AP2166 76

AP2166/ AP2176
1A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH
Description
Pin Assignments
The AP2166 and AP2176 are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and
available with both polarities of Enable input. They offer current and
thermal limiting and short-circuit protection as well as controlled rise
time and under-voltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false overcurrent reporting
and does not require any external components.
( Top View )
EN1
All devices are available in SO-8 and MSOP-8EP packages.
8
FLG1 2
7
FLG2 3
6
GND
EN2 4
5
OUT2




( Top View )
Dual USB port power switches
Overcurrent and thermal protection
1.5A accurate current limiting
Reverse Current Blocking
90mΩ on-resistance
Input voltage range: 2.7V - 5.5V
0.6ms typical rise time
Very low shutdown current: 1µA (max)
Fault report (FLG) with blanking time (7ms typ)
ESD protection: 6KV HBM, 300V MM
Active low (AP2166) or active high (AP2176) enable
Ambient temperature range -40°C to +85°C
SO-8 and MSOP-8EP (Exposed Pad): Available in “Green”
Molding Compound (No Br, Sb)
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Notes:
IN
SO-8
Features













OUT1
1
EN1
1
8
OUT1
FLG1
2
7
IN
FLG2
3
6
GND
EN2
4
5
OUT2
MSOP-8EP
Applications



Consumer Electronics – LCD TVs & Monitors, Game Machines
Communications – Set-Top-Boxes, GPS, Smartphones
Computing – Laptops, Desktops, Servers, Printers, Docking
Stations, HUBs
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Typical Applications Circuit
Power Supply
2.7V to 5.5V
IN
10k
10k
10uF
OFF
AP2166/ AP2176
Document number: DS31814 Rev. 4 - 2
0.1uF
68uF
0.1uF
68uF
0.1uF
FLG1
FLG2
ON
Load
OUT1
EN1
EN2
OUT2
Load
GND
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AP2166/ AP2176
Available Options
Part Number
Channel
Enable Pin
(EN)
Current Limit
(typ)
Recommended Maximum
Continuous Load Current
AP2166
AP2176
2
2
Active Low
Active High
1.5A
1.5A
1.0A
1.0A
Pin Descriptions
Pin Name
EN1
FLG1
FLG2
EN2
OUT2
GND
IN
OUT1
Exposed Pad
Pin Number
SO-8
MSOP-8EP
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
—
Function
Switch 1 enable input, active low (AP2166) or active high (AP2176)
Switch 1 over-current and over-temperature fault report, open-drain
Switch 2 over-current and over-temperature fault report, open-drain
Switch 2 enable input, active low (AP2166) or active high (AP2176)
Switch 2 voltage output pin
Ground
Voltage input pin
Switch 1 voltage output pin
Exposed Pad:
Exposed Pad It should be connected externally to GND and thermal mass for enhanced thermal impedance.
It should not be used as electrical ground conduction path.
Functional Block Diagram
FLG1
Thermal
Sense
Deglitch
EN1
Driver
Current
Limit
GND
UVLO
CS
OUT1
CS
OUT2
Reverse
blocking
IN
Reverse
blocking
UVLO
EN2
FLG2
Driver
Current
Limit
Deglitch
Thermal
Sense
AP2166/ AP2176
Document number: DS31814 Rev. 4 - 2
GND
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AP2166/ AP2176
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
ESD HBM
ESD MM
Rating
Unit
6
300
kV
V
6.5
V
VOUT
Output Voltage
VIN +0.3
V
VEN , VFLG
Enable Voltage
6.5
V
Internal Limited
A
+150
°C
-65 to +150
°C
VIN
ILOAD
TJ(MAX)
TST
Note:
Parameter
Human Body Model ESD Protection
Machine Model ESD Protection
Input Voltage
Maximum Continuous Load Current
Maximum Junction Temperature
Storage Temperature Range (Note 4)
4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C).
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
Parameter
Min
Max
Units
2.7
5.5
V
Output Current
0
1.0
A
VIL
Low-Level Input Voltage on EN or EN
0
0.8
V
VIH
High-Level Input Voltage on EN or EN
TA
Operating Ambient Temperature
VIN
Input Voltage
IOUT
AP2166/ AP2176
Document number: DS31814 Rev. 4 - 2
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2
VIN
V
-40
+85
C
May 2016
© Diodes Incorporated
AP2166/ AP2176
Electrical Characteristics
Symbol
(@TA = +25°C, CIN = 10µF, VIN = +5V, unless otherwise specified.)
