AP2101 2111

AP2101/AP2111
2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH
Description
Pin Assignments
( Top View )
The AP2101 and AP2111 are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
GND 1
applications. The family of devices complies with USB 2.0 and
IN
2
7
OUT
IN
3
6
OUT
EN
4
5
FLG
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time, under-voltage lockout and auto-discharge functionalities. A
7ms deglitch capability on the open-drain Flag output prevents false
SO-8
over-current reporting and does not require any external components.
All devices are available in SO-8 and MSOP-8EP packages.
( Top View )
Features
•
8 NC
Single USB port power switches with auto-discharge
GND
1
8
NC
IN
2
7
OUT
IN
3
6
OUT
EN
4
5
FLG
•
Short-circuit current and thermal protection
•
2.45A accurate current limiting
•
•
Fast transient response time: 5μs
90mΩ on-resistance
•
Reverse Current Blocking
•
Input voltage range: 2.7V – 5.5V
•
Consumer electronics – LCD TV & Monitor, Game Machines
•
0.6ms typical rise time
•
Communications – Set-Top-Box, GPS, Smartphone
•
MSOP-8EP
Applications
•
Very low shutdown current: 1μA (max)
•
Fault report (FLG) with blanking time (7ms typ)
•
ESD protection: 4kV HBM, 300V MM
•
Active low (AP2101) or active high (AP2111) enable
•
Ambient temperature range: -35°C to 85°C
•
Computing – Laptop, Desktop, Servers, Printers, Docking Station,
HUB
SO-8 and MSOP-8EP (Exposed Pad): Available in “Green”
Molding Compound (No Br, Sb)
ƒ
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
ƒ
Halogen and Antimony Free. “Green” Device (Note 3)
•
UL Recognized, File Number E322375
•
IEC60950-1 CB Scheme Certified
Notes:
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Typical Applications Circuit
AP2111 Enable Active High
IN
Power Supply
2.7V to 5.5V
10k
10uF
Load
OUT
0.1uF
0.1uF
120uF
FLG
ON
EN
GND
OFF
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
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AP2101/AP2111
Available Options
Part Number
Channel
AP2101
AP2111
1
1
Enable Pin
(EN)
Active Low
Active High
Current Limit
(Typical)
2.45A
2.45A
Recommended Maximum
Continuous Load Current
2.0A
2.0A
Pin Descriptions
Pin Number
Pin
Name
GND
IN
EN
FLG
OUT
NC
SO-8
1
2, 3
4
5
6, 7
8
MSOP-8EP
1
2, 3
4
5
6, 7
8
Exposed tab
—
Exposed tab
Functions
Ground
Voltage input pin (all IN pins must be tied together externally)
Enable input, active low (AP2101) or active high (AP2111)
Over-current and over-temperature fault report; open-drain flag is active low when triggered
Voltage output pin (all OUT pins must be tied together externally)
No internal connection; recommend tie to OUT pins
Exposed pad.
It should be connected to GND and thermal mass for enhanced thermal impedance.
It should not be used as electrical ground conduction path.
Functional Block Diagram
Current
Sense
IN
Discharge
Control
UVLO
Driver
EN
OUT
Current
Limit
FLG
Deglitch
Thermal
Sense
GND
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
ESD HBM
ESD MM
VIN
Input Voltage
Ratings
4
300
Units
kV
V
6.5
V
VOUT
Output Voltage
VIN +0.3
V
VEN , VFLG
Enable Voltage
6.5
V
ILOAD
TJ(MAX)
TST
Caution:
Note:
Parameter
Human Body Model ESD Protection
Machine Model ESD Protection
Maximum Continuous Load Current
Maximum Junction Temperature
Storage Temperature Range (Note 4)
Internal Limited
A
150
°C
-65 to +150
°C
Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
4. UL Recognized Rating from -30°C to 70°C (Diodes qualified TST from -65°C to 150°C)
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
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AP2101/AP2111
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
Parameter
VIN
Input voltage
IOUT
Output Current
Min
Max
Units
2.7
5.5
V
0
2.0
A
-35
85
°C
EN Input Logic Low Voltage
0
0.8
V
EN Input Logic High Voltage
2
VIN
V
TA
Operating Ambient Temperature
VIL
VIH
Electrical Characteristics (@TA = +25°C, VIN = +5.0V, unless otherwise specified.)
