AP2145 2155

 Green
AP2145/ AP2155
0.5A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH
Description
Pin Assignments
The AP2145 and AP2155 are integrated high-side power switches
SO-8
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and
EN
1
8
OUT
FLG
2
7
IN
GND
3
6
OUT
NC
4
5
NC
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time and under-voltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false over-current reporting
and does not require any external components.
All devices are available in SO-8 and MSOP-8EP packages.
(Top View)
Features
MSOP-8EP

Single USB Port Power Switches

Over-Current and Thermal Protection

0.8A Accurate Current Limiting

Reverse Current Blocking
EN
1
8
OUT
FLG
2
7
IN
GND
3
6
OUT
NC
4
5
NC

90mΩ On-Resistance

Input Voltage Range: 2.7V - 5.5V

0.6ms Typical Rise Time

Very Low Shutdown Current: 1µA (max)

Fault Report (FLG) with Blanking Time (7ms typ)

ESD Protection: 6kV HBM, 400V MM

Active High (AP2155) or Active Low (AP2145) Enable

Ambient Temperature Range -40°C to +85°C

Consumer electronics – LCD TV & Monitor, Game Machines

SO-8 and MSOP-8EP (Exposed Pad): Available in “Green”

Communications – Set-Top-Box, GPS, Smartphone
Molding Compound (No Br, Sb)

(Top View)
Applications

Lead-Free Finish; RoHS Compliant (Notes 1 & 2)

Halogen and Antimony Free. “Green” Device (Note 3) 
UL Recognized, File Number E322375