Parameter
Test Conditions
Min
Typ
Max
Unit
1.6
1.9
2.5
V
Disabled, IOUT = 0
-
0.5
1
µA
Enabled, IOUT = 0
-
95
140
µA
Input Leakage Current
Disabled, OUT grounded
-
-
1
µA
Reverse Leakage Current
Disabled, VIN = 0V, VOUT = 5V, IREV at VIN
-
1
-
µA
-
90
100
135
135
mΩ
mΩ
VUVLO
Input UVLO
RLOAD = 1kΩ
ISHDN
Input Shutdown Current
Input Quiescent Current, Dual
ILEAK
IREV
IQ
VIN = 5V, IOUT = 1A, -40°C ≤ TA ≤ +85°C
MSOP-8EP
SO-8
RDS(ON)
Switch On-Resistance
VIN = 3.3V, IOUT = 1A, -40°C ≤ TA ≤ +85°C
-
120
160
mΩ
ISHORT
Short-Circuit Current Limit
Enabled into short circuit, CL = 68µF
-
1.5
-
A
Overload Current Limit
VIN = 5V, VOUT = 4.8V, CL = 120µF, -40°C ≤ TA ≤ +85°C
1.1
1.5
1.9
A
2.0
-
A
ILIMIT
Current Limiting Trigger Threshold
VIN = VEN, Output Current Slew rate (<100A/WS), CL = 68µF
-
TSHORT
Short-Circuit Response Time
VOUT = 0V to IOUT = ILIMIT (short applied to output), CL = 68µF
-
20
-
µs
VIL
EN Input Logic Low Voltage
VIN = 2.7V to 5.5V
-
-
0.8
V
VIH
EN Input Logic High Voltage
VIN = 2.7V to 5.5V
2
-
-
V
ISINK
ITrig
EN Input Leakage
VEN = 5V
-
-
1
µA
TD(ON)
Output Turn-on Delay Time
CL=1µF, RLOAD = 10Ω
-
0.05
-
ms
TR
Output Turn-on Rise Time
CL=1µF, RLOAD = 10Ω
-
0.6
1.5
ms
TD(OFF)
Output Turn-off Delay Time
CL=1µF, RLOAD = 10Ω
-
0.01
-
ms
ms
Output Turn-off Fall Time
CL=1µF, RLOAD = 10Ω
-
0.05
0.1
RFLG
FLG Output FET on-Resistance
IFLG =10mA
-
20
40
Ω
IFOH
Error Flag Iff Current
VFLG = 5V
-
0.01
1
µA
TBlank
FLG Blanking Time
CL = 68µF
4
7
15
ms
TSHDN
Thermal Shutdown Threshold
Enabled, RLOAD = 1kΩ
-
+140
-
C
THYS
Thermal Shutdown Hysteresis
-
-
+25
-
C
-
110
60
-
°C/W
°C/W
TF
θJA
Notes:
SO-8 (Note 5)
Thermal Resistance Junction-to-Ambient
MSOP-8EP (Note 6)
5. Test condition for SO-8: Device mounted on FR-4 2-layer board, 2oz. copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on FR-4 2-layer board, 2oz. copper, with minimum recommended pad on top layer and 3 vias to bottom
layer ground plane.
AP2166/ AP2176
Document number: DS31814 Rev. 4 - 2
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AP2166/ AP2176
Typical Performance Characteristics
VEN
50%
TD(ON)
10%
TD(OFF)
TR
TF
90%
50%
50%
TD(OFF)
TR
VOUT
VEN
50%
TD(ON)
90%
VOUT
10%
TF
90%
10%
90%
10%
Figure 1 Voltage Waveforms: AP2166 (left), AP2176 (right)
All Enable Plots are for AP2176 Active High
Ven 1
5V/div
Ven 1
5V/div
Vout 1
2V/div
Vout 1
2V/div
CL=1µF
TA= +25°C
RL=10Ω
CL=1µF
TA= +25°C
RL=10Ω
500µs/div
Channel 1 Turn-On Delay and Rise Time
AP2166/ AP2176
Document number: DS31814 Rev. 4 - 2
500µs/div
Channel 1 Turn-Off Delay and Fall Time
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AP2166/ AP2176
Typical Performance Characteristics (continued)
Ven 2
5V/div
Ven 2
5V/div
Vout 2
2V/div
Vout 2
2V/div
CL=1µF
TA= +25°C
RL=10Ω
CL=1µF
TA= +25°C
RL=10Ω
500µs/div
Channel 2 Turn-Off Delay and Fall Time
500µs/div
Channel 2 Turn-On Delay and Rise Time
Ven 1
5V/div
Ven 1
5V/div
CL=100µF
Vout 1
2V/div
TA= +25°C
Vout 1
2V/div
RL=10Ω
CL=100µF
TA= +25°C
RL=10Ω
500µs/div
Channel 1 Turn-Off Delay and Fall Time
500µs/div
Channel 1 Turn-On Delay and Rise Time
Ven 2
5V/div
Ven 2
5V/div
CL=100µF
TA= +25°C
Vout 2
2V/div
Vout 2
2V/div
RL=10Ω
CL=100µF
TA= +25°C
RL=10Ω
500µs/div
Channel 2 Turn-Off Delay and Fall Time
500µs/div
Channel 2 Turn-On Delay and Rise Time
AP2166/ AP2176
Document number: DS31814 Rev. 4 - 2
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AP2166/ AP2176
Typical Performance Characteristics (cont.)