Symbol
Parameter
Test Conditions (Note 5)
Min
Typ
Max
1.6
1.9
2.5
V
Disabled, IOUT = 0
0.5
1
µA
45
70
µA
1
µA
VUVLO
Input UVLO
RLOAD = 1kΩ
ISHDN
Input Shutdown Current
IQ
Input Quiescent Current
Enabled, IOUT = 0
ILEAK
Input Leakage Current
Disabled, OUT grounded
IREV
Reverse Leakage Current
Disabled, VIN = 0V, VOUT = 5V, IREV at VIN
RDS(ON)
Switch On-Resistance
VIN = 5V, IOUT = 1.5A
TA = +25°C
0.05
MSOP8-EP
SO-8
90
95
VIN = 3.3V, IOUT = 1.5A
µA
115
115
140
-40°C ≤ TA ≤ +85°C
115
TA = 25°C
Unit
mΩ
140
170
-40°C ≤ TA ≤ +85°C
ILIMIT
Over-Load Current Limit
VIN = 5V, VOUT = 4.5V, CL=120µF
ITRIG
Current Limiting Trigger Threshold
Output Current Slew rate (<100A/s) , CL = 100µF
2.5
A
Short-Circuit Current Limit
Enabled into short circuit, CL = 100µF
2.5
A
ISHORT
2.1
2.45
TSHORT
Short-Circuit Response Time
VOUT = 0V to IOUT = ILIMIT (short applied to output)
VIL
EN Input Logic Low Voltage
VIN = 2.7V to 5.5V
VIH
EN Input Logic High Voltage
VIN = 2.7V to 5.5V
EN Input leakage
VEN = 5V
TD(ON)
Output Turn-On Delay Time
CL = 1µF, RLOAD = 10Ω
50
TR
Output Turn-On Rise Time
CL = 1µF, RLOAD = 10Ω
0.6
TD(OFF)
Output Turn-Off Delay Time
CL = 1µF, RLOAD = 10Ω
4
Output Turn-Off Fall Time
CL = 1µF, RLOAD = 10Ω
FLG Output FET On-Resistance
IFLG =10mA, CL=100µF
ISINK
TF
RFLG
2.8
5
µs
0.8
V
1
µA
1.5
ms
0.03
0.1
ms
20
40
Ω
7
15
ms
2
V
µs
µs
FLG Blanking Time
CIN = 10µF, CL = 100µF
RDIS
Discharge Resistance (Note 6)
VIN = 5V, disabled, IOUT = 1mA
290
Ω
TSHDN
Thermal Shutdown Threshold
Enabled, RLOAD = 1kΩ
140
°C
THYS
Thermal Shutdown Hysteresis
25
°C
SO-8 (Note 7)
110
°C/W
MSOP-8EP (Note 8)
60
°C/W
TBLANK
θJA
Notes:
Thermal Resistance Junction-toAmbient
4
A
5. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
6. The discharge function is active when the device is disabled (when enable is de-asserted). The discharge function offers a resistive discharge path for
the external storage capacitor. This is suitable only to discharge filter capacitors for limited time and cannot dissipate steady state currents greater than
8mA.
7. Test condition for SO-8: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
8. Test condition for MSOP-8EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and
thermal vias to bottom layer ground plane.
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
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AP2101/AP2111
Typical Performance Characteristics
VEN
50%
TD(ON)
TF
TD(ON)
90%
10%
TD(OFF)
TR
TF
90%
50%
50%
TD(OFF)
TR
VOUT
VEN
50%
VOUT
10%
90%
10%
90%
10%
Figure 1. Voltage Waveforms: AP2101 (left), AP2111 (right)
All Enable Plots are for AP2111 Active High
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
Ven
5V/div
Ven
5V/div
Vout
2V/div
Vout
2V/div
CL = 1µF
CL = 1µF
TA = 25°C
TA = +25°C
RL = 5Ω
RL = 5Ω
400µs/div
400µs/div
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
Ven
5V/div
Ven
5V/div
Vout
2V/div
Vout
2V/div
CL = 100µF
TA = +25°C
CL = 100µF
RL = 5Ω
TA = +25°C
RL = 5Ω
400µs/div
400µs/div
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
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AP2101/AP2111
Typical Performance Characteristics (cont.)
Short Circuit Current,
Device Enabled Into Short
Inrush Current
Ven
5V/div
Ven
5V/div
CL=100µF
Iout
500mA/div
VIN = 5V
Iout
500mA/div
CL=470µF
VIN = 5V
TA = +25°C
RL = 2.5Ω
CL=220µF
TA = +25°C
CL = 100µF
1ms/div
500us/div
0.6 Ω Load Connected to Enabled Device
Short Circuit with Blanking Time and Recovery
VIN = 5V
TA = +25°C
CL = 100µF
Vflag
5V/div
VIN = 5V
TA = +25°C
Vout
5V/div
CL = 100µF
Vflag
5V/div
Iout
1A/div
Iout
2A/div
2ms/div
50ms/div
Power On
Power Off
TA = +25°C
Vflag
5V/div
CL = 100µF
Vflag
5V/div
RL = 2.5Ω
Iout
1A/div
Iout
1A/div
Vin
5V/div
Vin
5V/div
Vout
5V/div
TA = +25°C
CL = 100µF
Vout
5V/div
RL = 2.5Ω
1ms/div
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
10ms/div
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AP2101/AP2111
Typical Performance Characteristics (cont.)
