R C-Dr ives, R C -Dr ives F ast an d R C -D r i ves Autom ot i ve R C-Dr ives IGB T for c ons u mer a nd aut om ot i ve appl i ca ti ons Rebec Mitja Note Application About this document Scope and purpose This application note describes a cost-optimized discrete IGBT solution in order to address to the pricesensitive consumer drives market. Furthermore, a comparison will be made between the two technologies RC-Drives (RC-D) and RC-Drives Fast (RC-DF) IGBTs. The RC-D device is optimized for low conduction losses while the RC-DF device is optimized for low switching losses. Intended audience This document is intended for design engineers who want to improve their high voltage consumer drive applications. Table of contents 1 Introduction and short description of the product family .............................................................. 2 2 2.1 2.2 Static and dynamic behavior ......................................................................................................... 4 Static behavior .................................................................................................................................... 4 Dynamic behavior ............................................................................................................................... 4 3 Application ..................................................................................................................................... 7 4 4.1 4.2 4.3 In-circuit application test on 200 W motor drive board .................................................................. 9 Efficiency ............................................................................................................................................. 9 Thermal behavior .............................................................................................................................. 10 Cooling considerations ..................................................................................................................... 11 1 Revision 1.1, 2015-08-12 RC-Drives IGBT for consumer and automotive applications Introduction and short description of the product family 1 Introduction and short description of the product family The RC-Drives IGBT technology was released by Infineon at the end of 2009 as a cost-optimized solution to address the price-sensitive consumer drives market. This basic technology provides outstanding performance in BLDC motor drives adopting block commutation–type of modulations, where one or both IGBT in the half-bridge are left conducting for 120° of the motor electrical angle (Dae-Woong Chung et al., IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, VOL. 46, No. 3, June 1999). Due to the low conduction losses of both IGBT and integrated diode, the overall losses are drastically reduced. This type of control is commonly found in fridge compressors: by limiting the hard switching events the dv/dt and dI/dt commutation slopes are avoided, therefore the harmonic content injected into the motor windings (hence the EMI) is reduced. Below we have a typical example of this type of commutation found on a 100 W commercial fridge compressor: High side Figure 1 Low side High side and low side gate signals for 120° PWM commutation switching Another application that benefits from the low on-state losses or the RC-Drives is found in domestic aircon systems: the ~1.5 kW BLDC compressor is driven by IGBTs switched by full sinusoidal PWM hard switching at moderate switching frequencies of 5 to 8 kHz. Again in this case a device optimized for low conduction losses provides an overall loss reduction. However, the trend observed in low power drives for outdoor and indoor fans of domestic aircon systems as well as industrial fans and pumps up to ~200 W is to increase the PWM switching frequency. The reason is two fold: on one side the size of the output filter can be reduced by keeping the same current ripple. On the other side, in small motor drives adopting sensor-less FOC (Field Oriented Control), where a high dynamic control (torque and speed) of the PMSM motor is required, the higher switching frequency allows to increase the sampling rate of current and hence the accuracy of reconstructed rotor position. In order to meet the rising demands of the IGBTs for the low power motor drive consumer market, a new version of the RC-Drives IGBT is developed: the IGBT and diode losses are optimized to reduce the inverter Application Note 2 Revision 1.1, 2015-08-12 RC-Drives IGBT for consumer and automotive applications Introduction and short description of the product family losses at switching frequencies of 18~30 kHz. The new family is called RC-DF, and released in the current classes from 2.5 A to 