Ven 1
5V/div
Ven 2
5V/div
Iout 1
500mA/div
Iout 2
500mA/div
VIN=5V
VIN=5V
TA= +25°C
TA= +25°C
CL=68µF
CL=68µF
500µs/div
Channel 1 Short Circuit Current,
Device Enabled Into Short
Ven 1
5V/div
500µs/div
Channel 2 Short Circuit Current,
Device Enabled Into Short
Ven 2
5V/div
CL=100µF
CL=100µF
VIN=5V
VIN=5V
TA= +25°C
TA= +25°C
RL=5Ω
RL=5Ω
Iout 1
200mA/div
Iout 2
200mA/div
CL=470µF
CL=470µF
CL=220µF
CL=220µF
1ms/div
Channel 2 Inrush Current
1ms/div
Channel 1 Inrush Current
VIN=5V
TA= +25°C
Vflag 1
2V/div
CL=68µF
Iout 1
1A/div
VIN=5V
TA= +25°C
Vflag 1
2V/div
CL=68µF
Iout 1
1A/div
2ms/div
Channel 1
1Ω Load Connected to Enabled Device
AP2166/ AP2176
Document number: DS31814 Rev. 4 - 2
2ms/div
Channel 1
2Ω Load Connected to Enabled Device
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AP2166/ AP2176
Typical Performance Characteristics (cont.)
VIN=5V
TA= +25°C
Vflag 2
2V/div
CL=68µF
VIN=5V
TA= +25°C
Vflag 2
2V/div
CL=68µF
Iout 2
1A/div
Iout 2
1A/div
2ms/div
Channel 2
2Ω Load Connected to Enabled Device
2ms/div
Channel 2
1Ω Load Connected to Enabled Device
Vout
5V/div
VIN=5V
TA= +25°C
Vout
5V/div
VIN=5V
TA= +25°C
CL=68µF
CL=68µF
Iout
500mA/div
Vflag
5V/div
Iout
1A/div
Iout
1A/div
20ms/div
Channel 1
Short Circuit with Blanking Time and Recovery
20ms/div
Channel 2
Short Circuit with Blanking Time and Recovery
Vflag
5V/div
Vflag
5V/div
Iout
500mA/div
TA= +25°C
Iout
500mA/div
TA= +25°C
CL=68µF
CL=68µF
RL=5Ω
RL=5Ω
Ven
5V/div
Ven
5V/div
Vin
5V/div
Vin
5V/div
1ms/div
Channel 2 Power On
1ms/div
Channel 1 Power On
AP2166/ AP2176
Document number: DS31814 Rev. 4 - 2
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AP2166/ AP2176
Typical Performance Characteristics (cont.)
TA= +25°C
Vin
2V/div
CL=68µF
Vin
2V/div
RL=5Ω
TA= +25°C
CL=68µF
RL=5Ω
Iout
500mA/div
Iout
500mA/div
10ms/div
Channel 1 UVLO Decreasing
1ms/div
Channel 1 UVLO Increasing
TA= +25°C
Vin
2V/div
CL=68µF
Vin
2V/div
RL=5Ω
TA= +25°C
CL=68µF
RL=5Ω
Iout
500mA/div
Iout
500mA/div
10ms/div
Channel 2 UVLO Decreasing
1ms/div
Channel 2 UVLO Increasing
Vout 1
5V/div
Ven1
5V/div
Vout 2
5V/div
Vflag 1
5V/div
Vout 1
5V/div
TA= +25°C
Ven2
5V/div
Iout 2
500mA/div
Vout 2
5V/div
100ms/div
Channel 1 Enabled and Shorted with Channel 2
Disabled
AP2166/ AP2176
Document number: DS31814 Rev. 4 - 2
TA= +25°C
CL=68µF
CL=68µF
50ms/div
Channel 1 Disabled and Channel 2 Enabled
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AP2166/ AP2176
Typical Performance Characteristics (cont.)
