DMN4036LK3

A Product Line of
Diodes Incorporated
DMN4036LK3
40V N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
V(BR)DSS
Features and Benefits
ID
RDS(on)
TA = 25°C
36mΩ @ VGS= 10V
12.2A
61mΩ @ VGS= 4.5V
9.4A
•
Low on-resistance
•
Fast switching speed
•
“Green” component and RoHS compliant (Note 1)
•
Qualified to AEC-Q101 Standards for High Reliability
40V
Mechanical Data
•
Case: TO252-3L
Description and Applications
•
This MOSFET has been designed to minimize the on-state resistance
(RDS(on)) and yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0 (Note 1)
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Terminals Connections: See Diagram
•
Terminals: Matte Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
•
Weight: 0.33 grams (approximate)
•
Backlighting
•
DC-DC Converters
•
Power management functions
D
D
TO252-3L
G
D
G
TOP VIEW
Ordering Information
PIN OUT -TOP VIEW
Equivalent Circuit
(Note 1)
Product
DMN4036LK3-13
Note:
S
S
Marking
N4036L
Reel size (inches)
13
Tape width (mm)
16
Quantity per reel
2,500
1. Diodes, Inc. defines “Green” products as those which are RoHS compliant and contain no halogens or antimony compounds; further information about
Diodes Inc.’s “Green” Policy can be found on our website. For packaging details, go to our website.
Marking Information
YYWW
N4036L
DMN4036LK3
Document number: DS32122 Rev. 2 - 2
= Manufacturer’s Marking
N4036L = Product Type Marking Code
YYWW = Date Code Marking
YY = Year (ex: 09 = 2009)
WW = Week (01 - 53)
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A Product Line of
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DMN4036LK3
Maximum Ratings
@TA = 25°C unless otherwise specified
Characteristic
Drain-Source voltage
Gate-Source voltage
Continuous Drain current
VGS = 10V
Pulsed Drain current
VGS = 10V
Continuous Source current (Body diode)
Pulsed Source current (Body diode)
(Note 2)
(Note 4)
TA = 70°C (Note 4)
(Note 3)
(Note 5)
(Note 4)
(Note 5)
Symbol
VDSS
VGS
ID
IDM
IS
ISM
Value
40
±20
12.2
9.7
8.5
31.7
10.4
31.7
Unit
V
V
A
A
A
A
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Symbol
(Note 3)
Power dissipation
Linear derating factor
(Note 4)
PD
(Note 6)
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Lead
Operating and storage temperature range
Notes:
(Note 3)
(Note 4)
(Note 6)
(Note 7)
RθJA
RθJL
TJ, TSTG
Value
4.12
33
8.49
67.9
2.12
16.9
30.3
14.7
59.0
3.1
-55 to 150
Unit
W
mW/°C
°C/W
°C
2. AEC-Q101 VGS maximum is ±16V.
3. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
4. Same as note 3, except the device is measured at t ≤ 10 sec.
5. Same as note 3, except the device is pulsed with D = 0.02 and pulse width 300 µs. The pulse current is limited by the maximum junction temperature.
6. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
7. Thermal resistance from junction to solder-point (at the end of the drain lead).
DMN4036LK3
Document number: DS32122 Rev. 2 - 2
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A Product Line of
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DMN4036LK3
Thermal Characteristics
10
RDS(on)
Limited
1
ID Drain Current (A)
ID Drain Current (A)
RDS(on)
DC 1s
100ms
10ms
Tamb=25°C
100m
100µs
1
DC
1
1s
100ms
10ms
T amb=25°C
100m
1ms
25mm x 25mm
1oz FR4
10 Limited
1ms
50mm x 50mm
2oz FR4
10
100µs
1
VDS Drain-Source Voltage (V)
10
VDS Drain-Source Voltage (V)
Safe Operating Area
Safe Operating Area
T amb=25°C
50
25mm x 25mm
1oz FR4
40
D=0.5
30
20
D=0.1
D=0.2
D=0.05
10
Single Pulse
0
100µ
1m
10m 100m
1
10
100
1k
Pulse Width (s)
Thermal Resistance (°C/W)
Thermal Resistance (°C/W)
35
60
Transient Thermal Impedance
T amb=25°C
30
50mm x 50mm
2oz FR4
25
20
D=0.5
15
D=0.1
D=0.2
10
D=0.05
5
Single Pulse
0
100µ
1m
10m 100m
1
10
100
1k
Pulse Width (s)
Transient Thermal Impedance
100
50mm x 50mm
2oz FR4
10
25mm x 25mm
1oz FR4
1
100µ
1m
10m 100m
1
10
100
Pulse Width (s)
1k
Max Power Dissipation (W)
Max Power Dissipation (W)
4.5
Single Pulse
T amb=25°C
4.0
50mm x 50mm
2oz FR4
3.5
3.0
25mm x 25mm
1oz FR4
2.5
2.0
1.5
1.0
0.5
0.0
0
Pulse Power Dissipation
DMN4036LK3
Document number: DS32122 Rev. 2 - 2
20
40
60
80
100 120 140 160
Temperature (°C)
Derating Curve
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A Product Line of
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DMN4036LK3
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
40
⎯
⎯
⎯
⎯
⎯
⎯
0.5
±100
V
μA
nA
ID = 250μA, VGS = 0V
VDS = 40V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(th)
1.0
RDS (ON)
⎯
gfs
VSD
trr
Qrr
⎯
⎯
S
V
ns
nC
ID = 250μA, VDS = VGS
VGS = 10V, ID = 12A
VGS = 4.5V, ID = 6A
VDS = 15V, ID = 12A
IS = 12A, VGS = 0V
⎯
3.0
0.036
0.061
⎯
1.1
⎯
⎯
V
Static Drain-Source On-Resistance (Note 8)
⎯
0.026
0.049
19.6
0.96
112
926
Ciss
Coss
Crss
Qg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
453
79.1
40.5
4.9
9.2
1.7
2.7
3.2
11.7
11.6
9.5
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
pF
pF
pF
nC
nC
nC
nC
ns
ns
ns
ns
Forward Transconductance (Notes 8 & 9)
Diode Forward Voltage (Note 8)
Reverse recovery time (Note 9)
Reverse recovery charge (Note 9)
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge (Note 10)
Total Gate Charge (Note 10)
Gate-Source Charge (Note 10)
Gate-Drain Charge (Note 10)
Turn-On Delay Time (Note 10)
Turn-On Rise Time (Note 10)
Turn-Off Delay Time (Note 10)
Turn-Off Fall Time (Note 10)
Notes:
