BCX19 HZG Datasheet NPN small signal transistor AEC-Q101 Qualified l Outline Parameter Value VCES 50V IC 500mA SOT-23 SST3 l Features l Inner circuit 1)High gain and low saturation voltage. 2)Complements the BCX17 HZG. l Application AUDIO FREQUENCY SMALL SIGNAL AMPLIFIER l Packaging specifications Part No. Package Package size Taping code BCX19 HZG SOT-23 (SST3) 2924 T116 Reel size Tape width (mm) (mm) 180 8 Basic ordering unit.(pcs) Marking 3000 GU1 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 1/6 20160613 - Rev.001 BCX19 HZG Datasheet l Absolute maximum ratings (Ta = 25°C) Parameter Symbol Values Unit VCES 50 V VCEO 45 V VEBO 5 V IC 500 mA ICP 1 A PD*1 200 mW PD*2 350 mW PD*3 425 mW Tj 150 ℃ Tstg -65 to +150 ℃ Collector-emitter voltage Emitter-base voltage Collector current Power dissipation Junction temperature Range of storage temperature l Electrical characteristics (Ta = 25°C) Parameter Symbol Conditions Values Min. Typ. Max. Unit Collector-emitter breakdown voltage BVCES IC = 50μA 50 - - V BVCEO IC = 10mA 45 - - V Emitter-base breakdown voltage BVEBO IE = 50μA 5 - - V VCB = 20V - - 100 nA VCB = 20V, Ta = 150℃ - - 5 μA VEB = 5V - - 10 μA Collector cut-off current Emitter cut-off current ICBO IEBO Collector-emitter saturation voltage VCE(sat) IC = 500mA, IB = 50mA - - 620 mV Base-emitter turn on voltage VBE(on) VCE = 1V, IC = 500mA - - 1.2 V DC current gain Transition frequency hFE1 VCE = 1V, IC = 100mA 100 - 600 hFE2 VCE = 1V, IC = 300mA 70 - - hFE3 VCE = 1V, IC = 500mA 40 - - fT VCE = 5V, IE = -20mA, f = 100MHz - 250 - - MHz *1 Each terminal mounted on a reference land. *2 Mounted on a ceramic board(7.0×5.0×0.6mm). *3 Mounted on a ceramic board(15×15×0.6mm). www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 2/6 20160613 - Rev.001 BCX19 HZG Datasheet l Electrical characteristic curves(Ta = 25°C) Fig.1 Ground Emitter Propagation Characteristics Fig.2 Grounded Emitter Output Characteristics Fig.3 DC Current Gain vs. Collector Current (I) Fig.4 DC Current Gain vs. Collector Current (lI) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 3/6 20160613 - Rev.001 BCX19 HZG Datasheet l Electrical characteristic curves(Ta = 25°C) Fig.5 Collector-Emitter Saturation Voltage vs. Collector Current(l) Fig.6 Collector-Emitter Saturation Voltage vs. Collector Current(ll) Fig.7 Base-Emitter Saturation Voltage vs. Collector Current (I) Fig.8 Gain Bandwith Product vs. Emitter Current www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 4/6 20160613 - Rev.001 BCX19 HZG Datasheet l Electrical characteristic curves(Ta = 25°C) Fig.9 Collector Output Capacitance vs. Collector-Base Voltage Emitter Input Capacitance vs. Emitter-Base Voltage Fig.10 Safe Operating Area www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 5/6 20160613 - Rev.001 BCX19 HZG Datasheet l Dimensions www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 6/6 20160613 - Rev.001 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. 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Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003