Turn-Off Time vs Input Voltage
750
30
700
29
CL=1µF
650
29
RL=10Ω
28
TA= +25°C
Turn-Off Time (us)
Turn-On Time (us)
Turn-On Time vs Input Voltage
600
550
500
450
28
27
27
400
CL=1µF
350
RL=10Ω
26
300
TA= +25°C
26
25
250
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1.5
6
2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Input Voltage (V)
Fall Time vs Input Voltage
Rise Time vs Input Voltage
22
650
600
22
Fall Time (us)
Rise Time (us)
550
500
450
400
CL=1µF
350
RL=10Ω
300
TA= +25°C
21
21
CL=1µF
20
RL=10Ω
20
TA= +25°C
19
250
2
2.5
3
3.5
4
4.5
5
5.5
2
6
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Input Voltage (V)
Supply Current, Output Disabled vs Ambient Temperature
Supply Current, Output Enabled vs Ambient Temperature
63
Supply Current, Output Disabled (uA)
Supply Current, Output Enabled (uA)
68
Vin=5.0V
58
Vin=5.5V
53
48
43
38
Vin=3.3V
33
Vin=2.7V
Vin=5.5V
0.8
Vin=3.3V
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Vin=2.7V
0.0
28
-60
-40
-20
0
20
40
60
80
100
-60
Document number: DS31814 Rev. 4 - 2
-40
-20
0
20
40
60
80
100
Ambient Temperature (°C)
Ambient Temperature (°C)
AP2166/ AP2176
Vin=5.0V
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AP2166/ AP2176
Typical Performance Characteristics (cont.)
Short-Circuit Output Current vs Ambient Temperature
Static Drain-Source On-State Resistance vs Ambient
Temperature
1.56
Short-Circuit Output Current (A)
170
Static Drain-Source On-State
Resistance (mΩ)
Vin=2.7V
160
150
140
130
Vin=3.3V
120
110
100
Vin=5V
90
80
1.55
CL=100µF
1.54
Vin=3.3V
Vin=2.7V
1.53
Vin=5.0V
1.52
1.51
1.50
1.49
1.48
1.47
1.46
Vin=5.5V
1.45
-60
-40
-20
0
20
40
60
80
100
-60
-40
-20
Ambient Temperature (°C)
0
20
40
60
80
100
Ambient Temperature (°C)
Threshold Trip Current vs Input Voltage
Undervoltage Lockout vs Ambient Temperature
1.99
2.20
Threshold Trip Current (A)
Undervoltage Lockout (V)
1.98
2.10
2.00
UVLO Rising
1.90
1.80
UVLO Falling
1.70
1.97
1.96
1.95
1.94
1.93
1.92
TA= +25°C
1.91
CL=68µF
1.90
1.89
1.88
1.60
-60
-40
-20
0
20
40
60
80
100
2.8
3.3
3.8
4.3
4.8
5.3
Input Voltage (V)
Ambient Temperature (°C)
Current Limit Response vs Peak Current
Current Limit Response (us)
120
100
80
VIN=5V
60
TA= +25°C
CL=68µF
40
20
0
0
2
4
6
8
10
12
Peak Current (A)
AP2166/ AP2176
Document number: DS31814 Rev. 4 - 2
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AP2166/ AP2176
Application Information
Power Supply Considerations
A 0.01-μF to 0.1-μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input (10-μF minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces
power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor improves
the immunity of the device to short-circuit transients.
Overcurrent and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN
has been applied. The AP2166/AP2176 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may
flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the overcurrent trip
threshold), the device switches into current limiting mode and the current is clamped at I LIMIT.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2166/AP2176 is capable of delivering current up
to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode
and is set at ILIMIT.
Note that when the output has been shorted to GND at extremely low temperature (< -30°C), a minimum 120-μF electrolytic capacitor on the output
pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that
capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature
characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic
capacitor type is Panasonic FC series.
FLG Response
When an overcurrent or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both overcurrent and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary overcurrent condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2166/AP2176 is designed to eliminate false overcurrent reporting without the need of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON)× I2
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where:
TA= Ambient temperature C
RθJA = Thermal resistance
PD = Total power dissipation
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2166/AP2176 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately +140°C due to excessive power dissipation in an overcurrent or short-circuit condition the internal thermal sense
circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the
device to cool down approximately +25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input
power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or overcurrent occurs with 7-ms deglitch.