Ω
Test Condition
IS = 12A, di/dt = 100A/μs
VDS = 20V, VGS = 0V
f = 1MHz
VGS = 4.5V
VGS = 10V
VDS = 20V
ID = 12A
VDD = 20V, VGS = 10V
ID = 12A, RG ≅ 6.0Ω
8. Measured under pulsed conditions. Pulse width ≤ 300μs; duty cycle ≤ 2%
9. For design aid only, not subject to production testing.
10. Switching characteristics are independent of operating junction temperatures.
DMN4036LK3
Document number: DS32122 Rev. 2 - 2
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A Product Line of
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DMN4036LK3
Typical Characteristics
10V
T = 150°C
4.5V
10
10V
4V
ID Drain Current (A)
ID Drain Current (A)
T = 25°C
4V
3.5V
1
3V
0.1
VGS
0.01
10
3.5V
3V
1
2.5V
0.1
2V
VGS
0.01
0.1
1
10
0.1
VDS Drain-Source Voltage (V)
1
10
VDS Drain-Source Voltage (V)
Output Characteristics
Output Characteristics
1
T = 150°C
0.1
T = 25°C
0.01
1E-3
1
2
3
4
5
VGS Gate-Source Voltage (V)
RDS(on) Drain-Source On-Resistance (Ω)
Typical Transfer Characteristics
10
3V
T = 25°C
3.5V
VGS
4V
1
4.5V
0.1
10V
0.01
0.01
0.1
1
10
ID Drain Current (A)
On-Resistance v Drain Current
DMN4036LK3
Document number: DS32122 Rev. 2 - 2
VGS = 10V
1.4
ID = 12A
RDS(on)
1.2
1.0
0.8
0.6
0.4
-50
VGS(th)
VGS = VDS
ID = 250uA
0
50
100
Tj Junction Temperature (°C)
150
Normalised Curves v Temperature
ISD Reverse Drain Current (A)
ID Drain Current (A)
VDS = 10V
Normalised RDS(on) and VGS(th)
1.6
10
10
1
T = 150°C
T = 25°C
0.1
Vgs = 0V
0.01
0.2
0.4
0.6
0.8
1.0
VSD Source-Drain Voltage (V)
Source-Drain Diode Forward Voltage
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DMN4036LK3
Typical Characteristics - continued
C Capacitance (pF)
VGS = 0V
f = 1MHz
500
CISS
400
COSS
300
CRSS
200
100
0
0.1
1
10
VGS Gate-Source Voltage (V)
10
600
8
6
4
VDS = 20V
2
0
ID = 12A
0
2
4
VDS - Drain - Source Voltage (V)
Capacitance v Drain-Source Voltage
6
8
10
Q - Charge (nC)
Gate-Source Voltage v Gate Charge
Test Circuits
Current
regulator
QG
50k
12V
VG
Q GS
Same as
D.U.T
Q GD
V DS
IG
D.U.T
ID
V GS
Charge
Basic gate charge waveform
Gate charge test circuit
V DS
90%
RD
V GS
V DS
RG
VDD
10%
V GS
td(on)
tr
t(on)
td(off)
tr
t(on)
Switching time waveforms
DMN4036LK3
Document number: DS32122 Rev. 2 - 2
Switching time test circuit
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A Product Line of
Diodes Incorporated
DMN4036LK3
Package Outline Dimensions
DIM
Inches
Millimeters
DIM
Inches
Min
Millimeters
Min
Max
Min
Max
Max
Min
A
0.086
0.094
2.18
2.39
e
A1
-
0.005
-
0.127
H
0.370
0.410
9.40
10.41
b
0.020
0.035
0.508
0.89
L
0.055
0.070
1.40
1.78
b2
0.030
0.045
0.762
1.14
L1
0.108 REF
2.74 REF
b3
0.205
0.215
5.21
5.46
L2
0.020 BSC
0.508 BSC
0.090 BSC
Max
2.29 BSC
c
0.018
0.024
0.457
0.61
L3
0.035
0.065
0.89
1.65
c2
0.018
0.023
0.457
0.584
L4
0.025
0.040
0.635
1.016
D
0.213
0.245
5.41
6.22
L5
0.045
0.060
1.14
1.52
D1
0.205
-
5.21
-
θ1°
0°
10°
0°
10°
E
0.250
0.265
6.35
6.73
θ°
0°
15°
0°
15°
E1
0.170
-
4.32
-
-
-
-
-
-
DMN4036LK3
Document number: DS32122 Rev. 2 - 2
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DMN4036LK3
Suggested Pad Layout
6.2
0.244
3.0
0.118
5.8
0.228
1.6
0.063
2.58
0.101
6.17
0.243
mm
inches
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
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noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A.
B.
Life support devices or systems are devices or systems which:
1.
are intended to implant into the body, or
2.
support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2010, Diodes Incorporated
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DMN4036LK3
Document number: DS32122 Rev. 2 - 2
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