485AG

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
12 PIN WDFN 3.0x1.0, 0.5P
CASE 485AG−01
ISSUE A
DATE 31 MAR 2006
12
1
SCALE 4:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION b APPLIES TO TERMINAL AND
IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
D
PIN ONE
REFERENCE
E
2X
0.15 C
TOP VIEW
2X
0.15 C
(A3)
0.10 C
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.18
0.30
3.00 BSC
1.00 BSC
0.50 BSC
0.20
0.40
DIM
A
A1
A3
b
D
E
e
L
A
12 X
0.08 C
SEATING
PLANE
SIDE VIEW
A1
12 X L
1
e
10X
C
GENERIC
MARKING DIAGRAM*
xxxxYW
6
1
12
7
12 X b
0.10 C A B
BOTTOM VIEW
0.05 C
NOTE 3
xxxx
Y
W
G or G
= Specific Device Code
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER:
98AON19981D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
12 PIN WDFN 3.0X1.0, 0.5 MM PITCH
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
1
1
DOCUMENT NUMBER:
98AON19981D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
18 NOV 2004
A
CHANGED DIMENSION A MAX VALUE TO 0.80. CHANGED CASE DESCRIPTION.
REQ. BY E. SOTO.
31 MAR 2006
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 01A
Case Outline Number:
485AG