MLX90603 Tire Pressure Monitoring SiP Low-Power Pressure Sensor Features and Benefits Low-Power Microcontroller-based Pressure-Temperature-Battery monitor, ideally suited for TPMS Measurement of car and truck tire pressure with 1% precision Sleep current < 1uA during operation, Run mode < 1mA Delivered as a fully tested and calibrated component Flash version compatible with ROM package, for development and small series Temperature compensation of sensors and timers Diagnostics for system error detection Robust package that withstands shocks up to 2000 G 5 digital IO’s to control the wireless RF transmitter or external IC’s Operation with internal RC clock for low-cost, or with external RF clock for very stable data-rate Compatible with existing RKE systems (remote keyless entry) LF interface for short-range wireless communication using 125KHz Applications Continuous car and truck Tire Pressure Monitoring System (TPMS) Low-Power Wireless Pressure-Temperature-Battery sensor Ordering Information Part No. MLX90603 Temperature Code K (-40°C to 125°C) Package Code DF (SO-wide) Memory code(*) Absolute Pressure range(**) BF (FLASH) B (0 – 700 kPa) XX (ROM) C (0 – 1500 kPa) (*) dedicated ROM code is assigned after customer ROM order (**) other pressure ranges are available on demand 1 Functional diagram 2 General description MLX90603 RF RFID MLX10111 TH720x 3901090603 Rev.002 Delivery Form 1500 pc/T&R The MLX90603 is a System in a Package (SIP) pressure sensor, combining an analog pressure sensor and a low-power sensor interface with micro-controller MLX10111, in a plastic SO16 package. Its primary use is in wireless TPMS applications, using any RF transmitter, the system can be made compliant with existing Remote Keyless Entry (RKE) systems. Power consumption in standby is less than 1uA, power during periodic sensing is reduced with the low-power microcontroller (typical <1mA). The MLX90603 offers 1% Full Scale accuracy. Pressure ranges of 7 and 15 Bar are available, other ranges are on demand. The robust sensor has a burst pressure >50 bar. Page 1 of 18 19 July 2007 MLX90603 Tire Pressure Monitoring SiP Low-Power Pressure Sensor Table of Contents 1 FUNCTIONAL DIAGRAM............................................................................................................................. 1 2 GENERAL DESCRIPTION ........................................................................................................................... 1 3 GLOSSARY OF TERMS............................................................................................................................... 3 4 ABSOLUTE MAXIMUM RATINGS............................................................................................................... 3 5 SPECIFICATIONS ........................................................................................................................................ 4 5.1 POWER DOWN/UP SPECIFICATION ................................................................................................................................................... 4 5.2 GENERAL CURRENT CONSUMPTION ................................................................................................................................................ 4 5.3 TIMING SPECIFICATIONS ................................................................................................................................................................ 5 5.4 SENSOR SPECIFIC SPECIFICATIONS ................................................................................................................................................ 5 5.5 RFID INTERFACE SPECIFIC SPECIFICATIONS ................................................................................................................................... 6 6 DETAILED DESCRIPTION........................................................................................................................... 7 6.1 ARCHITECTURE ............................................................................................................................................................................. 7 6.2 MEMORIES................................................................................................................................................................................. 8 6.2.1 EEPROM ............................................................................................................................................................................. 