Device Disabled
Device Enabled
Vflag
5V/div
Vflag
5V/div
TA = +25°C
VIN = 5V
Iout
1A/div
VIN = 5V
Iout
1A/div
TA = +25°C
CL = 100µF
RL = 2.5Ω
CL = 100µF
RL = 2.5Ω
Ven
5V/div
Ven
5V/div
Vout
5V/div
Vout
5V/div
1ms/div
1ms/div
UVLO Increasing
UVLO Decreasing
TA = +25°C
CL = 100µF
RL = 2.5Ω
Vin
2V/div
Vin
2V/div
Iout
500mA/div
Iout
500mA/div
TA = +25°C
CL = 100µF
1ms/div
10ms/div
Turn-On Time vs Input Voltage
Turn-Off Time vs Input Voltage
850
55
750
50
Turn-Off Time (us)
Turn-On Time (us)
RL = 2.5Ω
650
550
450
CL = 1µF
RL = 10Ω
350
CL = 1µF
RL = 10Ω
45
TA = +25°C
40
35
30
TA = +25°C
250
25
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
1.5
Input Voltage (V)
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
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AP2101/AP2111
Typical Performance Characteristics (cont.)
Fall Time vs Input Voltage
Rise Time vs Input Voltage
650
25
600
24
Fall Time (us)
Rise Time (us)
550
500
450
CL = 1µF
400
22
CL = 1µF
21
RL = 10Ω
RL = 10Ω
20
TA = +25°C
350
23
TA = +25°C
19
300
2
2.5
3
3.5
4
4.5
5
5.5
2
6
2.5
3
3.5
0.9
Supply Current, Output Disabled (uA)
52
47
Vin=5.5V
42
37
32
4.5
5
5.5
6
Supply Current, Output Disabled vs Ambient Temperature
Supply Current, Output Enabled vs Ambient Temperature
Supply Current, Output Enabled (uA)
4
Input Voltage (V)
Input Voltage (V)
Vin=5.0V
Vin=3.3V
27
Vin=5.5V
0.8
Vin=5.0V
0.7
0.6
Vin=3.3V
0.5
0.4
0.3
0.2
0.1
0.0
-60
-40
-20
0
20
40
60
80
100
-60
-40
-20
Ambient Temperature (°C)
0
20
40
60
80
100
80
100
Ambient Temperature (°C)
Short-Circuit Output Current vs Ambient Temperature
Static Drain-Source On-State Resistance vs Ambient
Temperature
Static Drain-Source On-State
Resistance (mΩ)
Short-Circuit Output Current (A)
2.70
140
Vin=3.3V
130
120
110
100
90
Vin=5.0V
80
CL = 120µF
2.65
Vin=3.3V
2.60
2.55
2.50
Vin=5.0V
2.45
2.40
2.35
2.30
70
-60
-40
-20
0
20
40
60
80
100
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
-60
-40
-20
0
20
40
60
Ambient Temperature (°C)
Ambient Temperature (°C)
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AP2101/AP2111
Typical Performance Characteristics (cont.)
Undervoltage Lockout vs Ambient Temperature
Threshold Trip Current vs Input Voltage
3.24
2.15
Threshold Trip Current (A)
Undervoltage Lockout (V)
3.22
2.10
UVLO Rising
2.05
2.00
UVLO Falling
1.95
3.20
3.18
3.16
TA = +25°C
3.14
CL = 68µF
3.12
3.10
1.90
3.08
-60
-40
-20
0
20
40
60
80
100
2.8
Ambient Temperature (°C)
3.3
3.8
4.3
4.8
5.3
Input Voltage (V)
Current Limit Response vs Peak Current
Current Limit Response (us)
45
40
VIN = 5V
35
TA = +25°C
30
25
20
15
10
5
0
0
2
4
6
8
10
12
Peak Current (A)
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
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AP2101/AP2111
Application Information
Power Supply Considerations
A 0.1-μF to 1-μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input (10-μF minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces
power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor
improves the immunity of the device to short-circuit transients.
