datasheet MLX90603 DownloadLink 5430

MLX90603
Tire Pressure Monitoring SiP
Low-Power Pressure Sensor
Features and Benefits
Low-Power Microcontroller-based Pressure-Temperature-Battery monitor, ideally suited for TPMS
Measurement of car and truck tire pressure with 1% precision
Sleep current < 1uA during operation, Run mode < 1mA
Delivered as a fully tested and calibrated component
Flash version compatible with ROM package, for development and small series
Temperature compensation of sensors and timers
Diagnostics for system error detection
Robust package that withstands shocks up to 2000 G
5 digital IO’s to control the wireless RF transmitter or external IC’s
Operation with internal RC clock for low-cost, or with external RF clock for very stable data-rate
Compatible with existing RKE systems (remote keyless entry)
LF interface for short-range wireless communication using 125KHz
Applications
Continuous car and truck Tire Pressure Monitoring System (TPMS)
Low-Power Wireless Pressure-Temperature-Battery sensor
Ordering Information
Part No.
MLX90603
Temperature Code
K (-40°C to 125°C)
Package Code
DF (SO-wide)
Memory code(*) Absolute Pressure range(**)
BF (FLASH)
B (0 – 700 kPa)
XX (ROM)
C (0 – 1500 kPa)
(*) dedicated ROM code is assigned after customer ROM order
(**) other pressure ranges are available on demand
1 Functional diagram
2 General description
MLX90603
RF
RFID
MLX10111
TH720x
3901090603 Rev.002
Delivery Form
1500 pc/T&R
The MLX90603 is a System in a Package (SIP)
pressure sensor, combining an analog pressure
sensor and a low-power sensor interface with
micro-controller MLX10111, in a plastic SO16
package.
Its primary use is in wireless TPMS applications,
using any RF transmitter, the system can be
made compliant with existing Remote Keyless
Entry (RKE) systems.
Power consumption in standby is less than 1uA,
power during periodic sensing is reduced with the
low-power microcontroller (typical <1mA).
The MLX90603 offers 1% Full Scale accuracy.
Pressure ranges of 7 and 15 Bar are available,
other ranges are on demand. The robust sensor
has a burst pressure >50 bar.
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19 July 2007
MLX90603
Tire Pressure Monitoring SiP
Low-Power Pressure Sensor
Table of Contents
1 FUNCTIONAL DIAGRAM............................................................................................................................. 1
2 GENERAL DESCRIPTION ........................................................................................................................... 1
3 GLOSSARY OF TERMS............................................................................................................................... 3
4 ABSOLUTE MAXIMUM RATINGS............................................................................................................... 3
5 SPECIFICATIONS ........................................................................................................................................ 4
5.1 POWER DOWN/UP SPECIFICATION ................................................................................................................................................... 4
5.2 GENERAL CURRENT CONSUMPTION ................................................................................................................................................ 4
5.3 TIMING SPECIFICATIONS ................................................................................................................................................................ 5
5.4 SENSOR SPECIFIC SPECIFICATIONS ................................................................................................................................................ 5
5.5 RFID INTERFACE SPECIFIC SPECIFICATIONS ................................................................................................................................... 6
6 DETAILED DESCRIPTION........................................................................................................................... 7
6.1 ARCHITECTURE ............................................................................................................................................................................. 7
6.2 MEMORIES................................................................................................................................................................................. 8
6.2.1 EEPROM ............................................................................................................................................................................. 8
6.2.2 RAM..................................................................................................................................................................................... 8
6.2.3 ROM/FLASH........................................................................................................................................................................ 8
6.3 INTERRUPTS ................................................................................................................................................................................. 8
6.4 MEASUREMENT FUNCTIONS ............................................................................................................................................................ 8
6.4.1 Absolute Pressure sensor .................................................................................................................................................... 8
6.4.2 Temperature sensor............................................................................................................................................................. 8
6.4.3 Voltage sensor..................................................................................................................................................................... 8
6.4.4 External sensor.................................................................................................................................................................... 9
6.5 COMMUNICATION INTERFACE .......................................................................................................................................................... 9
6.5.1 RF transmission ................................................................................................................................................................... 9