8 6.2.2 RAM..................................................................................................................................................................................... 8 6.2.3 ROM/FLASH........................................................................................................................................................................ 8 6.3 INTERRUPTS ................................................................................................................................................................................. 8 6.4 MEASUREMENT FUNCTIONS ............................................................................................................................................................ 8 6.4.1 Absolute Pressure sensor .................................................................................................................................................... 8 6.4.2 Temperature sensor............................................................................................................................................................. 8 6.4.3 Voltage sensor..................................................................................................................................................................... 8 6.4.4 External sensor.................................................................................................................................................................... 9 6.5 COMMUNICATION INTERFACE .......................................................................................................................................................... 9 6.5.1 RF transmission ................................................................................................................................................................... 9 6.5.2 RFID or LF interface............................................................................................................................................................. 9 6.6 POWER MANAGEMENT ................................................................................................................................................................... 9 6.7 OSCILLATORS ............................................................................................................................................................................... 9 7 APPLICATION INFORMATION.................................................................................................................. 10 7.1 DEMO BOARD .............................................................................................................................................................................. 10 7.2 UNIQUE FEATURES ...................................................................................................................................................................... 10 7.3 CURRENT CONSUMPTION ............................................................................................................................................................. 11 7.3.1 SHELF MODE.................................................................................................................................................................... 11 7.3.2 SLEEP MODE.................................................................................................................................................................... 11 7.3.3 RUN MODE ....................................................................................................................................................................... 11 7.3.4 IDLE MODE ....................................................................................................................................................................... 11 7.3.5 Battery life time calculation example .................................................................................................................................. 13 7.4 TEMPERATURE SHUT DOWN.......................................................................................................................................................... 13 7.5 MOTION DETECTION ..................................................................................................................................................................... 14 7.6 LF INITIATION .............................................................................................................................................................................. 