DISCRETE PACKAGE Data Sheet TO-220 (F) Standard Materials • • • • Introduction The TO-220 (F) package is a full pack version of the TO-220 package for high-power discrete products. The heat sink is isolated encapsulated with mold to improve manufacturability. Extra hardware is not needed for electrical isolation between the devices and the heat sink. Applications Leadframe: Bare copper Die attach: Pb solder Interconnect: Al wire 15.7 mil max Mold compound: With halogen Reliability Qualification J-Devices packages are assembled with proven reliable semiconductor materials. • PCT: 121°C/100% RH/2 atm, 96 hours • Temp Cycle: -65°C/+150°C, 300 cycles • High Temp Storage: 150°C, 1000 hours Test Services The TO-220 (F) package is suitable for mediumpower applications (reference values 35W*/80A), designed for low on-resistance and high-speed switching MOSFETs: • HV circuits • Motor drivers • Power supply circuits • Consumer products • Automotive products *Tc = 25°C, Tj = Max 150°C Enhanced Feature Options • Low on-resistance and high current density due to thick Al wire bonding • Full turnkey available from wafer probe through test and packing • Pb-free dipping Under Developments • Environmentally friendly die attach Pb-free solder • Halogen free mold compound J-Devices offers full turnkey business for all power discrete products with the capability to test various types of power devices including: MOSFETs, intelligent power devices, etc. • Power discrete test capability: – DC – Capacitance *1 – Rg *1 – Avalanche test – Thermal resistance – Dielectric strength voltage • Program conversion • Electrical failure analysis • Integrated test, marking, vision inspection and tape & reel services *1 Sampling test only Shipping • Loose packing (std. 200 pcs/pack) • Barcode packing label Process Highlights • Interconnect: Thick Al wire bonding technology • Lead finish: Sn-Ag-Cu dipping • Marking: Laser mark DSJD411A Rev Date: 3/15 www.j-devices.co.jp Data Sheet DISCRETE PACKAGE TO-220 (F) Cross-section Top & Bottom View Wire Die Attach Material Leadframe Mold Compound Die Package Outline Drawing – TO-220 (F) Unit: mm With respect to the information in this document, J-Devices makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. J-Devices shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify J-Devices’ warranty on any product beyond that set forth in its standard terms and conditions of sale. J-Devices reserves the right to make changes in its product and specifications at any time and without notice. © 2015, J-Devices Corporation. All Rights Reserved. DSJD411A Rev Date: 3/15 www.j-devices.co.jp