IEC60950-1 CB Scheme Certified
Notes:
Computing – Laptop, Desktop, Servers, Printers, Docking Station,
HUB
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Typical Applications Circuit
IN
Power Supply
2.7V to 5.5V
10k
10uF
OUT
Load
0.1uF
0.1uF
120uF
FLG
EN
ON
GND
OFF
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
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AP2145/ AP2155
Available Options
Part Number
Channel
AP2145
AP2155
1
1
Enable Pin
(EN)
Active Low
Active High
Current Limit
(typ)
0.8A
0.8A
Recommended Maximum
Continuous Load Current
0.5A
0.5A
Pin Descriptions
Pin Name
Pin Number
EN
FLG
GND
NC
OUT
IN
SO-8
1
2
3
4, 5
6, 8
7
Exposed Pad
—
MSOP-8EP
1
2
3
4, 5
6, 8
7
Function
Enable input, active low (AP2145) or active high (AP2155)
Over-current and over-temperature fault report; open-drain flag is active low when triggered.
Ground
No internal connection
Voltage output pin (all OUT pins must be tied together externally)
Voltage input pin
Exposed Pad:
Exposed Pad It should be externally connected to GND plane and thermal mass for enhanced thermal impedance.
It should not be used as electrical ground conduction path.
Functional Block Diagram
AP2145, AP2155
IN
Current
Sense
OUT
Current
Limit
FLG
UVLO
EN
Driver
Deglitch
Thermal
Sense
GND
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
ESD HBM
ESD MM
Parameter
Human Body Model ESD Protection
Machine Model ESD Protection
Ratings
6
400
6.5
V
VOUT
Output Voltage
VIN +0.3
V
VEN , VFLG
Enable Voltage
6.5
V
VIN
ILOAD
TJ(MAX)
TST
Input Voltage
Unit
kV
V
Maximum Continuous Load Current
Internal Limited
A
150
°C
-65 to +150
°C
Maximum Junction Temperature
Storage Temperature Range (Note 4)
Caution:
Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Note:
4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C)
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
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AP2145/ AP2155
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
VIN
Parameter
Min
Max
Unit
2.7
5.5
V
Input voltage
IOUT
Output Current
0
500
mA
VIL
EN Input Logic Low Voltage
0
0.8
V
VIH
EN Input Logic High Voltage
2.0
VIN
V
TA
Operating Ambient Temperature
-40
85
C
Electrical Characteristics (@TA = +25°C, VIN = +5.0V, unless otherwise specified.)
Symbol
Parameter
Test Conditions
Min
Typ.
Max
Unit
1.6
1.9
2.5
V
VUVLO
Input UVLO
ISHDN
Input Shutdown Current
Disabled, OUT = open
0.5
1
µA
IQ
Input Quiescent Current
Enabled, OUT = open
45
70
µA
ILEAK
Input Leakage Current
Disabled, OUT grounded
1
µA
IREV
Reverse Leakage Current
Disabled, VIN= 0V, VOUT= 5V, IREV at VIN
1
RDS(ON)
Switch On-Resistance
MSOP-8EP
VIN = 5V, IOUT = 0.5A, -40°C ≤ TA ≤ +85°C
SO-8
90
95
140
140
mΩ
mΩ
VIN = 3.3V, IOUT = 0.5A, -40°C ≤ TA ≤ +85°C
120
160
mΩ
ISHORT
Short-Circuit Current Limit
Enabled into short circuit, CIN =10µF, CL = 100µF
0.7
ILIMIT
Over-Load Current Limit
VIN = 5V, VOUT = 4.5V, CIN =10µF, CL = 100µF,
-40°C ≤ TA ≤ +85°C
ITRIG
Current Limiting Trigger Threshold
Output Current Slew rate (<100A/s), CIN = 10µF, CL = 22µF
1.0
A
TSHORT
Short-Circuit Response Time
VOUT = 0V to IOUT = ILIMIT (short applied to output),
CL = 100µF
10
µs
VIL
EN Input Logic Low Voltage
VIN = 2.7V to 5.5V
VIH
EN Input Logic High Voltage
VIN = 2.7V to 5.5V
EN Input Leakage
Output Leakage Current
ISINK
IO-LEAK
RLOAD = 1kΩ
-1
0.6
0.8
µA
A
1.0
0.8
V
VEN = 5V
1
µA
Disabled
1
µA
2
V
TD(ON)
Output Turn-On Delay Time
CL = 1µF, RLOAD = 10Ω
0.05
TR
Output Turn-On Rise Time
CL = 1µF, RLOAD = 10Ω
0.6
TD(OFF)
Output Turn-Off Delay Time
CL = 1µF, RLOAD = 10Ω
0.01
ms
1.5
Output Turn-Off Fall Time
CL = 1µF, RLOAD = 10Ω
0.05
0.1
FLG Output FET On-Resistance
VIN = 3.3V or 5V, CIN = 10µF, IFLG = 10mA
20
40
IFLG
FLG Leakage Current
VFLG = 5V
1
TBlLANK
FLG Blanking Time
VIN = 3.3V or 5V, CIN = 10µF, CL = 100µF
TSHDN
Thermal Shutdown Threshold
Enabled, RLOAD = 1kΩ
THYS
Thermal Shutdown Hysteresis
θJA
Notes:
Thermal Resistance Junction-toAmbient
4
7
ms
ms
RFLG
TF
A
ms
Ω
µA
15
ms
135
C
25
C
SO-8 (Note 5)
110
C/W
MSOP-8EP (Note 6)
60
C/W
5. Test condition for SO-8: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer
and thermal vias to bottom layer ground plane.
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
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AP2145/ AP2155
Typical Performance Characteristics
VEN
50%
TD(ON)
TD(ON)
90%
10%
TD(OFF)
TR
TF
90%
50%
50%
TD(OFF)
TR
VOUT
VEN
50%
VOUT
10%
TF
90%
10%
90%
10%
Figure 1. Voltage Waveforms: AP2145 (left), AP2155 (right)
All Enable Plots are for AP2155 Active High
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
Ven
5V/div
Ven
5V/div
Vout
2V/div
Vout
2V/div
CL=1µF
CL=1µF
TA= +25°C
TA= +25°C
RL=10Ω
RL=10Ω
500µs/div
500µs/div
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
Ven
5V/div
Ven
5V/div
Vout
2V/div
Vout
2V/div
CL=100µF
CL=100µF
TA= +25°C
TA= +25°C
RL=10Ω
500µs/div
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
RL=10Ω
500µs/div
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AP2145/ AP2155
Typical Performance Characteristics (cont.)
Short Circuit Current,
Device Enabled Into Short
Inrush Current
CL=100µF
Ven
5V/div
Ven
5V/div
Iout
200mA/div
VIN=5V
TA= +25°C
RL=10Ω
Iin
200mA/div
VIN= 5V
TA= +25°C
CL=470µF
CL=220µF
CL=100µF
500µs/div
1ms/div
3 Ω Load Connected to Enabled Device
2 Ω Load Connected to Enabled Device
VIN=5V
TA= +25°C
CL=100µF
Vflag
2V/div
VIN=5V
TA= +25°C
CL=100µF
Vflag
2V/div
Iout
500mA/div
Iout
500mA/div
2ms/div
2ms/div
Short Circuit with Blanking Time and Recovery
Power On
Vflag
5V/div
Vout
5V/div
Vflag
5V/div
VIN=5V
TA= +25°C
CL=100µF
Iout
1A/div
TA= +25°C
CL=100µF
RL=10Ω
Iout
200mA/div
Vin
5V/div
Vout
5V/div
50ms/div
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
1ms/div
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Vout
5V/div
March 2013
© Diodes Incorporated
AP2145/ AP2155
Typical Performance Characteristics (cont.)
Power Off
Device Enabled
TA= +25°C
CL=100µF
RL=10Ω
Vflag
5V/div
Iout