14 7.7 TOOLS AND LIBRARIES ................................................................................................................................................................. 14 7.7.1 Tools.................................................................................................................................................................................. 14 7.7.2 Standard library.................................................................................................................................................................. 14 8 OTHER PRODUCT REFERENCES ........................................................................................................... 14 9 STANDARD INFORMATION REGARDING MANUFACTURABILITY OF MELEXIS PRODUCTS WITH DIFFERENT SOLDERING PROCESSES ..................................................................................................... 15 10 ESD PRECAUTIONS................................................................................................................................ 15 11 PACKAGE INFORMATION ...................................................................................................................... 16 11.1 PIN DESCRIPTION FOR MLX90603.............................................................................................................................................. 16 11.2 SO16 PACKAGE OUTLINE ........................................................................................................................................................... 17 12 DISCLAIMER ............................................................................................................................................ 18 3901090603 Rev.002 Page 2 of 18 19 July 2007 MLX90603 Tire Pressure Monitoring SiP Low-Power Pressure Sensor 3 Glossary of Terms VLFO LFO HFO POR MFD SFD SIP RESOLUTION ACCURACY VERY LOW FREQUENCY OSCILLATOR. LOW FREQUENCY OSCILLATOR: HIGH FREQUENCY OSCILLATOR POWER ON RESET/POWER DOWN MEDIUM FIELD DETECTOR STRONG FIELD DETECTOR SYSTEM IN A PACKAGE 2.5 NOISE LEVEL ABSOLUTE ACCURACY INCLUDING NON-LINEARITIES, OFFSETS AND RESOLUTION. 1 bar = 14.5038 psi (Pound per square inch) = 750.0639973 mmHg (height mercury) = 100 kPa 4 Absolute maximum ratings Parameter. Units Supply Voltage, VDD (overvoltage) 6V Supply Voltage, VDD (operating) 3.6V Reverse Voltage Protection -0.5V Supply Current, IDD 4mA Operating Temperature Range, Tamb -40 to +125°C Operating Temperature Range, Tamb, 10 hours +125 to 150°C Storage Temperature Range, TS 150°C ESD Sensitivity (AEC Q100 002) 1kV ESD Sensitivity on COIL1 COIL2 pins (AEC Q100 002) 1kV Table 1: Absolute maximum ratings Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximumrated conditions for extended periods may affect device reliability. 3901090603 Rev.002 Page 3 of 18 19 July 2007 MLX90603 Tire Pressure Monitoring SiP Low-Power Pressure Sensor 5 Specifications 5.1 Power down/Up specification Parameter. Power down Reset Power up Hysteresis Symbol VPDR-40 VPDR25 Test Conditions -40oC Min Typ Max 1.8 Units V 25oC 1.9 V VPDR85 85oC 2.1 V VPDR125 125oC 2.2 V VPUR_hyst Power Up level – Power Down Level 0.2 V 2.2 2 1.8 1.6 Power Down Level Table 2: Power Down/Up specifications -40°C 0°C 40°C 80°C 120°C Temperature (°C) Note: the Power down level is the lowest voltage at which IC operates 5.2 General Current Consumption DC Operating Parameters TA = -40oC to 125oC, VDD = 1.8V (*) to 3.6V (unless otherwise specified) Parameter. SHELF MODE current SLEEP MODE current Symbol ISHELF ISLEEP Test Conditions No clock active, [-40, 70] oC VLFO clock active, VDD=3V, [-40, 70] oC (**) Min Typ 100 300 Max Unit 220 nA 520 nA 3400 nA SLEEP MODE current HighT ISLEEP_HT VLFO clock active, VDD=3V, [ 70, 125] oC (**) 900 IDLE MODE current ISHELF CPU inactive, VDD=3V, [-40, 125] oC 375 700 uA RUN MODE current IRUN CPU active at 1MHz, VDD=3V, [-40, 125] oC 0.8 1.4 mA Table 3: Electrical specifications (*) See 5.1: minimum operating voltage VDD > 1.8V at higher temperature (**) See 7.3: graphs with sleep current change over voltage supply and temperature range 3901090603 Rev.002 Page 4 of 18 19 July 2007 MLX90603 Tire Pressure Monitoring SiP Low-Power Pressure Sensor 5.3 Timing Specifications DC Operating Parameters TA = -40oC to 125oC, VDD = 1.8V (*) to 3.6V (unless otherwise specified) Parameter. Symbol Test Conditions Min Typ Max 1 MHz High Frequency Oscillator tolerance fHFO_tol +/-3% +/-7.5% 32 kHz Low Frequency Oscillator tolerance fLFO_tol +/-6% +/-10% Very Low Frequency Oscillator tolerance fVLFO_tol Sleep time