA to 250mA
VIN = 4.75V, ΔILOAD = 1mA to 250mA
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Dropout Voltage
VIN = VOUT(NOMINAL) (Notes 4, 5)
ILOAD = 10mA
ILOAD = 10mA
l
ILOAD = 50mA
ILOAD = 50mA
l
ILOAD = 250mA
ILOAD = 250mA
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MAX
UNITS
0.1
5
mV
7
12
25
mV
mV
160
230
300
mV
mV
250
340
420
mV
mV
400
490
620
mV
mV
40
3
10
100
μA
mA
mA
GND Pin Current
VIN = 4.75V (Notes 4, 6)
ILOAD = 0mA
ILOAD = 100mA
ILOAD = 250mA
Output Voltage Noise
COUT = 10μF, ILOAD = 250mA, BW = 10Hz to 100kHz
100
ADJ Pin Bias Current
(Note 7)
30
100
nA
Shutdown Threshold
VOUT = Off to On
VOUT = On to Off
1.3
0.8
2
V
V
0.3
0.1
2
1
μA
μA
1
5
μA
SHDN Pin Current (Note 8)
VSHDN = 0V
VSHDN = 6V
Quiescent Current in Shutdown
VIN = 6V, VSHDN = 0V
Ripple Rejection
VIN = 7V(Avg), VRIPPLE = 0.5VP-P, fRIPPLE = 120Hz, ILOAD = 250mA
Current Limit
VIN = 7V, VOUT = 0V
VIN = 4.75V, ΔVOUT = –0.1V (Note 2)
Reverse Output Current (Note 9)
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0.3
65
l
18
μVRMS
75
dB
400
mA
mA
250
VOUT = 1.24V, VIN < 1.24V (Note 2)
12
25
μA
ELECTRICAL CHARACTERISTICS
(LT3012H)
The l denotes the specifications which apply over the –40°C to 140°C operating temperature range, otherwise specifications are at TJ = 25°C.
PARAMETER
CONDITIONS
Minimum Input Voltage
ILOAD = 200mA
l
ADJ Pin Voltage (Notes 2, 3)
VIN = 4V, ILOAD = 1mA
4.75V < VIN < 80V, 1mA < ILOAD < 200mA
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Line Regulation
ΔVIN = 4V to 80V, ILOAD = 1mA (Note 2)
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Load Regulation (Note 2)
VIN = 4.75V, ΔILOAD = 1mA to 200mA
VIN = 4.75V, ΔILOAD = 1mA to 200mA
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Dropout Voltage
VIN = VOUT(NOMINAL) (Notes 4, 5)
ILOAD = 10mA
ILOAD = 10mA
l
ILOAD = 50mA
ILOAD = 50mA
l
ILOAD = 200mA
ILOAD = 200mA
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GND Pin Current
VIN = 4.75V (Notes 4, 6)
ILOAD = 0mA
ILOAD = 100mA
ILOAD = 200mA
MIN
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1.225
1.2
TYP
MAX
UNITS
4
4.75
V
1.24
1.24
1.255
1.28
V
V
0.1
5
mV
6
12
30
mV
mV
160
230
320
mV
mV
250
340
450
mV
mV
360
490
630
mV
mV
40
3
7
110
μA
mA
mA
18
3012fd
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LT3012
ELECTRICAL CHARACTERISTICS
(LT3012H)
The l denotes the specifications which apply over the –40°C to 140°C operating temperature range, otherwise specifications are at TJ = 25°C.
PARAMETER
CONDITIONS
Output Voltage Noise
COUT = 10μF, ILOAD = 200mA, BW = 10Hz to 100kHz
100
ADJ Pin Bias Current
(Note 7)
30
100
nA
Shutdown Threshold
VOUT = Off to On
VOUT = On to Off
1.3
0.8
2
V
V
0.3
0.1
2
1
μA
μA
1
5
μA
SHDN Pin Current (Note 8)
MIN
l
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VSHDN = 0V
VSHDN = 6V
Quiescent Current in Shutdown
VIN = 6V, VSHDN = 0V
Ripple Rejection
VIN = 7V(Avg), VRIPPLE = 0.5VP-P, fRIPPLE = 120Hz, ILOAD = 200mA
Current Limit
VIN = 7V, VOUT = 0V
VIN = 4.75V, ΔVOUT = –0.1V (Note 2)
Reverse Output Current (Note 9)
0.3
VOUT = 1.24V, VIN < 1.24V (Note 2)
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LT3012 is tested and specified for these conditions with the
ADJ pin connected to the OUT pin.
Note 3: Operating conditions are limited by maximum junction
temperature. The regulated output voltage specification will not apply
for all possible combinations of input voltage and output current. When
operating at maximum input voltage, the output current range must be
limited. When operating at maximum output current, the input voltage
range must be limited.
Note 4: To satisfy requirements for minimum input voltage, the LT3012
is tested and specified for these conditions with an external resistor
divider (249k bottom, 649k top) for an output voltage of 4.5V. The external
resistor divider will add a 5μA DC load on the output.
Note 5: Dropout voltage is the minimum input to output voltage differential
needed to maintain regulation at a specified output current. In dropout, the
output voltage will be equal to (VIN – VDROPOUT).