6.5.2 RFID or LF interface............................................................................................................................................................. 9
6.6 POWER MANAGEMENT ................................................................................................................................................................... 9
6.7 OSCILLATORS ............................................................................................................................................................................... 9
7 APPLICATION INFORMATION.................................................................................................................. 10
7.1 DEMO BOARD .............................................................................................................................................................................. 10
7.2 UNIQUE FEATURES ...................................................................................................................................................................... 10
7.3 CURRENT CONSUMPTION ............................................................................................................................................................. 11
7.3.1 SHELF MODE.................................................................................................................................................................... 11
7.3.2 SLEEP MODE.................................................................................................................................................................... 11
7.3.3 RUN MODE ....................................................................................................................................................................... 11
7.3.4 IDLE MODE ....................................................................................................................................................................... 11
7.3.5 Battery life time calculation example .................................................................................................................................. 13
7.4 TEMPERATURE SHUT DOWN.......................................................................................................................................................... 13
7.5 MOTION DETECTION ..................................................................................................................................................................... 14
7.6 LF INITIATION .............................................................................................................................................................................. 14
7.7 TOOLS AND LIBRARIES ................................................................................................................................................................. 14
7.7.1 Tools.................................................................................................................................................................................. 14
7.7.2 Standard library.................................................................................................................................................................. 14
8 OTHER PRODUCT REFERENCES ........................................................................................................... 14
9 STANDARD INFORMATION REGARDING MANUFACTURABILITY OF MELEXIS PRODUCTS WITH
DIFFERENT SOLDERING PROCESSES ..................................................................................................... 15
10 ESD PRECAUTIONS................................................................................................................................ 15
11 PACKAGE INFORMATION ...................................................................................................................... 16
11.1 PIN DESCRIPTION FOR MLX90603.............................................................................................................................................. 16
11.2 SO16 PACKAGE OUTLINE ........................................................................................................................................................... 17
12 DISCLAIMER ............................................................................................................................................ 18
3901090603 Rev.002
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MLX90603
Tire Pressure Monitoring SiP
Low-Power Pressure Sensor
3 Glossary of Terms
VLFO
LFO
HFO
POR
MFD
SFD
SIP
RESOLUTION
ACCURACY
VERY LOW FREQUENCY OSCILLATOR.
LOW FREQUENCY OSCILLATOR:
HIGH FREQUENCY OSCILLATOR
POWER ON RESET/POWER DOWN
MEDIUM FIELD DETECTOR
STRONG FIELD DETECTOR
SYSTEM IN A PACKAGE
2.5 NOISE LEVEL
ABSOLUTE ACCURACY INCLUDING NON-LINEARITIES, OFFSETS AND RESOLUTION.
1 bar = 14.5038 psi (Pound per square inch) = 750.0639973 mmHg (height mercury) = 100 kPa
4 Absolute maximum ratings
Parameter.
Units
Supply Voltage, VDD (overvoltage)
6V
Supply Voltage, VDD (operating)
3.6V
Reverse Voltage Protection
-0.5V
Supply Current, IDD
4mA
Operating Temperature Range, Tamb
-40 to +125°C
Operating Temperature Range, Tamb, 10 hours
+125 to 150°C
Storage Temperature Range, TS
150°C
ESD Sensitivity (AEC Q100 002)
1kV
ESD Sensitivity on COIL1 COIL2 pins (AEC Q100 002)
1kV
Table 1: Absolute maximum ratings
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximumrated conditions for extended periods may affect device reliability.
3901090603 Rev.002
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MLX90603
Tire Pressure Monitoring SiP
Low-Power Pressure Sensor
5 Specifications
5.1 Power down/Up specification
Parameter.
Power down Reset
Power up Hysteresis
Symbol
VPDR-40
VPDR25
Test Conditions
-40oC
Min
Typ
Max
1.8
Units
V
25oC
1.9
V
VPDR85
85oC
2.1
V
VPDR125
125oC
2.2
V
VPUR_hyst
Power Up level – Power Down Level
0.2
V
2.2
2
1.8
1.6
Power Down Level
Table 2: Power Down/Up specifications
-40°C
0°C
40°C
80°C
120°C
Temperature (°C)
Note: the Power down level is the lowest voltage at which IC operates
5.2 General Current Consumption
DC Operating Parameters TA = -40oC to 125oC, VDD = 1.8V (*) to 3.6V (unless otherwise specified)
Parameter.
