DISCRETE PACKAGE Data Sheet HSON8 Standard Materials Introduction The HSON8 package maintains the same footprint area (5 x 6 mm) as the standard SOP8 package. HSON8 features an exposed die pad to enhance thermal performance. Applications The HSON8 is suitable for medium-power applications (reference values 80W*/60A), designed for low on-resistance and high-speed switching MOSFETs: • Motor drivers • Injection drivers • Power supply circuits • Lamp drivers • Automotive products *Tc = 25°C, Tj = Max 150°C Enhanced Feature Options • Al wire bonding • Full turnkey available from wafer probe through test and packing • Green materials: Pb-free plating & halogen free mold compound • Plating coverage at the tip of the lead is more than 50% of leadframe thickness Under Development • Environmentally friendly die attach Pb-free solder • Leadframe: Copper with Ni plating on wire bonding area • Die attach: Pb solder • Interconnect: Al wire • Mold compound: Halogen free Reliability Qualification J-Devices packages are assembled with proven reliable semiconductor materials. • All reliability testing includes: JEDEC standard pre-conditioning except high temperature storage • 85°C/85%RH, 168 hours, IR reflow 260°C 3X • PCT: 121°C/100%RH/2 atm, 96 hours • Temp Cycle: -55°C/+150°C, 300 cycles • High Temp Storage: 175°C, 1000 hours Test Services J-Devices offers full turnkey business for all power discrete products with the capability to test various types of power devices including: MOSFETs, intelligent power devices, etc. • Power discrete test capability: – DC – Capacitance *1 – Rg *1 – Avalanche test – Thermal resistance • Program conversion • Electrical failure analysis • Integrated test, marking, vision inspection and tape & reel services *1 Sampling test only Process Highlights • Interconnect: φ125 µm ~ φ300 µm Al wire • Plating: 100% matte Sn • Marking: Laser mark Shipping • Tape and reel packing – 2500 pcs per reel – Tape width 12 mm – Reel Ф = 330 mm • Barcode packing label DSJD407A Rev Date: 3/15 www.j-devices.co.jp Data Sheet DISCRETE PACKAGE HSON8 Cross-section Top & Bottom View Mold Compound Wire Die Leadframe Die Attach Material Package Outline Drawing – HSON8 Unit: mm With respect to the information in this document, J-Devices makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. J-Devices shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify J-Devices’ warranty on any product beyond that set forth in its standard terms and conditions of sale. J-Devices reserves the right to make changes in its product and specifications at any time and without notice. © 2015, J-Devices Corporation. All Rights Reserved. DSJD406A Rev Date: 3/15 www.j-devices.co.jp