15 A in DPAK packages. Static and dynamic behavior of RC-D and RC Drives Automotive (RC-DA) devices are similar, therefore all characteristics for RC-D are valid also for RC-DA devices. Table 1 Part Product specification for RC-D and RC-DFast Package type Power [W] Switching frequency VCE number [V] 25°C 100°C 25°C IKD03N60RF DPAK 40-80 4-30 kHz 600 5 2.5 2.2 IKD04N60RF DPAK 80-150 4-30 kHz 600 8 4 IKD06N60RF DPAK 150-250 4-30 kHz 600 12 IKD10N60RF DPAK 250-600 4-30 kHz 600 20 IKD15N60RF DPAK 600-1000 4-30 kHz 600 IKU04N60R IPAK IKD04N60R DPAK 80-150 DC to 5 kHz IKU06N60R IPAK IKD06N60R DPAK 150-250 IKU10N60R IPAK IKD10N60R DPAK IKU15N60R IPAK IKD15N60R DPAK Table 2 IC [A] VCE(sat) [V] Ets [mJ] tSC VF [V] 175°C 25°C 175°C [s] Qrr [µC] 25°C 175°C 25°C 175°C 2.3 0.09 0.14 5 2.1 2.0 0.06 0.19 2.2 2.3 0.11 0.19 5 2.1 2.0 0.09 0.26 6 2.2 2.3 0.18 0.28 5 2.1 2.0 0.16 0.34 10 2.2 2.3 0.35 0.52 5 2.1 2.0 0.27 0.62 30 15 2.2. 2.3 0.52 0.78 5 2.1 2.0 0.42 1.00 600 8 4 1.65 1.85 0.24 0.4 5 1.7 1.7 0.22 0.52 DC to 5 kHz 600 12 6 1.65 1.85 0.33 0.56 5 1.7 1.7 0.37 0.80 250-600 DC to 8 kHz 600 20 10 1.65 1.85 0.59 0.93 5 1.7 1.7 0.56 1.22 600-1000 DC to 8 kHz 600 30 15 1.65 1.85 0.9 1.25 5 1.7 1.7 0.76 1.7 VF [V] Product specification for RC-D Automotive Part number Package type Power [W] Switching frequency VCE [V] IC [A] 25°C IKD04N60RA DPAK 80-150 DC to 5 kHz 600 8 IKD06N60RA DPAK 150-250 DC to 5 kHz 600 IKD10N60RA DPAK 250-600 DC to 5 kHz IKD15N60RA DPAK 600-1000 DC to 8 kHz Application Note VCE(sat) [V] Ets [mJ] 100°C 25°C 175°C 25°C 175°C tSC [s] 25°C 175°C 25°C 175°C 4 1.65 1.85 0.24 0.4 5 1.7 1.7 0.22 0.52 12 6 1.65 1.85 0.33 0.56 5 1.7 1.7 0.37 0.8 600 20 10 1.65 1.85 0.59 0.93 5 1.7 1.7 0.56 1.22 600 30 15 1.65 1.85 0.9 1.25 5 1.7 1.7 0.76 1.7 3 Qrr [µC] Revision 1.1, 2015-08-12 RC-Drives IGBT for consumer and automotive applications Static and dynamic behavior 2 Static and dynamic behavior 2.1 Static behavior Due to the optimization for fast switching, the VCE(sat) of the RC-DF is increased compared to the RC-D. However for the target inverter applications in the range of ~100 W the RMS currents are usually limited below 1 A and here the VCE(sat) increase is limited to ~200 mV both at 25°C and 175°C. A negative temperature co-efficient of VCE(sat) is observed in this current range, contributing to a reduction of conduction losses in normal operating conditions, with junction temperature Tj typically ranging from 60 to 100°C. VCE(sat) comparison RC-D vs RC-DF 4,0 IKD04N60R-25°C 3,5 RC-D IKD04N60RF-25°C 3,0 IKD04N60R-175°C Ic (A) RC-DF IKD04N60RF-175°C 2,5 2,0 1,5 1,0 0,5 0,0 0,00 0,50 1,00 1,50 2,00 2,50 VCE(sat) (V) Figure 2 VCE(sat) comparison of the RC-DF vs. the RC-D technology 2.2 Dynamic behavior The RC-DF maintains the smooth switching behavior and RG controllability of the basic RC-D technology, by providing drastically reduced turn-off losses of the IGBT. The internal diode is also optimized to reduce the turn-on losses. The devices are characterized in a classical half-bridge test circuit with inductive load: the low side IGBT (DUT) is commutated over the high side diode. Therefore, the diode switching improvement is visible in the IGBT turn-on behavior (see below). Application Note 4 Revision 1.1, 2015-08-12 RC-Drives IGBT for consumer and automotive applications Static and dynamic behavior Figure 3 Dynamic switching behavior as a function of external RG The turn-on and turn-off waveforms are clearly showing significantly faster switching: both the tail current of the IGBT, the Qrr, Irrm and trr of the integrated diode are drastically reduced. Application Note 5 Revision 1.1, 2015-08-12 RC-Drives IGBT for consumer and automotive applications Static and dynamic behavior RC-D RC-DF RC-D RC-DF Figure 4 Dynamic switching waveforms: turn-off (top) and turn-on (bottom). Note that the current scales are different Application Note 6 Revision 1.1, 2015-08-12 RC-Drives IGBT for consumer and automotive applications Application 3 Application RC-D and RC-DF devices are suitable for home appliances as shown in Figure 6, especially as the power component of motor drive inverters. This is usually a two-level three-phase inverter driving a three-phase induction or permanent magnet synchronous motor. U V W VAC Figure 5 Three-phase two-level inverter Figure 6 Commercial air-conditioning split system, showing the motor drive card housed on the back of the BLDC fan motor RC-DA is a device that can be used for automotive applications such as, High Intensity Discharge (HID) lamps and piezo injection. HID lamps have two important issues, a greater starting voltage and the presence of acoustic resonance. The first issue is resolved by using a sort of starting aid, called igniters, which