SHELF MODE current
SLEEP MODE current
Symbol
ISHELF
ISLEEP
Test Conditions
No clock active, [-40, 70] oC
VLFO clock active, VDD=3V, [-40, 70] oC (**)
Min
Typ
100
300
Max Unit
220 nA
520 nA
3400 nA
SLEEP MODE current HighT ISLEEP_HT
VLFO clock active, VDD=3V, [ 70, 125] oC (**)
900
IDLE MODE current
ISHELF
CPU inactive, VDD=3V, [-40, 125] oC
375
700
uA
RUN MODE current
IRUN
CPU active at 1MHz, VDD=3V, [-40, 125] oC
0.8
1.4
mA
Table 3: Electrical specifications
(*) See 5.1: minimum operating voltage VDD > 1.8V at higher temperature
(**) See 7.3: graphs with sleep current change over voltage supply and temperature range
3901090603 Rev.002
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MLX90603
Tire Pressure Monitoring SiP
Low-Power Pressure Sensor
5.3 Timing Specifications
DC Operating Parameters TA = -40oC to 125oC, VDD = 1.8V (*) to 3.6V (unless otherwise specified)
Parameter.
Symbol Test Conditions
Min
Typ
Max
1 MHz
High Frequency Oscillator tolerance
fHFO_tol
+/-3% +/-7.5%
32 kHz
Low Frequency Oscillator tolerance
fLFO_tol
+/-6% +/-10%
Very Low Frequency Oscillator tolerance
fVLFO_tol
Sleep time with VLFO timer
2 kHz
+/-10% +/-20%
VLFO+ Sw temp compensation
+/-5%
Tsleep
Table 4: Timing specifications
Unit
+/-10%
Notes:
(*) See 5.1: minimum operating voltage VDD > 1.8V at higher temperature
5.4 Sensor Specific Specifications
o
o
DC Operating Parameters TA = -40 C to 125 C, VDD = 2.2V to 3.6V (unless otherwise specified)
Parameter.
Symbol Test Conditions
Min
Typ
Max
Battery Voltage Measurement Specific Specifications
Voltage sensor resolution
VRES
Voltage sensor accuracy
VERR1
Voltage sensor accuracy
VERR2
2.5σ noise
[-20, 70]
[-40, 125]
oC
Temperature Measurement Specific Specifications
Temperature sensor resolution TRES
2.5σ noise – 12bit ADC reading
(repeatability)
Temperature sensor accuracy TERR1
[-20, 70] oC after sw temp correction
Temperature sensor accuracy
TERR2
5
oC
±0.25
[-40, 125] oC
MLX90603KDFxxB -- Full Scale (FS) = 700kPa, Pressure Measurement Specific Specifications
Pressure sensor resolution
PRES
2.5σ noise – 12bit ADC reading
Pressure sensor accuracy
PERR1
[-20, 70] oC, [300, 500] kPa
Pressure sensor accuracy
PERR2
[-40, 125] oC
Pressure sensor G-error
PERR_CENTR Extra rotation error, per 1000G
MLX90603KDFxxC -- Full Scale (FS) = 1500kPa, Pressure Measurement Specific Specifications
Pressure sensor resolution
PRES
2.5σ noise – 12bit ADC reading
Pressure sensor accuracy
PERR1
[-20, 70] ] oC, [100, 1200] kPa
Pressure sensor accuracy
PERR2
[-40, 125] oC, [100, 1300] kPa
Pressure sensor accuracy
PERR3
[-40, 125] oC, [1300, 1500] kPa
Pressure sensor G-error
PERR_CENTR Extra rotation error, per 1000G
0.3
0.9
0.3
0.4
Units
10
mV
50
mV
100
mV
±0.5
ºC
±2.5
ºC
±4
ºC
0.5
1
2.5
1.1
%F.S.
%F.S.
%F.S.
%F.S.
0.5
1
2
4
0.5
%F.S.
%F.S.
%F.S.
%F.S.
%F.S.
Table 5: Specifications after linearization by the microcontroller
3901090603 Rev.002
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MLX90603
Tire Pressure Monitoring SiP
Low-Power Pressure Sensor
Parameter.
Power consumption
P Measurement Power
P Linearisation Power
P Coeff (T) calc Power
T Measurement Power
T Linearisation Power
V Measurement Power
V Linearisation Power
V Coeff (T) calc Power
Symbol
Test Conditions
Min
Typ
Raw ADC value available
PMEASP
Linearized value available
PLINP
Calc. of the calibr. coeff as a function of Temp.