65
l
TYP
MAX
UNITS
μVRMS
75
dB
400
mA
mA
200
12
25
μA
Note 6: GND pin current is tested with VIN = 4.75V and a current source
load. This means the device is tested while operating close to its dropout
region. This is the worst-case GND pin current. The GND pin current will
decrease slightly at higher input voltages.
Note 7: ADJ pin bias current flows into the ADJ pin.
Note 8: SHDN pin current flows out of the SHDN pin.
Note 9: Reverse output current is tested with the IN pin grounded and the
OUT pin forced to the rated output voltage. This current flows into the OUT
pin and out the GND pin.
Note 10: The LT3012E is guaranteed to meet performance specifications
from 0°C to 125°C operating junction temperature. Specifications over
the –40°C to 125°C operating junction temperature range are assured by
design, characterization and correlation with statistical process controls.
The LT3012H is tested to the LT3012H Electrical Characteristics table at
140°C operating junction temperature. High junction temperatures degrade
operating lifetimes. Operating lifetime is derated at junction temperatures
greater than 125°C.
Note 11: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C (LT3012E) or 140°C (LT3012H) when
overtemperature protection is active. Continuous operation above the
specified maximum operating junction temperature may impair device
reliability.
3012fd
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LT3012
TYPICAL PERFORMANCE CHARACTERISTICS
Typical Dropout Voltage
Guaranteed Dropout Voltage
600
400
TJ = 25°C
300
200
100
0
= TEST POINTS
TJ ≤ 125°C
500
500
400
DROPOUT VOLTAGE (mV)
TJ = 125°C
TJ ≤ 25°C
300
200
100
150
200
OUTPUT CURRENT (mA)
0
250
Quiescent Current
50
150
100
200
OUTPUT CURRENT (mA)
50
40
30
20
IL = 1mA
0
1.250
1.245
1.240
1.235
1.230
VSHDN = VIN
50
40
30
20
VSHDN = GND
25 50 75 100 125 150
TEMPERATURE (°C)
1.220
–50 –25
0
0
25 50 75 100 125 150
TEMPERATURE (°C)
Quiescent Current
TJ = 25°C
225 RL = ∞
VOUT = 1.24V
200
GND PIN CURRENT (mA)
VSHDN = VIN
100
75
VSHDN = GND
2
RL = 49.6Ω
IL = 25mA*
0.8
RL = 124Ω
IL = 10mA*
0.6
0.4
RL = 1.24k
IL = 1mA*
0.2
20
30 40 50 60
INPUT VOLTAGE (V)
70
80
3012 G07
0
0
1
2
9
10
TJ = 25°C, *FOR VOUT = 1.24V
9
8
RL = 4.96Ω
IL = 250mA*
7
6
5
RL = 12.4Ω
IL = 100mA*
4
3
1
10
8
2
25
0
3 4 5 6 7
INPUT VOLTAGE (V)
GND Pin Current
10
TJ = 25°C
*FOR VOUT = 1.24V
1.0
150
1
3012 G06
GND Pin Current
1.2
175
0
3012 G05
250
50
60
10
3012 G04
125
25 50 75 100 125 150
TEMPERATURE (°C)
TJ = 25°C
RL = ∞
VOUT = 1.24V
70
VSHDN = GND
0
–50 –25
0
Quiescent Current
80
1.225
10
IL = 1mA
3012 G03
QUIESCENT CURRENT (μA)
ADJ PIN VOLTAGE (V)
QUIESCENT CURRENT (μA)
VSHDN = VIN
IL = 10mA
0
–50 –25
250
1.255
60
IL = 50mA
200
ADJ Pin Voltage
1.260
VIN = 6V
90 RL = ∞
I =0
80 L
0
300
3012 G02
100
70
IL = 100mA
400
0
50
0
IL = 250mA
100
100
3012 G01
QUIESCENT CURRENT(μA)
Dropout Voltage
600
GND PIN CURRENT (mA)
DROPOUT VOLTAGE (mV)
500
GUARANTEED DROPOUT VOLTAGE (mV)
600
3 4 5 6 7
INPUT VOLTAGE (V)
8
9
10
3012 G08
0
RL = 24.8Ω, IL = 50mA*
0
1
2
3 4 5 6 7
INPUT VOLTAGE (V)
8
9
10
3012 G09
3012fd
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LT3012
TYPICAL PERFORMANCE CHARACTERISTICS
SHDN Pin Threshold
GND Pin Current vs ILOAD
10
TJ = 25°C
CURRENT FLOWS
0.5 OUT OF SHDN PIN
1.8
7
6
5
4
3
2
1.6
OFF-TO-ON
1.4
1.2
1.0
ON-TO-OFF
0.8
0.6
0.4
0.4
0.3
0.2
0.1
0.2
1
50
0
100
150
200
LOAD CURRENT (mA)
0
0
–50 –25
250
0
0
25 50 75 100 125 150
TEMPERATURE (°C)
3012 G10
SHDN Pin Current
Current Limit
1000
VOUT = 0V
0.3
0.2