with VLFO timer 2 kHz +/-10% +/-20% VLFO+ Sw temp compensation +/-5% Tsleep Table 4: Timing specifications Unit +/-10% Notes: (*) See 5.1: minimum operating voltage VDD > 1.8V at higher temperature 5.4 Sensor Specific Specifications o o DC Operating Parameters TA = -40 C to 125 C, VDD = 2.2V to 3.6V (unless otherwise specified) Parameter. Symbol Test Conditions Min Typ Max Battery Voltage Measurement Specific Specifications Voltage sensor resolution VRES Voltage sensor accuracy VERR1 Voltage sensor accuracy VERR2 2.5σ noise [-20, 70] [-40, 125] oC Temperature Measurement Specific Specifications Temperature sensor resolution TRES 2.5σ noise – 12bit ADC reading (repeatability) Temperature sensor accuracy TERR1 [-20, 70] oC after sw temp correction Temperature sensor accuracy TERR2 5 oC ±0.25 [-40, 125] oC MLX90603KDFxxB -- Full Scale (FS) = 700kPa, Pressure Measurement Specific Specifications Pressure sensor resolution PRES 2.5σ noise – 12bit ADC reading Pressure sensor accuracy PERR1 [-20, 70] oC, [300, 500] kPa Pressure sensor accuracy PERR2 [-40, 125] oC Pressure sensor G-error PERR_CENTR Extra rotation error, per 1000G MLX90603KDFxxC -- Full Scale (FS) = 1500kPa, Pressure Measurement Specific Specifications Pressure sensor resolution PRES 2.5σ noise – 12bit ADC reading Pressure sensor accuracy PERR1 [-20, 70] ] oC, [100, 1200] kPa Pressure sensor accuracy PERR2 [-40, 125] oC, [100, 1300] kPa Pressure sensor accuracy PERR3 [-40, 125] oC, [1300, 1500] kPa Pressure sensor G-error PERR_CENTR Extra rotation error, per 1000G 0.3 0.9 0.3 0.4 Units 10 mV 50 mV 100 mV ±0.5 ºC ±2.5 ºC ±4 ºC 0.5 1 2.5 1.1 %F.S. %F.S. %F.S. %F.S. 0.5 1 2 4 0.5 %F.S. %F.S. %F.S. %F.S. %F.S. Table 5: Specifications after linearization by the microcontroller 3901090603 Rev.002 Page 5 of 18 19 July 2007 MLX90603 Tire Pressure Monitoring SiP Low-Power Pressure Sensor Parameter. Power consumption P Measurement Power P Linearisation Power P Coeff (T) calc Power T Measurement Power T Linearisation Power V Measurement Power V Linearisation Power V Coeff (T) calc Power Symbol Test Conditions Min Typ Raw ADC value available PMEASP Linearized value available PLINP Calc. of the calibr. coeff as a function of Temp. PCOEFP Raw ADC value available PMEAST Linearized value available PLINT Raw ADC value available PMEASV Linearized value available PLINV Calc. of the calibr. coeff as a function of Temp. PCOEFV Table 6: Measurement power consumption Max 0.72 0.87 0.2 0.72 0.96 0.72 0.87 0.2 1.00 1.22 0.27 1.00 1.35 1.00 1.22 0.27 Units uAs uAs uAs uAs uAs uAs uAs uAs 5.5 RFID interface Specific Specifications DC Operating Parameters TA = -40oC to 125oC, VDD = 2.2V to 3.6V (unless otherwise specified) Parameter. Current consumption medium field mode Symbol IMFD Test Conditions Supply current used by MFD on top of sleep current Min Typ 33 Max 55 Sensitivity level medium field mode consumption strong Current field mode VDETMFD ILOWFIELD Absolute detection level Supply current required by SFD on top of shelf current 50 120 0 200 20 Sensitivity level strong field mode VDETSFD Absolute detection level 1 Table 7: RFID interface Specific specifications 2 3 Units nA mVpp (*) nA Vpp (*) (*)Note: Vpp means the differential voltage across the 2 coil terminals 3901090603 Rev.002 Page 6 of 18 19 July 2007 MLX90603 Tire Pressure Monitoring SiP Low-Power Pressure Sensor 6 Detailed Description The MLX90603 is a System In a Package (SIP) that consists of two silicon dies: • a MEMS absolute pressure sensor • and a microcontroller based low power sensor interface (MLX10111), assembled in a wide body (300mils) SOIC16 compatible package. The MLX90603 is delivered as a fully tested and calibrated device. 6.1 Architecture The heart of the MLX90603 is the Melexis 16 bit microcontroller: MLX16. It allows software control of: • the sensor interface o temperature and voltage measurements on the MLX10111 o measurements of the analog pressure sensor bridge or a 2nd sensor bridge • the communication interface o Internal RFID: 125kHz o External RF o Serial communication using 1 of the 5 digital IO’s • the power management. The microcontroller can access RAM, EEPROM and ROM memories. Also a programmable FLASH memory is available for development and pre-production series. The standard software library with low-level routines give access to all IC’s functions. Application examples offer a low-entry level introduction to the MLX16 programming. COIL2 COIL1 TagSUP 100nF VDD 10uF MLX90603 VBG BS 125KHz LF interface bandgap 3 BP1 TEST / PROGR/ EMUL BN1 gain BG ADC VBG MLX16 + I/O Interface BS BP2 MUX BP3 / IO2 5 IO (See pinout) BN3 / IO4 Tsense Oscillators Timers Counters VDD Vsense TDMA 3901090603 Rev.002 Page 7 of 18 RAM EEPROM ROM FLASH FLASHMEM 19 July 2007 MLX90603 Tire Pressure Monitoring SiP Low-Power Pressure Sensor 6.2 MEMORIES 6.2.1 EEPROM The MLX90603 has 128 bytes of EEPROM on board. Half of this memory is reserved for internal operation coefficients. The rest is available for application specific data like a sensor identification number. 