PCOEFP
Raw ADC value available
PMEAST
Linearized value available
PLINT
Raw ADC value available
PMEASV
Linearized
value available
PLINV
Calc. of the calibr. coeff as a function of Temp.
PCOEFV
Table 6: Measurement power consumption
Max
0.72
0.87
0.2
0.72
0.96
0.72
0.87
0.2
1.00
1.22
0.27
1.00
1.35
1.00
1.22
0.27
Units
uAs
uAs
uAs
uAs
uAs
uAs
uAs
uAs
5.5 RFID interface Specific Specifications
DC Operating Parameters TA = -40oC to 125oC, VDD = 2.2V to 3.6V (unless otherwise specified)
Parameter.
Current consumption medium
field mode
Symbol
IMFD
Test Conditions
Supply current used by MFD on
top of sleep current
Min
Typ
33
Max
55
Sensitivity level medium field
mode consumption strong
Current
field mode
VDETMFD
ILOWFIELD
Absolute detection level
Supply current required by SFD
on top of shelf current
50
120
0
200
20
Sensitivity level strong field
mode
VDETSFD
Absolute detection level
1
Table 7: RFID interface Specific specifications
2
3
Units
nA
mVpp (*)
nA
Vpp (*)
(*)Note: Vpp means the differential voltage across the 2 coil terminals
3901090603 Rev.002
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MLX90603
Tire Pressure Monitoring SiP
Low-Power Pressure Sensor
6 Detailed Description
The MLX90603 is a System In a Package (SIP) that consists of two silicon dies:
• a MEMS absolute pressure sensor
• and a microcontroller based low power sensor interface (MLX10111),
assembled in a wide body (300mils) SOIC16 compatible package.
The MLX90603 is delivered as a fully tested and calibrated device.
6.1 Architecture
The heart of the MLX90603 is the Melexis 16 bit microcontroller: MLX16. It allows software control of:
• the sensor interface
o temperature and voltage measurements on the MLX10111
o measurements of the analog pressure sensor bridge or a 2nd sensor bridge
• the communication interface
o Internal RFID: 125kHz
o External RF
o Serial communication using 1 of the 5 digital IO’s
• the power management.
The microcontroller can access RAM, EEPROM and ROM memories. Also a programmable FLASH
memory is available for development and pre-production series. The standard software library with low-level
routines give access to all IC’s functions. Application examples offer a low-entry level introduction to the
MLX16 programming.
COIL2
COIL1
TagSUP
100nF
VDD
10uF
MLX90603
VBG
BS
125KHz
LF interface
bandgap
3
BP1
TEST /
PROGR/
EMUL
BN1
gain
BG
ADC
VBG
MLX16
+
I/O Interface
BS
BP2
MUX
BP3 / IO2
5
IO (See
pinout)
BN3 / IO4
Tsense
Oscillators
Timers
Counters
VDD
Vsense
TDMA
3901090603 Rev.002
Page 7 of 18
RAM
EEPROM
ROM
FLASH
FLASHMEM
19 July 2007
MLX90603
Tire Pressure Monitoring SiP
Low-Power Pressure Sensor
6.2 MEMORIES
6.2.1 EEPROM
The MLX90603 has 128 bytes of EEPROM on board. Half of this memory is reserved for internal operation
coefficients. The rest is available for application specific data like a sensor identification number.
6.2.2 RAM
RAM size is 256 bytes.
6.2.3 ROM/FLASH
The Program Memory size is 4K Word Instructions or 8 Kbytes.
6.3 Interrupts
A wide range of interrupt sources are available, each with their own interrupt vector address.
External interrupts include IRQ on digital IO’s or from the RFID interface.
Internal interrupts include a watchdog and 2 compare timers.
6.4 Measurement functions
A bandgap is used to generate the internal voltage reference, independent of the battery voltage.
The output of the pressure, temperature and voltage sensor are differential signals that are multiplexed on
the input of the signal conditioning chain.
• The actual measurement consists of the amplification of the analog value that then is converted to a
digital signal by an analogue to digital converter (ADC).
• Next these ADC output values are linearized, removing the offset and adjusting the sensitivity using
the calibration constants that are stored in the EEPROM. These calibration constants are
measured and programmed during the production test at Melexis.