0.1
100
800
CURRENT LIMIT (mA)
ADJ PIN BIAS CURRENT (nA)
900
0.4
3.0
3012 G12
ADJ Pin Bias Current
120
VIN = 6V
VSHDN = 0V
0.5 CURRENT FLOWS
OUT OF SHDN PIN
1.0
2.0
1.5
2.5
SHDN PIN VOLTAGE (V)
0.5
3012 G11
0.6
SHDN PIN CURRENT (μA)
SHDN PIN CURRENT (μA)
SHDN PIN THRESHOLD (V)
GND PIN CURRENT (mA)
VIN = 4.75V
9 TJ = 25°C
= 1.24V
V
8 OUT
0
SHDN Pin Current
0.6
2.0
80
60
40
TJ = 25°C
700
600
TJ = 125°C
500
400
300
200
20
100
0
–50 –25
0
0
–50 –25
25 50 75 100 125 150
TEMPERATURE (°C)
0
Current Limit
300
200
VIN = 7V
VOUT = 0V
0
–50 –25
TJ = 25°C
180 VIN = 0V
VOUT = VADJ
160
140
120
100 CURRENT FLOWS
80 INTO OUTPUT PIN
60
ADJ
PIN CLAMP
(SEE APPLICATIONS
INFORMATION)
40
REVERSE OUTPUT CURRENT (μA)
REVERSE OUTPUT CURRENT (μA)
CURRENT LIMIT (mA)
400
20
30 40 50 60
INPUT VOLTAGE (V)
70
80
Reverse Output Current
120
200
500
10
3012 G15
Reverse Output Current
700
600
0
3012 G14
3012 G13
100
0
25 50 75 100 125 150
TEMPERATURE (°C)
VIN = 0V
VOUT = VADJ = 1.24V
100
80
60
40
20
20
0
25 50 75 100 125 150
TEMPERATURE (°C)
3012 G16
0
0
1
2
3 4 5 6 7 8
OUTPUT VOLTAGE (V)
9
10
3012 G17
0
–50 –25
0
25 50 75 100 125 150
TEMPERATURE (°C)
3012 G18
3012fd
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LT3012
TYPICAL PERFORMANCE CHARACTERISTICS
Input Ripple Rejection
Input Ripple Rejection
100
RIPPLE REJECTION (dB)
80
76
72
68
VIN = 4.75V + 0.5VP-P RIPPLE AT f = 120Hz
IL = 250mA
VOUT = 1.24V
60
0
25 50 75 100 125 150
TEMPERATURE (°C)
70
60
50
COUT = 10μF
40
30
20
COUT = 3.3μF
10
10
100
1k
10k
FREQUENCY (Hz)
OUTPUT NOISE SPECTRAL DENSITY (μV/√Hz)
–4
–6
–8
–10
–12
–14
–16
–18
0
2.5
2.0
1.5
1.0
0
–50 –25
1M
0
25 50 75 100 125 150
TEMPERATURE (°C)
3012 G21
Output Noise Spectral Density
ΔIL = 1mA TO 250mA
–20
–50 –25
3.0
3012 G20
Load Regulation
–2
3.5
0.5
100k
3012 G19
0
ILOAD = 250mA
4.0
0
10
COUT = 3.3μF
ILOAD = 250mA
1
0.1
0.01
25 50 75 100 125 150
TEMPERATURE (°C)
10
100
1k
10k
FREQUENCY (Hz)
100k
3012 G23
3012 G22
10Hz to 100kHz Output Noise
Transient Response
OUTPUT VOLTAGE
DEVIATION (V)
0.15
VOUT
100μV/DIV
COUT = 10μF
IL = 250mA
VOUT = 1.24V
1ms/DIV
3012 G24
LOAD CURRENT (mA)
–50 –25
LOAD REGULATION (mV)
RIPPLE REJECTION (dB)
4.5
80
84
64
VIN = 4.75V + 50mVRMS RIPPLE
ILOAD = 250mA
90
88
Minimum Input Voltage
5.0
MINIMUM INPUT VOLTAGE (V)
92
0.10
0.05
0
–0.05
VIN = 6V
VOUT = 5V
CIN = 3.3μF CERAMIC
COUT = 3.3μF CERAMIC
ΔILOAD = 100mA TO 200mA
–0.10
–0.15
300
200
100
0
0
100
300
200
TIME (μs)
400
500
3012 G25
3012fd
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LT3012
PIN FUNCTIONS
(DFN Package/TSSOP Package)
NC (Pins 1, 6, 7, 9, 12)/(Pins 2, 7, 10, 12, 15): No Connect. These pins have no internal connection; connecting
NC pins to a copper area for heat dissipation provides a
small improvement in thermal performance.
OUT (Pins 2, 3)/(Pins 3, 4): Output.The output supplies
power to the load. A minimum output capacitor of 3.3μF
is required to prevent oscillations. Larger output capacitors will be required for applications with large transient
loads to limit peak voltage transients. See the Applications
Information section for more information on output capacitance and reverse output characteristics.
ADJ (Pin 4)/(Pin 5): Adjust. This is the input to the error
amplifier. This pin is internally clamped to ±7V. It has a
bias current of 30nA which flows into the pin (see curve
of ADJ Pin Bias Current vs Temperature in the Typical
Performance Characteristics). The ADJ pin voltage is
1.24V referenced to ground, and the output voltage range
is 1.24V to 60V.