Over-Current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before
VIN has been applied. The AP2101/AP2111 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current
may flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the overcurrent trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2101/AP2111 is capable of delivering current
up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting
mode and is set at ILIMIT.
To protect against short circuit to GND at extremely low temperature (< -30°C), a minimum 120-μF electrolytic capacitor on the output pin is
recommended.
A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that
capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature
characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic
capacitor type is Panasonic FC series.
At low input voltage condition (VIN < 3V), the short circuit protection current may rise as high as twice the typical value.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout.
The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy
capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch
timeout. The AP2101/AP2111 is designed to eliminate false over-current reporting without the need of external components to remove unwanted
pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
2
PD = RDS(ON)× I
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where:
TA= Ambient temperature °C
RθJA = Thermal resistance
PD = Total power dissipation
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
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AP2101/AP2111
Application Information (cont.)
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2101/AP2111 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal
sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing
the device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or
input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.
Under-Voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V,
even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the
design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Host/Self-Powered HUBs
Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports. This power supply
must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts and SPHs
are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop PCs,
monitors, printers, and stand-alone hubs.
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP2101/AP2111, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2101/AP2111 also ensures that the switch is off
after the card has been removed, and that the switch is off during the next insertion.
By placing the AP2101/AP2111 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion.
The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls
system surge current and provides a hot-plugging mechanism for any device.
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
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AP2101/A
AP2111
O
Ordering
In
nformation
n
mber
Part Num
Package
P
Code
Packagin
ng
AP21X1S
SG-13
AP21X1MP
PG-13
S
MP
SO-8
MSOP-8E
EP
13” Tape an
nd Reel
Quantity
y
Part Numb
ber Suffix
2500/Tape & Reel
-13
2500/Tape & Reel
-13
M
Marking
Infformation
(1) SO-8
( Top
p View )
8
7
6
5
1 : 1 Chan
nnel
YY : Yearr : 08, 09,10~
WW : Week : 01~52; 52
2
representts 52 and 53 week
w
X : Interna
al Code
G : Green
n
Logo
Partt Number
6 : Active
A
Low
7 : Active
A
High
AP21
1X X D
YY WW
W XX
1
2
3
4
EP
(2) MSOP-8E
( Top View
V
)
8
7
Logo
AP21X X D
1
Document numberr: DS32015 Rev. 3 - 2
5
YWXE
Parrt Number
6 : Active
A
Low
7 : Active
A
High
AP2101/AP2
2111
6
2
3
A~Z : Green
n
MSOP-8-EP
P
Y : Year : 0~
~9
W : Week : a~z : 1~26 week;
A~Z : 27~52
2 week; Z reprresents
52 and 53 week
w
1 : 1 Channel
4
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ed
AP2101/AP2111
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
0.254
(1) SO-8
E1 E
A1
Gauge Plane
Seating Plane
L
Detail ‘A’
h
7°~9°
45°
Detail ‘A’
A2 A A3
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82
0°
8°
θ
All Dimensions in mm
b
e
D
(2) MSOP-8EP
D
4X
10
°
x
E
0.25
D1
E2
Gauge Plane
Seating Plane
a
y
1
4X
10
°
8Xb
e
Detail C
E3
A1
A3
c
A2
A
D
L
E1
See Detail C
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
12 of 14
www.diodes.com
MSOP-8EP
Dim Min Max Typ
A
1.10
A1
0.05 0.15 0.10
A2
0.75 0.95 0.86
A3
0.29 0.49 0.39
b
0.22 0.38 0.30
c
0.08 0.23 0.15
D
2.90 3.10 3.00
D1
1.60 2.00 1.80
E
4.70 5.10 4.90
E1
2.90 3.10 3.00
E2
1.30 1.70 1.50
E3
2.85 3.05 2.95
e
0.65
L
0.40 0.80 0.60
a
0°
8°
4°
x
0.750
y
0.750
All Dimensions in mm
January 2013
© Diodes Incorporated
AP2101/AP2111
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) SO-8
X
Dimensions
X
Y
C1
C2
C1
Value (in mm)
0.60
1.55
5.4
1.27
C2
Y
(2) MSOP-8-EP
X
C
G
Y2
Y
Dimensions
Y1
C
G
X
X1
Y
Y1
Y2
X1
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
13 of 14
www.diodes.com
Value
(in mm)
0.650
0.450
0.450
2.000
1.350
1.700
5.300
January 2013
© Diodes Incorporated
AP2101/AP2111
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
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final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
14 of 14
www.diodes.com
January 2013
© Diodes Incorporated
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