Linearization time varies depending on the sensor (see specification). During the ADC measurement, the
microcontroller is switched off to reduce power consumption and noise influence during a measurement
(see power consumption below).
6.4.1 Absolute Pressure sensor
The pressure sensor is a separate silicon MEMS (Micro Electro-Mechanical Structure) die based on piezoresistive wheatstone bridge. Under the sensitive pressure membrane a vacuum cavity serves as reference.
6.4.2 Temperature sensor
The temperature sensor is part of the MLX10111.
6.4.3 Voltage sensor
The battery or supply voltage sensor is part of the MLX10111.
3901090603 Rev.002
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MLX90603
Tire Pressure Monitoring SiP
Low-Power Pressure Sensor
6.4.4 External sensor
Pin BP2 can be used to measure an extra analog sensor.
rd
The general I/O pins IO2 and IO4 can be configured as a differential input of a 3 sensor.
6.5 Communication interface
An external interface communication can be implemented in software, using any of the digital IO’s: any
serial RF/LF/SPI protocol can be programmed.
6.5.1 RF transmission
The communication protocol for RF transmission can be programmed in software, with preamble and CRC.
Normally the baud rate is generated in software, using the High Frequency Clock of the microcontroller
(HFO). The temperature variation of the internal RC oscillator can be reduced by extra software
compensation. As alternative, the stable external clock from the RF transmitter IC can be used for accurate
baud rate generation.
The MLX90603 can be used with most commercially available transmitters and transceivers. For instance
in combination with the Melexis TH720x range of RF transmitters an ASK or FSK data-stream can be
generated.
6.5.2 RFID or LF interface
The RFID interface operates at 125kHz. This operating frequency is set by an external inductance and
capacitor. Two sensitivity levels are available:
• A Strong Field Detector (SFD) is available in which the controller does not consume any current
from the battery. This can be used to wake up the IC in production test, and to maximize shelf life.
• A Medium Field Detector (MFD), is available in which the controller is sleeping and woken-up by an
external 125KHz signal, e.g. to start a measurement and do a transmission on demand.
6.6 Power management
Several hardwired features are integrated to minimize power consumption:
• Multiple power consumption operating modes: shelf mode, sleep mode, idle mode, run mode
• Optional 16bit CRC in hardware to reduce power consumption during communication
• Optional DMA mode (direct memory access) for low power RAM access during communication
6.7 Oscillators
VLFO: The Very Low Frequency Oscillator generates a 2 KHz clock that is used for the low-power Sleep
Mode: the sleep time can be programmed in steps of 250ms (= 0 to 64 seconds sleep time).
LFO:
The Low Frequency Oscillator generates a 32 KHz clock that can be used for low-power DMA
communication or to program short sleep periods
HFO:
The High Frequency Oscillator is the 1MHz micro-controller clock, instructions are executed based
on this clock: 4 clocks per instruction, 4us per instruction
3901090603 Rev.002
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MLX90603
Tire Pressure Monitoring SiP
Low-Power Pressure Sensor
7 Application information
7.1 Demo board
A schematic and a picture of a typical application is shown below, it uses the MLX90603 pressure sensor
with the TH720xx RF transmitter. Both ASK (Red) and FSK (Blue) modes of RF transmission are possible.
LF antenna
125KHz
COIL1
COIL2
Pressure
sensor
Battery
3V
VDD
Crystal
13.56MHz
RF antenna
434MHz
ASIC
IO4 RF enable
FSK-SW
EN-TX
VDD
CK_OUT
IO2
Data out
VSS
MLX90603
FSK-data
ASK-data
RF-out
TH720xx
7.2 Unique Features
-
Automotive qualified
Low stand-by power consumption
Flexible software control over performance and power consumption
Options for battery and battery-less implementation
Small feature size of the package
3901090603 Rev.002
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MLX90603
Tire Pressure Monitoring SiP
Low-Power Pressure Sensor
7.3 Current consumption
The IC is designed for maximizing the battery life time in automotive applications. Four different operating
modes are considered:
7.3.1 SHELF MODE
In Shelf Mode the battery voltage is applied, but the IC consumes very little power: only the Power-Ono
Reset circuit is active (note: above 80 C the consumption increases). This shelf mode is used after the
TPMS module has been assembled and tested. In this mode the battery leakage is the biggest limit on
battery life. The module can exit shelf mode by an external interrupt, for instance a mechanical motion
switch or a strong RFID signal.