GND (Pins 5, 13)/(Pins 1, 6, 8, 9, 16, 17): Ground. The
exposed backside of the package is an electrical connection
for GND. As such, to ensure optimum device operation and
thermal performance, the exposed pad must be connected
directly to pin 5/pin 6 on the PC board.
SHDN (Pin 8)/(Pin 11): Shutdown. The SHDN pin is used
to put the LT3012 into a low power shutdown state. The
output will be off when the ⎯SHDN pin is pulled low. The
SHDN pin can be driven either by 5V logic or open-collector
logic with a pull-up resistor. The pull-up resistor is only
required to supply the pull-up current of the open-collector gate, normally several microamperes. If unused, the
SHDN pin must be tied to a logic high or to VIN.
IN (Pins 10, 11)/(Pins 13,14): Input. Power is supplied
to the device through the IN pin. A bypass capacitor is
required on this pin if the device is more than six inches
away from the main input filter capacitor. In general, the
output impedance of a battery rises with frequency, so it is
advisable to include a bypass capacitor in battery-powered
circuits. A bypass capacitor in the range of 1μF to 10μF is
sufficient. The LT3012 is designed to withstand reverse
voltages on the IN pin with respect to ground and the OUT
pin. In the case of a reversed input, which can happen if
a battery is plugged in backwards, the LT3012 will act as
if there is a diode in series with its input. There will be no
reverse current flow into the LT3012 and no reverse voltage will appear at the load. The device will protect both
itself and the load.
APPLICATIONS INFORMATION
The LT3012 is a 250mA high voltage low dropout regulator with micropower quiescent current and shutdown.
The device is capable of supplying 250mA at a dropout
voltage of 400mV. The low operating quiescent current
(40μA) drops to 1μA in shutdown. In addition to the
low quiescent current, the LT3012 incorporates several
protection features which make it ideal for use in battery-powered systems. The device is protected against
both reverse input and reverse output voltages. In battery
backup applications where the output can be held up by
a backup battery when the input is pulled to ground, the
LT3012 acts like it has a diode in series with its output
and prevents reverse current flow.
Adjustable Operation
The LT3012 has an output voltage range of 1.24V to 60V.
The output voltage is set by the ratio of two external resistors as shown in Figure 1. The device servos the output to
maintain the voltage at the adjust pin at 1.24V referenced
to ground. The current in R1 is then equal to 1.24V/R1
and the current in R2 is the current in R1 plus the ADJ
pin bias current. The ADJ pin bias current, 30nA at 25°C,
flows through R2 into the ADJ pin. The output voltage
can be calculated using the formula in Figure 1. The value
of R1 should be less than 250k to minimize errors in the
output voltage caused by the ADJ pin bias current. Note
that in shutdown the output is turned off and the divider
current will be zero.
3012fd
8
LT3012
APPLICATIONS INFORMATION
IN
VIN
VOUT
OUT
LT3012
R2
+
ADJ
3012 F01
R1
GND
VOUT = 1.24V 1 + R2 + (IADJ)(R2)
R1
VADJ = 1.24V
IADJ = 30nA AT 25°C
OUTPUT RANGE = 1.24V TO 60V
Figure 1. Adjustable Operation
The adjustable device is tested and specified with the
ADJ pin tied to the OUT pin and a 5μA DC load (unless
otherwise specified) for an output voltage of 1.24V. Specifications for output voltages greater than 1.24V will be
proportional to the ratio of the desired output voltage to
1.24V; (VOUT /1.24V). For example, load regulation for an
output current change of 1mA to 250mA is –7mV typical at
VOUT = 1.24V. At VOUT = 12V, load regulation is:
(12V/1.24V) • (–7mV) = –68mV
Output Capacitance and Transient Response
The LT3012 is designed to be stable with a wide range of
output capacitors. The ESR of the output capacitor affects
stability, most notably with small capacitors. A minimum
output capacitor of 3.3μF with an ESR of 3Ω or less is
recommended to prevent oscillations. The LT3012 is a
micropower device and output transient response will be
a function of output capacitance. Larger values of output
capacitance decrease the peak deviations and provide
20
improved transient response for larger load current
changes. Bypass capacitors, used to decouple individual
components powered by the LT3012, will increase the
effective output capacitor value.
Extra consideration must be given to the use of ceramic
capacitors. Ceramic capacitors are manufactured with a
variety of dielectrics, each with different behavior across
temperature and applied voltage. The most common
dielectrics used are specified with EIA temperature characteristic codes of Z5U, Y5V, X5R and X7R. The Z5U and
Y5V dielectrics are good for providing high capacitances
in a small package, but they tend to have strong voltage
and temperature coefficients as shown in Figures 2 and 3.
When used with a 5V regulator, a 16V 10μF Y5V capacitor
can exhibit an effective value as low as 1μF to 2μF for the
DC bias voltage applied and over the operating temperature range. The X5R and X7R dielectrics result in more
stable characteristics and are more suitable for use as the
output capacitor. The X7R type has better stability across
temperature, while the X5R is less expensive and is available in higher values. Care still must be exercised when
using X5R and X7R capacitors; the X5R and X7R codes
only specify operating temperature range and maximum
capacitance change over temperature. Capacitance change
due to DC bias with X5R and X7R capacitors is better than
Y5V and Z5U capacitors, but can still be significant enough
to drop capacitor values below appropriate levels. Capacitor DC bias characteristics tend to improve as component
case size increases, but expected capacitance at operating
voltage should be verified.