200mA/div
Vflag
5V/div
Iout
200mA/div
Vin
5V/div
Ven
5V/div
Vout
5V/div
Vout
5V/div
TA= +25°C
CL=100µF
RL=10Ω
10ms/div
1ms/div
Device Disabled
UVLO Increasing
Vflag
5V/div
TA= +25°C
CL=100µF
RL=10Ω
Vin
2V/div
TA= +25°C
CL=100µF
RL=10Ω
Iout
200mA/div
Ven
5V/div
Iout
200mA/div
Vout
5V/div
1ms/div
1ms/div
UVLO Decreasing
TA= +25°C
CL=100µF
RL=10Ω
Vin
2V/div
Iout
200mA/div
10ms/div
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
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AP2145/ AP2155
Typical Performance Characteristics (cont.)
Turn-Off Time vs Input Voltage
800
31
700
31
600
Turn-Off Time (us)
Turn-On Time (us)
Turn-On Time vs Input Voltage
500
400
300
200
CL=1µF
RL=10Ω
TA= +25°C
100
30
CL=1µF
RL=10Ω
TA= +25°C
30
29
29
28
28
0
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1.5
6
2
2.5
3
4
4.5
5
5.5
6
5.5
6
Fall Time vs Input Voltage
Rise Time vs Input Voltage
600
25
500
24
400
23
Fall Time (us)
Rise Time (us)
3.5
Input Voltage (V)
Input Voltage (V)
300
CL=1µF
RL=10Ω
TA= +25°C
200
22
CL=1µF
RL=10Ω
TA= +25°C
21
20
100
19
0
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1.5
6
2
2.5
3
3.5
4
4.5
5
Input Voltage (V)
Input Voltage (V)
Supply Current, Output Disabled vs Ambient Temperature
Vin=5.5V
Vin=5.0V
Vin=3.3V
Supply Current, Output Disabled (uA)
1.60
Vin=5.5V
1.40
1.20
Vin=5.0V
1.00
Vin=3.3V
0.80
0.60
Vin=2.7V
0.40
0.20
0.00
-45
-25
-5
15
35
55
75
95
Ambient Temperature (°C)
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
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AP2145/ AP2155
Typical Performance Characteristics (cont.)
Static Drain-Source On-State Resistance vs Ambient
Temperature
Short-Circuit Output Current vs Ambient Temperature
750
Short-Circuit Output Current (A)
Static Drain-Source On-State
Resistance (mΩ)
145
Vin=3.3V
135
125
115
105
95
85
75
745
Vin=3.3V
740
735
730
Vin=5V
725
Vin=5V
720
65
-60
-40
-20
0
20
40
60
80
-60
100
-40
-20
0
20
40
60
80
100
Ambient Temperature (°C)
Ambient Temperature (°C)
Threshold Trip Current vs Input Voltage
Undervoltage Lockout vs Ambient Temperature
1.15
2.05
Threshold Trip Current (A)
Undervoltage Lockout (V)
2.04
2.03
UVLO Rising
2.02
2.01
2.00
1.99
UVLO Falling
1.98
1.97
1.14
1.13
1.12
TA= +25°C
CL=22µF
1.11
1.96
1.10
1.95
-60
-40
-20
0
20
40
60
80
100
2.8
3.3
3.8
4.3
4.8
5.3
Input Voltage (V)
Ambient Temperature (°C)
Current Limit Response vs Peak Current
45
Current Limit Response (us)
40
35
30
VIN=5V
25
TA= +25°C
20
CL=22µF
15
10
5
0
2
3
4
5
6
7
8
9
10
Peak Current (A)
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
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AP2145/ AP2155
Application Information
Power Supply Considerations
A 0.1-μF to 1-μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply
transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity
of the device to short-circuit transients.
Over-Current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN
has been applied. The AP2145/AP2155 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may
flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current
trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2145/AP2155 is capable of delivering current up
to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode
and is set at ILIMIT.
To protect against short circuit to GND at extremely low temperature (< -30°C), a minimum 120-μF electrolytic capacitor on the output pin is
recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that capacitance
value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature characteristics of less
than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic capacitor type is
Panasonic FC series.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2145/AP2155 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
2
PD = RDS(ON)× I
Finally, calculate the junction temperature:
TJ = PD x RJA + TA
Where:
TA= Ambient temperature C
RJA = Thermal resistance
PD = Total power dissipation
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2145/AP2155 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense
circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the
device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input
power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
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AP2145/ AP2155
Application Information (cont.)
Under-Voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even
if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design
of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP2145/AP2155, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2145/AP2155 also ensures that the switch is off
after the card has been removed, and that the switch is off during the next insertion.
By placing the AP2145/AP2155 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The
typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system
surge current and provides a hot-plugging mechanism for any device.
Ordering Information
AP 21 X 5 XX G - 13
Channel
Package
Green
Packing
5 : 1 Channel
S : SO-8
MP : MSOP-8EP
G : Green
13 : Tape & Reel
Enable
4 : Active Low
5 : Active High
Part Number
Package Code
Packaging
AP21X5SG-13
S
SO-8
Quantity
2500/Tape & Reel
AP21X5MPG-13
MP
MSOP-8EP
2500/Tape & Reel
13” Tape and Reel
Part Number Suffix
-13
-13
Marking Information
(1)
SO-8
( Top view )
8
7
6
5
Logo
Part Number
4 : Active Low
5 : Active High
YY WW X X
1
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
5 : 1 Channel
G : Green
YY : Year : 08, 09,10~
WW : Week : 01~52; 52
represents 52 and 53 week
X : Internal Code
AP21X X
2
3
4
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AP2145/ AP2155
Marking Information (cont.)
(2)
MSOP-8EP
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
0.254
(1) Package Type: SO-8
E1 E
Gauge Plane
Seating Plane
A1
L
Detail ‘A’
7°~9°
h
45°
Detail ‘A’
A2 A A3
b
e
D
(2)
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82
0
8