7.3.2 SLEEP MODE
Only the VLFO Oscillator is active in sleep mode. A digital counter will wake up the microcontroller on preprogrammed VLFO time intervals, as preset in software (typical between 0 – 64 sec). During SLEEP MODE
the total current consumption is ISLEEP = ISHELF + IVLFO.
7.3.3 RUN MODE
When the microcontroller clock is running (Clock = High Frequency Oscillator = HFO), the IC is in RUN
MODE and the microcontroller is executing instructions. Current consumption of the chip is now increased
to Irun.
7.3.4 IDLE MODE
During measurements the microcontroller is not used. Therefore an IDLE MODE has been introduced in
which only the ADC is functional, but the microcontroller is NOT executing instructions.
RUN
MODE
DISABLE
CPU clock
HFO
disabled?
NO
YES
LFO
disabled?
NO
YES
3901090603 Rev.002
SHELF
MODE
SLEEP
MODE
External
interrupt
wake-up
Timer wake-up Request
Interrupt wake-up Request
End of ADC conversion
Page 11 of 18
IDLE
MODE
19 July 2007
MLX90603
350
300
250
150
200
Current
consumption (nA)
400
450
Tire Pressure Monitoring SiP
Low-Power Pressure Sensor
2.4V
1.8V
3V
3.6V
Battery voltage
10000
1000
100
1
10
Current consumption
(log) (nA)
Typical SLEEP MODE current vs. supply voltage (at 25oC)
-40°C
0°C
40°C
80°C
120°C
160°C
Temperature (°C)
Typical SLEEP MODE current vs. temperature (at 3V power supply)
3901090603 Rev.002
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MLX90603
Tire Pressure Monitoring SiP
Low-Power Pressure Sensor
7.3.5 Battery life time calculation example
1. One Pressure + one Temperature measurement every 3 seconds
IMEAS = (2.22uAs + 2.35uAs) / 3s = 1.52 uA
2. One RF transmission every 30 sec, using messages of 10 bytes (80 bits) and 10kbps FSK.
The TH720xx transmitter at 3dBm RF power consumes 7mA and takes 1.5ms to start up.
consumption per message: 7ma * (8ms+1.5ms) = 66.5 uAs
Average transmit current: ITX = 66.5uAs/30s =
2.22 uA
3. Standby current depends on the choice of motion sensor:
a. No motion sensor:
ISLEEP =
b. With mechanical motion switch
ISHELF =
c. With MFD for LF initiation
ISLEEP+MFD =
0.52uA
0.22uA
0.57uA
4. Using a CR2450 battery with 540mAH capacity.
=> assume 1%/yr leakage, this consumes ILEAK = 0.62uA
In the table below the battery life time is estimated based on the above simplified example.
Wake up
Standby
Duty cycle(*)
IMEAS
ITX
ILEAK
Total average current
Battery life (100% cap)
Battery life (60% cap) (**)
Timer
(no motion detect)
0.52
100%
1.52
2.22
0.62
4.88
12.6
7.6
Mechanical
switch
0.22
5%
0.08
0.11
0.62
1.03
59.8
35.9
LF initiator
0.57
5%
0.08
0.11
0.62
1.38
44.7
26.8
uA
uA
uA
uA
uA
Year
Year
(*) Assumption that vehicle is driving during 5% of the time, so that sensor measurements and RF
transmissions are active only 5% if motion detection is used. Without motion detection, the
measurements and transmissions must be done 100% of the time.
(**) In typical cases not the full rated battery capacity can be used. Therefore a battery life time for
60% of the rated capacity is estimated.
7.4 Temperature shut down
The timers, the microcontroller, the ADC and the sensors are guaranteed to operate up to 150C.
The temperature sensor works monotonously up to 150C. The MLX90603 can be programmed to go to
Sleep Mode without measuring, when the temperature rises above a defined value, it can restart measuring
when the temperature is again below this limit.
3901090603 Rev.002
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MLX90603
Tire Pressure Monitoring SiP
Low-Power Pressure Sensor
7.5 Motion detection
Several motion detection strategies can be implemented on the MLX90603: The MLX90603 has several
IO’s, some with interrupt capability. Wake-up from shelf or sleep mode can be realized using the interrupt
IO’s.