40
BOTH CAPACITORS ARE 16V,
1210 CASE SIZE, 10μF
20
X5R
CHANGE IN VALUE (%)
CHANGE IN VALUE (%)
0
–20
–40
–60
Y5V
–80
–100
0
X5R
–20
–40
Y5V
–60
–80
0
2
4
8
6
10 12
DC BIAS VOLTAGE (V)
14
16
3012 F02
Figure 2. Ceramic Capacitor DC Bias Characteristics
BOTH CAPACITORS ARE 16V,
1210 CASE SIZE, 10μF
–100
50
25
75
–50 –25
0
TEMPERATURE (°C)
100
125
3012 F03
Figure 3. Ceramic Capacitor Temperature Characteristics
3012fd
9
LT3012
APPLICATIONS INFORMATION
Voltage and temperature coefficients are not the only
sources of problems. Some ceramic capacitors have a
piezoelectric response. A piezoelectric device generates
voltage across its terminals due to mechanical stress, similar to the way a piezoelectric accelerometer or microphone
works. For a ceramic capacitor the stress can be induced
by vibrations in the system or thermal transients.
Current Limit and Safe Operating Area Protection
Like many IC power regulators, the LT3012 has safe operating area protection. The safe operating area protection
decreases the current limit as the input voltage increases
and keeps the power transistor in a safe operating region.
The protection is designed to provide some output current
at all values of input voltage up to the device breakdown
(see curve of Current Limit vs Input Voltage in the Typical
Performance Characteristics).
The LT3012 is limited for operating conditions by maximum
junction temperature. While operating at maximum input
voltage, the output current range must be limited; when
operating at maximum output current, the input voltage
range must be limited. Device specifications will not apply
for all possible combinations of input voltage and output
current. Operating the LT3012 beyond the maximum junction temperature rating may impair the life of the device.
Thermal Considerations
The power handling capability of the device will be limited
by the maximum rated junction temperature of (125°C for
LT3012E, or 140°C for LT3012HFE). The power dissipated
by the device will be made up of two components:
1. Output current multiplied by the input/output voltage
differential: IOUT • (VIN – VOUT) and,
2. GND pin current multiplied by the input voltage:
IGND • VIN.
The GND pin current can be found by examining the GND
Pin Current curves in the Typical Performance Characteristics. Power dissipation will be equal to the sum of the
two components listed above.
The LT3012 has internal thermal limiting designed to protect the device during overload conditions. For continuous
normal conditions the maximum junction temperature
rating of 125°C (E-Grade) or 140°C (H-Grade)must not
be exceeded. It is important to give careful consideration
to all sources of thermal resistance from junction to ambient. Additional heat sources mounted nearby must also
be considered.
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Copper board stiffeners and plated
through-holes can also be used to spread the heat generated by power devices.
The following tables list thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 3/32" FR-4 board with one ounce
copper.
Table 1. DFN Measured Thermal Resistance
COPPER AREA
TOPSIDE
BOARD AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
2500 sq mm
2500 sq mm
40°C/W
1000 sq mm
2500 sq mm
45°C/W
225 sq mm
2500 sq mm
50°C/W
100 sq mm
2500 sq mm
62°C/W
Table 2. TSSOP Measured Thermal Resistance
COPPER AREA
TOPSIDE
BOARD AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
2500 sq mm
2500 sq mm
40°C/W
1000 sq mm
2500 sq mm
45°C/W
225 sq mm
2500 sq mm
50°C/W
100 sq mm
2500 sq mm
62°C/W
The thermal resistance junction-to-case (θJC), measured
at the exposed pad on the back of the die, is 16°C/W.
Continuous operation at large input/output voltage differentials and maximum load current is not practical
due to thermal limitations. Transient operation at high
input/output differentials is possible. The approximate
thermal time constant for a 2500sq mm 3/32" FR-4 board
with maximum topside and backside area for one ounce
copper is 3 seconds. This time constant will increase as
more thermal mass is added (i.e., vias, larger board, and
other components).
3012fd
10
LT3012
APPLICATIONS INFORMATION
For an application with transient high power peaks, average
power dissipation can be used for junction temperature
calculations as long as the pulse period is significantly less
than the thermal time constant of the device and board.
Calculating Junction Temperature
Example 1: Given an output voltage of 5V, an input voltage range of 24V to 30V, an output current range of 0mA
to 50mA, and a maximum ambient temperature of 50°C,
what will the maximum junction temperature be?
The power dissipated by the device will be equal to:
IOUT(MAX) • (VIN(MAX) – VOUT) + (IGND • VIN(MAX))
where:
P3(72V in, 5mA load) = 5mA • (72V – 5V)
+ (200μA • 72V) = 0.35W
P4(72V in, 50mA load) = 50mA • (72V – 5V)
+ (1mA • 72V) = 3.42W
Operation at the different power levels is as follows:
76% operation at P1, 19% for P2, 4% for P3, and
1% for P4.
PEFF = 76%(0.23W) + 19%(2.20W) + 4%(0.35W)
+ 1%(3.42W) = 0.64W
With a thermal resistance in the range of 40°C/W to
62°C/W, this translates to a junction temperature rise
above ambient of 26°C to 38°C.
