488AP

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WQFN16, 1.8x2.6, 0.4P
CASE 488AP−01
ISSUE B
DATE 25 JUN 2008
1
SCALE 5:1
PIN 1 REFERENCE
2X
2X
L
A
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
E
ÉÉ
ÉÉ
EXPOSED Cu
0.15 C
B
A1
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.050
0.20 REF
0.15
0.25
1.80 BSC
2.60 BSC
0.40 BSC
0.30
0.50
0.00
0.15
0.40
0.60
MOUNTING FOOTPRINT
C
A3
8
0.562
0.0221
15 X L
9
e
1
DIM
A
A1
A3
b
D
E
e
L
L1
L2
SEATING
PLANE
A1
4
ÇÇ
ÉÉ
ALTERNATE
CONSTRUCTIONS
0.08 C
DETAIL A
A3
MOLD CMPD
DETAIL B
A
DETAIL B
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
5. EXPOSED PADS CONNECTED TO DIE FLAG.
USED AS TEST CONTACTS.
L1
0.15 C
0.10 C
L
0.400
0.0157
0.225
0.0089
1
12
2.900
0.1142
16
L2
16 X
b
0.463
0.0182
0.10 C A B
0.05 C
NOTE 3
1.200
0.0472
2.100
0.0827
SCALE 20:1
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
98AON20790D
ON SEMICONDUCTOR STANDARD
http://onsemi.com
WQFN16, 1.8 X 2.6, 0.4P
1
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
mm Ǔ
ǒinches
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON20790D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY EDWIN SOTO.
18 MAY 2005
A
CORRECTED DEVICE TITLE. REQ. BY EDWIN SOTO.
30 AUG 2005
B
ADDED TERMINAL OPTIONS DETAILS A AND B. REQ. BY A. CARMONA.
25 JUN 2008
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2008
June, 2008 − Rev. 01B
Case Outline Number:
488AP
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