• The MLX90603 can read a mechanical motion switch with 1 digital interrupt input.
• The MLX90603 can read an acceleration IC with an analog input and 1 output to switch IC on/off
• The MLX90603 can read a low-cost circuit with PZT shock sensor (cfr application note)
7.6 LF Initiation
The IC coil inputs can be used for LF initiation (measurement on demand). Typically the 125 KHz LF field is
detected when the tire module rotates and comes close to the LF initiator in the wheel well. The wheel
rotation can be detected fast and with low power, if the coil input sensing is programmed with a low duty
cycle (e.g. duty cycle of 10% , 1ms on - 9ms off).
An alternative approach for very sensitive LF initiation is that the MLX90603 powers and measures an
external LF detection IC that uses two LF antennas.
7.7 Tools and libraries
7.7.1 Tools
The MLX16 environment is based on the EMLX-MM emulator/programmer tool, in combination with a C
compiler.
7.7.2 Standard library
A set of library functions is available to simplify the programming of the total application. A range of
application notes describe the software examples.
8 Other product references
•
•
•
TH720XX: RF transmitter
TH711XX: RF receiver
TH722XX: RF transceiver
3901090603 Rev.002
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MLX90603
Tire Pressure Monitoring SiP
Low-Power Pressure Sensor
9 Standard information regarding manufacturability of Melexis
products with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
•
•
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
•
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
•
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance
of adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.asp
10 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
3901090603 Rev.002
Page 15 of 18
19 July 2007
MLX90603
Tire Pressure Monitoring SiP
Low-Power Pressure Sensor
11 Package Information
The MLX90603 is a System-In-Package (SIP) consisting of two chips that are assembled in a custom
moulded package. The package footprint is compatible with a standard SO16 wide-body IC.
90603
BF
YYWW
NNNNNNN
NNNNNNN
YYWW
90603BF
LOT NUMBER
YEAR-WEEK CODE
PRODUCT VERSION
Table 8: SOIC16 pin layout
11.1 Pin description for MLX90603
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Pad Name
MUST
FLASHMEM
IO7
TAGSUP
COIL1
COIL2
VSS
NC
BP2
IO0
IO1
IO2
VDD
IO4
VDDTEST
MICE
3901090603 Rev.002
Function
Test input pin
FLASH memory selection (not connected in ROM version)
Programmable I/O pin
Tag Supply output
Coil connection1
Coil connection2
Ground
Not Connected
analog input
Programmable I/O pin with IRQ
Programmable I/O pin with IRQ
Programmable I/O pin
Power Supply
Programmable I/O pin
Test supply pin
Test output pin
Table 9: Pin description for MLX90603
Page 16 of 18
19 July 2007
MLX90603
Tire Pressure Monitoring SiP
Low-Power Pressure Sensor
11.2 SO16 Package outline
Profile depth: W
z1
Z
E
H
X
Y
D
A1 A
b
e
Package
type
SO16
Min
Max
D
E
H
A
A1
e
b
L
α
W
X
Y
Z
Z1
10.10
10.50
7.40
7.60
10.00
10.65
2.35
2.65
0.10
0.30
1.27
0.33
0.51
0.40
1.27
0°
8°
0.01
0.09
2.40
2.50
4.01
4.21
0.75
0.85
4.3
4.7
Table 10: SO16 dimensions in mm, co-planarity<0.1mm
3901090603 Rev.002
Page 17 of 18
19 July 2007
MLX90603
Tire Pressure Monitoring SiP
Low-Power Pressure Sensor
12 Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its
Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the
information set forth herein or regarding the freedom of the described devices from patent infringement.
Melexis reserves the right to change specifications and prices at any time and without notice. Therefore,
prior to designing this product into a system, it is necessary to check with Melexis for current information.
This product is intended for use in normal commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or high reliability applications, such as military,
medical life-support or life-sustaining equipment are specifically not recommended without additional
processing by Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be
liable to recipient or any third party for any damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential
damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical
data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’
rendering of technical or other services.
© 2005 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at
www.melexis.com
Or for additional information contact Melexis Direct:
Europe, Africa, Asia:
Phone: +32 1367 0495
E-mail: [email protected]
3901090603 Rev.002
America:
Phone: +1 603 223 2362
E-mail: [email protected]
Page 18 of 18
19 July 2007
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