6.2.2 RAM RAM size is 256 bytes. 6.2.3 ROM/FLASH The Program Memory size is 4K Word Instructions or 8 Kbytes. 6.3 Interrupts A wide range of interrupt sources are available, each with their own interrupt vector address. External interrupts include IRQ on digital IO’s or from the RFID interface. Internal interrupts include a watchdog and 2 compare timers. 6.4 Measurement functions A bandgap is used to generate the internal voltage reference, independent of the battery voltage. The output of the pressure, temperature and voltage sensor are differential signals that are multiplexed on the input of the signal conditioning chain. • The actual measurement consists of the amplification of the analog value that then is converted to a digital signal by an analogue to digital converter (ADC). • Next these ADC output values are linearized, removing the offset and adjusting the sensitivity using the calibration constants that are stored in the EEPROM. These calibration constants are measured and programmed during the production test at Melexis. Linearization time varies depending on the sensor (see specification). During the ADC measurement, the microcontroller is switched off to reduce power consumption and noise influence during a measurement (see power consumption below). 6.4.1 Absolute Pressure sensor The pressure sensor is a separate silicon MEMS (Micro Electro-Mechanical Structure) die based on piezoresistive wheatstone bridge. Under the sensitive pressure membrane a vacuum cavity serves as reference. 6.4.2 Temperature sensor The temperature sensor is part of the MLX10111. 6.4.3 Voltage sensor The battery or supply voltage sensor is part of the MLX10111. 3901090603 Rev.002 Page 8 of 18 19 July 2007 MLX90603 Tire Pressure Monitoring SiP Low-Power Pressure Sensor 6.4.4 External sensor Pin BP2 can be used to measure an extra analog sensor. rd The general I/O pins IO2 and IO4 can be configured as a differential input of a 3 sensor. 6.5 Communication interface An external interface communication can be implemented in software, using any of the digital IO’s: any serial RF/LF/SPI protocol can be programmed. 6.5.1 RF transmission The communication protocol for RF transmission can be programmed in software, with preamble and CRC. Normally the baud rate is generated in software, using the High Frequency Clock of the microcontroller (HFO). The temperature variation of the internal RC oscillator can be reduced by extra software compensation. As alternative, the stable external clock from the RF transmitter IC can be used for accurate baud rate generation. The MLX90603 can be used with most commercially available transmitters and transceivers. For instance in combination with the Melexis TH720x range of RF transmitters an ASK or FSK data-stream can be generated. 6.5.2 RFID or LF interface The RFID interface operates at 125kHz. This operating frequency is set by an external inductance and capacitor. Two sensitivity levels are available: • A Strong Field Detector (SFD) is available in which the controller does not consume any current from the battery. This can be used to wake up the IC in production test, and to maximize shelf life. • A Medium Field Detector (MFD), is available in which the controller is sleeping and woken-up by an external 125KHz signal, e.g. to start a measurement and do a transmission on demand. 6.6 Power management Several hardwired features are integrated to minimize power consumption: • Multiple power consumption operating modes: shelf mode, sleep mode, idle mode, run mode • Optional 16bit CRC in hardware to reduce power consumption during communication • Optional DMA mode (direct memory access) for low power RAM access during communication 6.7 Oscillators VLFO: The Very Low Frequency Oscillator generates a 2 KHz clock that is used for the low-power Sleep Mode: the sleep time can be programmed in steps of 250ms (= 0 to 64 seconds sleep time). LFO: The Low Frequency Oscillator generates a 32 KHz clock that can be used for low-power DMA communication or to program short sleep periods HFO: The High Frequency Oscillator is the 1MHz micro-controller clock, instructions are