IOUT(MAX) = 50mA
High Temperature Operation
VIN(MAX) = 30V
Care must be taken when designing LT3012 applications to
operate at high ambient temperatures. The LT3012 works
at elevated temperatures but erratic operation can occur
due to unforeseen variations in external components. Some
tantalum capacitors are available for high temperature
operation, but ESR is often several ohms; capacitor ESR
above 3Ω is unsuitable for use with the LT3012. Ceramic
capacitor manufacturers (Murata, AVX, TDK, and Vishay
Vitramon at this writing) now offer ceramic capacitors that
are rated to 150°C using an X8R dielectric. Device instability
will occur if output capacitor value and ESR are outside
design limits at elevated temperature and operating DC
voltage bias (see information on capacitor characteristics
under Output Capacitance and Transient Response). Check
each passive component for absolute value and voltage
ratings over the operating temperature range.
IGND at (IOUT = 50mA, VIN = 30V) = 1mA
So:
P = 50mA • (30V – 5V) + (1mA • 30V) = 1.28W
The thermal resistance will be in the range of 40°C/W to
62°C/W depending on the copper area. So the junction
temperature rise above ambient will be approximately
equal to:
1.31W • 50°C/W = 65.5°C
The maximum junction temperature will then be equal to
the maximum junction temperature rise above ambient
plus the maximum ambient temperature or:
TJMAX = 50°C + 65.5°C = 115.5°C
Example 2: Given an output voltage of 5V, an input voltage
of 48V that rises to 72V for 5ms(max) out of every 100ms,
and a 5mA load that steps to 50mA for 50ms out of every
250ms, what is the junction temperature rise above ambient? Using a 500ms period (well under the time constant
of the board), power dissipation is as follows:
P1(48V in, 5mA load) = 5mA • (48V – 5V)
+ (200μA • 48V) = 0.23W
Leakages in capacitors or from solder flux left after
insuficient board cleaning adversely affects low
quiescent current operation. The output voltage resistor
divider should use a maximum bottom resistor value of
124k to compensate for high temperature leakage, setting
divider current to 10μA. Consider junction temperature
increase due to power dissipation in both the junction and
nearby components to ensure maximum specifications are
not violated for the device or external components.
P2(48V in, 50mA load) = 50mA • (48V – 5V)
+ (1mA • 48V) = 2.20W
3012fd
11
LT3012
APPLICATIONS INFORMATION
The LT3012 incorporates several protection features which
make it ideal for use in battery-powered circuits. In addition to the normal protection features associated with
monolithic regulators, such as current limiting and thermal
limiting, the device is protected against reverse-input voltages, and reverse voltages from output to input.
Like many IC power regulators, the LT3012 has safe operating area protection. The safe area protection decreases the
current limit as input voltage increases and keeps the power
transistor inside a safe operating region for all values of
input voltage. The protection is designed to provide some
output current at all values of input voltage up to the device
breakdown. The SOA protection circuitry for the LT3012
uses a current generated when the input voltage exceeds
25V to decrease current limit. This current shows up as
additional quiescent current for input voltages above 25V.
This increase in quiescent current occurs both in normal
operation and in shutdown (see curve of Quiescent Current
in the Typical Performance Characteristics).
Current limit protection and thermal overload protection
are intended to protect the device against current overload
conditions at the output of the device. For normal operation, the junction temperature should not exceed 125°C
(LT3012E) or 140°C (LT3012HFE).
The input of the device will withstand reverse voltages of
80V. No negative voltage will appear at the output. The
device will protect both itself and the load. This provides
protection against batteries which can be plugged in
backward.
The ADJ pin of the device can be pulled above or below
ground by as much as 7V without damaging the device.
If the input is left open circuit or grounded, the ADJ pin
will act like an open circuit when pulled below ground,
and like a large resistor (typically 100k) in series with a
diode when pulled above ground. If the input is powered
by a voltage source, pulling the ADJ pin below the reference voltage will cause the device to current limit. This
will cause the output to go to a unregulated high voltage.
Pulling the ADJ pin above the reference voltage will turn
off all output current.
In situations where the ADJ pin is connected to a resistor
divider that would pull the ADJ pin above its 7V clamp voltage if the output is pulled high, the ADJ pin input current
must be limited to less than 5mA. For example, a resistor
divider is used to provide a regulated 1.5V output from the
1.24V reference when the output is forced to 60V. The top
resistor of the resistor divider must be chosen to limit the
current into the ADJ pin to less than 5mA when the ADJ
pin is at 7V. The 53V difference between the OUT and ADJ
pins divided by the 5mA maximum current into the ADJ
pin yields a minimum top resistor value of 10.6k.
In circuits where a backup battery is required, several
different input/output conditions can occur. The output
voltage may be held up while the input is either pulled
to ground, pulled to some intermediate voltage, or is left
open circuit. Current flow back into the output will follow
the curve shown in Figure 4. The rise in reverse output
current above 7V occurs from the breakdown of the 7V
clamp on the ADJ pin. With a resistor divider on the
regulator output, this current will be reduced depending
on the size of the resistor divider.