All Dimensions in mm
Package Type: MSOP-8EP
D
4X
10
°
0.25
D1
x
E
E2
Gauge Plane
Seating Plane
a
y
1
4X
10
°
8Xb
e
Detail C
E3
A1
A3
L
c
A2
A
D
E1
See Detail C
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
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MSOP-8EP
Dim Min Max Typ
A
1.10
A1
0.05 0.15 0.10
A2
0.75 0.95 0.86
A3
0.29 0.49 0.39
b
0.22 0.38 0.30
c
0.08 0.23 0.15
D
2.90 3.10 3.00
D1
1.60 2.00 1.80
E
4.70 5.10 4.90
E1
2.90 3.10 3.00
E2
1.30 1.70 1.50
E3
2.85 3.05 2.95
e
0.65
L
0.40 0.80 0.60
a
0°
8°
4°
x
0.750
y
0.750
All Dimensions in mm
March 2013
© Diodes Incorporated
AP2145/ AP2155
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package Type: SO-8
X
Dimensions
X
Y
C1
C2
C1
Value (in mm)
0.60
1.55
5.4
1.27
C2
Y
(2)
Package Type: MSOP-8EP
X
C
Y
G
Y2
Dimensions
C
G
X
X1
Y
Y1
Y2
Y1
X1
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
12 of 13
www.diodes.com
Value
(in mm)
0.650
0.450
0.450
2.000
1.350
1.700
5.300
March 2013
© Diodes Incorporated
AP2145/ AP2155
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
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LIFE SUPPORT
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
13 of 13
www.diodes.com
March 2013
© Diodes Incorporated
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