executed based on this clock: 4 clocks per instruction, 4us per instruction 3901090603 Rev.002 Page 9 of 18 19 July 2007 MLX90603 Tire Pressure Monitoring SiP Low-Power Pressure Sensor 7 Application information 7.1 Demo board A schematic and a picture of a typical application is shown below, it uses the MLX90603 pressure sensor with the TH720xx RF transmitter. Both ASK (Red) and FSK (Blue) modes of RF transmission are possible. LF antenna 125KHz COIL1 COIL2 Pressure sensor Battery 3V VDD Crystal 13.56MHz RF antenna 434MHz ASIC IO4 RF enable FSK-SW EN-TX VDD CK_OUT IO2 Data out VSS MLX90603 FSK-data ASK-data RF-out TH720xx 7.2 Unique Features - Automotive qualified Low stand-by power consumption Flexible software control over performance and power consumption Options for battery and battery-less implementation Small feature size of the package 3901090603 Rev.002 Page 10 of 18 19 July 2007 MLX90603 Tire Pressure Monitoring SiP Low-Power Pressure Sensor 7.3 Current consumption The IC is designed for maximizing the battery life time in automotive applications. Four different operating modes are considered: 7.3.1 SHELF MODE In Shelf Mode the battery voltage is applied, but the IC consumes very little power: only the Power-Ono Reset circuit is active (note: above 80 C the consumption increases). This shelf mode is used after the TPMS module has been assembled and tested. In this mode the battery leakage is the biggest limit on battery life. The module can exit shelf mode by an external interrupt, for instance a mechanical motion switch or a strong RFID signal. 7.3.2 SLEEP MODE Only the VLFO Oscillator is active in sleep mode. A digital counter will wake up the microcontroller on preprogrammed VLFO time intervals, as preset in software (typical between 0 – 64 sec). During SLEEP MODE the total current consumption is ISLEEP = ISHELF + IVLFO. 7.3.3 RUN MODE When the microcontroller clock is running (Clock = High Frequency Oscillator = HFO), the IC is in RUN MODE and the microcontroller is executing instructions. Current consumption of the chip is now increased to Irun. 7.3.4 IDLE MODE During measurements the microcontroller is not used. Therefore an IDLE MODE has been introduced in which only the ADC is functional, but the microcontroller is NOT executing instructions. RUN MODE DISABLE CPU clock HFO disabled? NO YES LFO disabled? NO YES 3901090603 Rev.002 SHELF MODE SLEEP MODE External interrupt wake-up Timer wake-up Request Interrupt wake-up Request End of ADC conversion Page 11 of 18 IDLE MODE 19 July 2007 MLX90603 350 300 250 150 200 Current consumption (nA) 400 450 Tire Pressure Monitoring SiP Low-Power Pressure Sensor 2.4V 1.8V 3V 3.6V Battery voltage 10000 1000 100 1 10 Current consumption (log) (nA) Typical SLEEP MODE current vs. supply voltage (at 25oC) -40°C 0°C 40°C 80°C 120°C 160°C Temperature (°C) Typical SLEEP MODE current vs. temperature (at 3V power supply) 3901090603 Rev.002 Page 12 of 18 19 July 2007 MLX90603 Tire Pressure Monitoring SiP Low-Power Pressure Sensor 7.3.5 Battery life time calculation example 1. One Pressure + one Temperature measurement every 3 seconds IMEAS = (2.22uAs + 2.35uAs) / 3s = 1.52 uA 2. One RF transmission every 30 sec, using messages of 10 bytes (80 bits) and 10kbps FSK. The TH720xx transmitter at 3dBm RF power consumes 7mA and takes 1.5ms to start up. consumption per message: 7ma * (8ms+1.5ms) = 66.5 uAs Average transmit current: ITX = 66.5uAs/30s = 2.22 uA 3. Standby current depends on the choice of motion sensor: a. No motion sensor: ISLEEP = b. With mechanical motion switch ISHELF = c. With MFD for LF initiation ISLEEP+MFD = 0.52uA 0.22uA 0.57uA 4. Using a CR2450 battery with 540mAH capacity. => assume 1%/yr leakage, this consumes ILEAK = 0.62uA In the table below the battery life time is estimated based on the above simplified example. Wake up Standby Duty cycle(*) IMEAS ITX ILEAK Total average current Battery life (100% cap) Battery life (60% cap) (**) Timer (no motion detect) 0.52 100% 1.52 2.22 0.62 4.88 12.6 7.6 Mechanical switch 0.22 5% 0.08 0.11 0.62 1.03 59.8 35.9 LF initiator 0.57 5% 0.08 0.11 0.62 1.38 44.7 26.8 uA uA uA uA uA Year Year (*) Assumption that vehicle is driving during 5% of the time, so that sensor measurements and RF transmissions are active only 5% if motion detection is used. Without motion detection, the measurements and transmissions must be done 100% of the time. (**) In typical cases not the full rated battery capacity can be used. Therefore a battery life time for 60% of the rated capacity is estimated. 