200
REVERSE OUTPUT CURRENT (μA)
Protection Features
TJ = 25°C
180 VIN = 0V
VOUT = VADJ
160
140
120
100 CURRENT FLOWS
80 INTO OUTPUT PIN
ADJ
PIN CLAMP
(SEE ABOVE)
60
40
20
0
0
1
2
3 4 5 6 7 8
OUTPUT VOLTAGE (V)
9
10
3012 F04
Figure 4. Reverse Output Current
When the IN pin of the LT3012 is forced below the OUT
pin or the OUT pin is pulled above the IN pin, input current will typically drop to less than 2μA. This can happen
if the input of the LT3012 is connected to a discharged
(low voltage) battery and the output is held up by either
a backup battery or a second regulator circuit. The state
of the SHDN pin will have no effect on the reverse output
current when the output is pulled above the input.
3012fd
12
LT3012
TYPICAL APPLICATIONS
5V Buck Converter with Low Current Keep Alive Backup
D2
D1N914
6
VIN
5.5V*
TO 60V
4
C3
4.7μF
100V
CERAMIC
C2
0.33μF
BOOST
VIN
SW
2
14
SHDN
VOUT
5V
1A/250mA
D1
10MQ060N
LT1766
15
L1†
15μH
BIAS
SYNC
FB
GND
10
R1
15.4k
12
R2
4.99k
VC
+
C1
100μF 10V
SOLID
TANTALUM
1, 8, 9, 16 11
CC
1nF
14
OPERATING
CURRENT
IN
OUT
3
LT3012
11
SHDN
LOW HIGH
ADJ
GND
5
3012 TA03
750k
249k
1
* FOR INPUT VOLTAGES BELOW 7.5V,
SOME RESTRICTIONS MAY APPLY
†
INCREASE L1 TO 30μH FOR LOAD
CURRENTS ABOVE 0.6A AND TO
60μH ABOVE 1A
Buck Converter
Efficiency vs Load Current
100
VOUT = 5V
L = 68μH
VIN = 10V
EFFICIENCY (%)
90
VIN = 42V
80
70
60
50
0
0.25
0.75
1.00
0.50
LOAD CURRENT (A)
1.25
3012 TA04
3012fd
13
LT3012
TYPICAL APPLICATIONS
LT3012 Automotive Application
VIN
12V
(LATER 42V)
IN
+
1μF
NO PROTECTION
DIODE NEEDED!
OUT
LT3012
SHDN
750k
3.3μF
ADJ
GND
LOAD: CLOCK,
SECURITY SYSTEM
ETC
249k
OFF ON
LT3012 Telecom Application
VIN
48V
(72V TRANSIENT)
IN
1μF
OUT
LT3012
SHDN
+
750k NO PROTECTION
DIODE NEEDED!
ADJ
GND
3.3μF
LOAD:
SYSTEM MONITOR
ETC
–
BACKUP
BATTERY
249k
3012 TA05
OFF ON
Constant Brightness for Indicator LED over Wide Input Voltage Range
RETURN
IN
1μF
OFF ON
OUT
LT3012
SHDN
3.3μF
ADJ
GND
–48V
ILED = 1.24V/RSET
–48V CAN VARY FROM –4V TO –80V
RSET
3012 TA06
3012fd
14
LT3012
PACKAGE DESCRIPTION
DE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695)
4.00 ±0.10
(2 SIDES)
7
0.70 ±0.05
3.60 ±0.05
2.20 ±0.05
PIN 1
TOP MARK
PACKAGE (NOTE 6)
OUTLINE
0.25 ± 0.05
0.40 ± 0.10
12
R = 0.05
TYP
3.30 ±0.05
1.70 ± 0.05
R = 0.115
TYP
0.200 REF
0.50 BSC
3.30 ±0.10
3.00 ±0.10
(2 SIDES)
1.70 ± 0.10
0.75 ±0.05
6
0.25 ± 0.05
1
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
(UE12/DE12) DFN 0806 REV D
0.50 BSC
2.50 REF
2.50 REF
BOTTOM VIEW—EXPOSED PAD
0.00 – 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BB
4.90 – 5.10*
(.193 – .201)
3.58
(.141)
3.58
(.141)
16 1514 13 12 1110
6.60 ±0.10
9
2.94
(.116)
4.50 ±0.10
2.94 6.40
(.116) (.252)
BSC
SEE NOTE 4
0.45 ±0.05
1.05 ±0.10
0.65 BSC
1 2 3 4 5 6 7 8
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
MILLIMETERS
2. DIMENSIONS ARE IN
(INCHES)
3. DRAWING NOT TO SCALE
0.25
REF
1.10
(.0433)
MAX
0° – 8°
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
0.05 – 0.15
(.002 – .006)
FE16 (BB) TSSOP 0204
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
3012fd
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
LT3012
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LT1020
125mA, Micropower Regulator and Comparator VIN: 4.5V to 36V, VOUT(MIN) = 2.5V, VDO = 0.4V, IQ = 40μA, ISD = 40μA, Comparator
and Reference, Class B Outputs, S16, PDIP14 Packages
LT1120/LT1120A