AP2166/ AP2176
Document number: DS31814 Rev. 4 - 2
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AP2166/ AP2176
Application Information (continued)
Undervoltage Lockout (UVLO)
Undervoltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even
if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design
of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Host/Self-Powered HUBs
Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This
power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts
and SPHs are required to have current-limit protection and must report overcurrent conditions to the USB controller. Typical SPHs are desktop
PCs, monitors, printers, and stand-alone hubs.
Downstream
USB Ports
Power Supply
3.3V
5V
D+
DVBUS
AP2166
IN
OUT1
0.1uF
USB
Controller
0.1uF
FLG1
EN1
FLG2
EN2
68uF
D+
DVBUS
OUT2
GND
GND
0.1uF
68uF
GND
Figure 2 Typical Two-Port USB Host/ Self-Powered Hub
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or PC boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP2166/AP2176, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2166/AP2176 also ensures that the switch is off
after the card has been removed, and that the switch is off during the next insertion.
By placing the AP2166/AP2176 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The
typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system
surge current and provides a hot-plugging mechanism for any device.
AP2166/ AP2176
Document number: DS31814 Rev. 4 - 2
13 of 17
www.diodes.com
May 2016
© Diodes Incorporated
AP2166/ AP2176
Ordering Information
AP 21 X 6 XX G - 13
Enable
Channel
Package
Green
Packing
6 : Active Low
7 : Active High
6 : 2 Channel
S : SO-8
MP : MSOP-8EP
G : Green
13 : Tape & Reel
Part Number
Package Code
Packaging
AP21X6SG-13
AP21X6MPG-13
S
MP
SO-8
MSOP-8EP
Quantity
13” Tape and Reel
Part Number Suffix
2,500/Tape & Reel
2,500/Tape & Reel
-13
-13
Marking Information
(1)
SO-8
( Top view )
8
7
6
5
Logo
Part Number
6 : Active Low
7 : Active High
YY WW X X
1
(2)
6 : 2 Channel
G : Green
YY : Year : 08, 09,10~
WW : Week : 01~52; 52
represents 52 and 53 week
X : Internal Code
AP21X X
2
3
4
MSOP-8EP
AP2166/ AP2176
Document number: DS31814 Rev. 4 - 2
14 of 17
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May 2016
© Diodes Incorporated
AP2166/ AP2176
Package Outline Dimensions (All dimensions in mm.)
Please see http://www.diodes.com/package-outlines.html for the latest version.
0.254
(1) Package type: SO-8
E1 E
Gauge Plane
Seating Plane
A1
L
Detail ‘A’
7°~9°
h
45°
Detail ‘A’
A2 A A3
b
e
D
(2)
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82

0
8
All Dimensions in mm
Package type: MSOP-8EP
D
4X
10
°
0.25
D1
x
E
E2
Gauge Plane
Seating Plane
a
y
1
4X
10
°
8Xb
e
Detail C
E3
A1
A3
L
c
A2
A
D
E1
See Detail C
AP2166/ AP2176
Document number: DS31814 Rev. 4 - 2
15 of 17
www.diodes.com
MSOP-8EP
Dim Min Max Typ
A
1.10
A1
0.05 0.15 0.10
A2
0.75 0.95 0.86
A3
0.29 0.49 0.39
b
0.22 0.38 0.30
c
0.08 0.23 0.15
D
2.90 3.10 3.00
D1
1.60 2.00 1.80
E
4.70 5.10 4.90
E1
2.90 3.10 3.00
E2
1.30 1.70 1.50
E3
2.85 3.05 2.95
e
0.65
L
0.40 0.80 0.60
a
0°
8°
4°
x
0.750
y
0.750
All Dimensions in mm
May 2016
© Diodes Incorporated
AP2166/ AP2176
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
(1) Package type: SO-8
X
Dimensions
X
Y
C1
C2
C1
Value (in mm)
0.60
1.55
5.4
1.27
C2
Y
(2)
Package type: MSOP-8EP
X
C
Y
G
Y2
Dimensions
C
G
X
X1
Y
Y1
Y2
Y1
X1
AP2166/ AP2176
Document number: DS31814 Rev. 4 - 2
16 of 17
www.diodes.com
Value
(in mm)
0.650
0.450
0.450
2.000
1.350
1.700
5.300
May 2016
© Diodes Incorporated
AP2166/ AP2176
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
www.diodes.com
AP2166/ AP2176
Document number: DS31814 Rev. 4 - 2
17 of 17
www.diodes.com
May 2016
© Diodes Incorporated
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