7.4 Temperature shut down The timers, the microcontroller, the ADC and the sensors are guaranteed to operate up to 150C. The temperature sensor works monotonously up to 150C. The MLX90603 can be programmed to go to Sleep Mode without measuring, when the temperature rises above a defined value, it can restart measuring when the temperature is again below this limit. 3901090603 Rev.002 Page 13 of 18 19 July 2007 MLX90603 Tire Pressure Monitoring SiP Low-Power Pressure Sensor 7.5 Motion detection Several motion detection strategies can be implemented on the MLX90603: The MLX90603 has several IO’s, some with interrupt capability. Wake-up from shelf or sleep mode can be realized using the interrupt IO’s. • The MLX90603 can read a mechanical motion switch with 1 digital interrupt input. • The MLX90603 can read an acceleration IC with an analog input and 1 output to switch IC on/off • The MLX90603 can read a low-cost circuit with PZT shock sensor (cfr application note) 7.6 LF Initiation The IC coil inputs can be used for LF initiation (measurement on demand). Typically the 125 KHz LF field is detected when the tire module rotates and comes close to the LF initiator in the wheel well. The wheel rotation can be detected fast and with low power, if the coil input sensing is programmed with a low duty cycle (e.g. duty cycle of 10% , 1ms on - 9ms off). An alternative approach for very sensitive LF initiation is that the MLX90603 powers and measures an external LF detection IC that uses two LF antennas. 7.7 Tools and libraries 7.7.1 Tools The MLX16 environment is based on the EMLX-MM emulator/programmer tool, in combination with a C compiler. 7.7.2 Standard library A set of library functions is available to simplify the programming of the total application. A range of application notes describe the software examples. 8 Other product references • • • TH720XX: RF transmitter TH711XX: RF receiver TH722XX: RF transceiver 3901090603 Rev.002 Page 14 of 18 19 July 2007 MLX90603 Tire Pressure Monitoring SiP Low-Power Pressure Sensor 9 Standard information regarding manufacturability of Melexis products with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD’s (Surface Mount Devices) • • IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2) Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) • • EN60749-20 Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices Iron Soldering THD’s (Through Hole Devices) • EN60749-15 Resistance to soldering temperature for through-hole mounted devices Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) • EIA/JEDEC JESD22-B102 and EN60749-21 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.asp 10 ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. 3901090603 Rev.002 Page 15 of 18 19 July 2007 MLX90603 Tire Pressure Monitoring SiP Low-Power Pressure Sensor 11 Package Information The MLX90603 is a System-In-Package (SIP) consisting of two chips that are assembled in a custom moulded package. The package footprint is compatible with a standard SO16 wide-body IC. 90603 BF YYWW NNNNNNN NNNNNNN YYWW 90603BF LOT NUMBER YEAR-WEEK CODE PRODUCT VERSION Table 8: SOIC16 pin layout 11.1 Pin description for MLX90603 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pad Name MUST FLASHMEM IO7 TAGSUP COIL1 COIL2 VSS NC BP2 IO0 IO1 IO2 VDD IO4 VDDTEST MICE 3901090603 Rev.002 Function Test input pin FLASH memory selection (not connected in ROM version) Programmable I/O pin Tag Supply output Coil connection1 Coil connection2 Ground Not Connected analog input Programmable I/O pin with IRQ Programmable I/O pin with IRQ Programmable I/O pin Power Supply Programmable I/O pin Test supply pin Test output pin Table 9: Pin description for MLX90603 Page 16 of 18 19 July 2007 MLX90603 Tire Pressure Monitoring SiP Low-Power Pressure Sensor 11.2 SO16 Package outline Profile depth: W z1 Z E H X Y D A1 A b e Package type SO16 Min Max D E H A A1 e b L α W X Y Z Z1 10.10 10.50 7.40 7.60 10.00 10.65 2.35 2.65 0.10 0.30 1.27 0.33 0.51 0.40 1.27 0° 8° 0.01 0.09 2.40 2.50 4.01 4.21 0.75 0.85 4.3 4.7 Table 10: SO16 dimensions in mm, co-planarity<0.1mm 3901090603 Rev.002 Page 17 of 18 19 July 2007 MLX90603 Tire Pressure Monitoring SiP Low-Power Pressure Sensor 12 Disclaimer Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services. © 2005 Melexis NV. All rights reserved. For the latest version of this document, go to our website at www.melexis.com Or for additional information contact Melexis Direct: Europe, Africa, Asia: Phone: +32 1367 0495 E-mail: [email protected] 3901090603 Rev.002 America: Phone: +1 603 223 2362 E-mail: [email protected] Page 18 of 18 19 July 2007