125mA, Micropower Regulator and Comparator VIN: 4.5V to 36V, VOUT(MIN) = 2.5V, VDO = 0.4V, IQ = 40μA, ISD = 10μA,
Comparator and Reference, Logic Shutdown, Ref Sources and Sinks 2/4mA,
S8, N8 Packages
LT1121/LT1121HV
150mA, Micropower, LDO
VIN: 4.2V to 30/36V, VOUT(MIN) = 3.75V, VDO = 0.42V, IQ = 30μA, ISD = 16μA,
Reverse Battery Protection, SOT-223, S8, Z Packages
LT1129
700mA, Micropower, LDO
VIN: 4.2V to 30V, VOUT(MIN) = 3.75V, VDO = 0.4V, IQ = 50μA, ISD = 16μA,
DD, S0T-223, S8,TO220-5, TSSOP20 Packages
LT1676
60V, 440mA (IOUT), 100kHz, High Efficiency
Step-Down DC/DC Converter
VIN: 7.4V to 60V, VOUT(MIN) = 1.24V, IQ = 3.2mA, ISD = 2.5μA, S8 Package
LT1761
100mA, Low Noise Micropower, LDO
VIN: 1.8V to 20V, VOUT(MIN) = 1.22V, VDO = 0.3V, IQ = 20μA, ISD = <1μA,
Low Noise < 20μVRMS, Stable with 1μF Ceramic Capacitors, ThinSOT™ Package
LT1762
150mA, Low Noise Micropower, LDO
VIN: 1.8V to 20V, VOUT(MIN) = 1.22V, VDO = 0.3V, IQ = 25μA, ISD = <1μA,
Low Noise < 20μVRMS, MS8 Package
LT1763
500mA, Low Noise Micropower, LDO
VIN: 1.8V to 20V, VOUT(MIN) = 1.22V, VDO = 0.3V, IQ = 30μA, ISD = <1μA,
Low Noise < 20μVRMS, S8 Package
LT1764/LT1764A
3A, Low Noise, Fast Transient Response, LDO
VIN: 2.7V to 20V, VOUT(MIN) = 1.21V, VDO = 0.34V, IQ = 1mA, ISD = <1μA,
Low Noise < 40μVRMS, “A” Version Stable with Ceramic Capacitors,
DD, TO220-5 Packages
LT1766
60V, 1.2A (IOUT), 200kHz, High Efficiency
Step-Down DC/DC Converter
VIN: 5.5V to 60V, VOUT(MIN) = 1.2V, IQ = 2.5mA, ISD = 25μA, TSSOP16/E Package
LT1776
40V, 550mA (IOUT), 200kHz, High Efficiency
Step-Down DC/DC Converter
VIN: 7.4V to 40V, VOUT(MIN) = 1.24V, IQ = 3.2mA, ISD = 30μA, N8, S8 Packages
LT1934/LT1934-1
300mA/60mA, (IOUT), Constant Off-Time, High
Efficiency Step-Down DC/DC Converter
90% Efficiency, VIN: 3.2V to 34V, VOUT(MIN) = 1.25V, IQ = 14μA, ISD = <1μA,
ThinSOT Package
LT1956
60V, 1.2A (IOUT), 500kHz, High Efficiency
Step-Down DC/DC Converter
VIN: 5.5V to 60V, VOUT(MIN) = 1.2V, IQ = 2.5mA, ISD = 25μA, TSSOP16/E Package
LT1962
300mA, Low Noise Micropower, LDO
VIN: 1.8V to 20V, VOUT(MIN) = 1.22V, VDO = 0.27V, IQ = 30μA, ISD = <1μA,
Low Noise < 20μVRMS, MS8 Package
LT1963/LT1963A
1.5A, Low Noise, Fast Transient Response, LDO
VIN: 2.1V to 20V, VOUT(MIN) = 1.21V, VDO = 0.34V, IQ = 1mA, ISD = <1μA,
Low Noise < 40μVRMS, “A” Version Stable with Ceramic Capacitors,
DD, TO220-5, S0T-223, S8 Packages
LT1964
200mA, Low Noise Micropower, Negative LDO
VIN: –1.9V to –20V, VOUT(MIN) = –1.21V, VDO = 0.34V, IQ = 30μA, ISD = 3μA,
Low Noise < 30μVRMS, Stable with Ceramic Capacitors, ThinSOT Package
LT3010/LT3010H
50mA, 3V to 80V, Low Noise Micropower LDO
VIN: 3V to 8V, VOUT(MIN) = 1.275V, VDO = 0.3V, IQ = 30μA, ISD = 1μA,
Low Noise < 100μVRMS, MS8E Package, H Grade = +140°C TJMAX.
LT3013/LT3013H
250mA, 4V to 80V, Low Dropout Micropower
Linear Regulator with PWRGD
VIN: 4V to 80V, VOUT: 1.24V to 60V, VDO = 0.4V, IQ = 65μA, ISD = <1μA,
Power Good Feature; TSSOP-16E and 4mm × 3mm DFN-12 Packages,
H Grade = +140°C TJMAX.
LT3014/HV
20mA, 3V to 80V, Low Dropout Micropower
Linear Regulator
VIN: 3V to 80V (100V for 2ms, HV version), VOUT: 1.22V to 60V, VDO = 0.35V,
IQ = 7μA, ISD = <1μA, ThinSOT and 3mm × 3mm DFN-8 Packages.
ThinSOT is a trademark of Linear Technology Corporation.
3012fd
16 Linear Technology Corporation
LT 0508 REV D • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2005