ignites the lamp. In order to avoid acoustic resonance and flickering, the designer must avoid the combination of power fluctuation and operating frequency. The frequency used in the application is higher than 100 Hz and Application Note 7 Revision 1.1, 2015-08-12 RC-Drives IGBT for consumer and automotive applications Application below 1 kHz. Power fluctuation can be avoided by using square wave alternate current techniques. This current control can be achieved by using a full bridge that converts the DC current coming from a DC/DC converter into an AC current for the lamp. DC Bus Igniter LAMP L Shunt Figure 7 HID lamp output stage Figure 8 Automotive application: piezo injection and High Intensity Discharge(HID) lights Application Note 8 Revision 1.1, 2015-08-12 RC-Drives IGBT for consumer and automotive applications In-circuit application test on 200 W motor drive board 4 In-circuit application test on 200 W motor drive board 4.1 Efficiency In order to verify the improvement of the RC-DF in a real application conditions, the new devices were tested on a demo board developed by Infineon and used as test bench to simulate a real air-conditioning outdoor fan. The board is designed for a 200 W output and consists of an input rectifier stage, inverter stage and output filter. The IGBTs are driven by a 600 V three-phase driver IC from Infineon (6ED003L06-F), and the modulation pattern is provided by an 8 bit Infineon microcontroller (XC-878) mounted on an external card. No heat-sink is required, just thermal vias through the PCB. The control method is sensor-less FOC using a single shunt-based feedback loop. The board is driving a 200 W induction motor coupled to an adjustable DC brake, which allows controlling the output power from the inverter. The efficiency is monitored by a Siemens power meter and case temperature is monitored by an IR camera. Figure 9 Test set-up for the application measurements Already at switching frequency of 10 kHz a clear efficiency improvement is observed. At the target fsw of 18 kHz the RC-DF provides 2.8% improvement at 50 W input power and 1.6% at 100 W: Application Note 9 Revision 1.1, 2015-08-12 RC-Drives IGBT for consumer and automotive applications In-circuit application test on 200 W motor drive board Figure 10 Inverter efficiency as a function of input power and switching frequency 4.2 Thermal behavior The increased efficiency for the RC-DF translates in lower case temperature, as verified by thermal images with infrared camera: Figure 11 Inverter efficiency as a function of input power and switching frequency The RC-DF shows outstanding thermal performance providing lower case temperature over the entire frequency range: at the target switching frequency of 18 kHz, the case temperature is lowered by 20°C. The temperature distribution is quite uniform, as demonstrated by detailed analysis of the thermal images: Application Note 10 Revision 1.1, 2015-08-12 RC-Drives IGBT for consumer and automotive applications In-circuit application test on 200 W motor drive board Figure 12 Thermal images at Pin= 50 W, fsw= 20 kHz This translates in increased reliability and longer life expectancy for the device, especially in the harsh thermal environments to be encountered in a real application. In the case of outdoor fan for domestic split aircon systems, for example, the board is mounted directly on the back of the motor in a close environment without airflow. In this case high ambient temperature up to ~60°C can be expected: 4.3 Cooling considerations When the power range of the inverter exceeds ~200 W, along with careful PCB design (avoid placing devices too close to each other or to the edge of the PCB), some type of cooling is required for the SMD devices. In case of DPAK packages, top side cooling is not effective due to the relatively high thickness of the mold compound on top of the chip and the poor heat exchange. Infineon recommends cooling from the bottom of the chip by thermal vias through the PCB. Several methods for vias formation are adopted in the industry: Application Note 11 Revision 1.1, 2015-08-12 RC-Drives IGBT for consumer and automotive applications In-circuit application test on 200 W motor drive board Table 3 Commonly adopted vias concepts Copper inlays Production limited and quite expensive concept. Adopted in high efficiency converter for SMPS applications Copper inlays (Ruwel GmbH) Thermal vias Placed around the leadframe or partially under the drain contact. Typical vias diameter is 400 µm. Filled with synthetic resin to avoid solder voids at RC-Drives leadframe due to a solder reflow through the vias. Most common solution in consumer drives. Classical thermal vias with resin Small drill holes Holes diameter below 0.2 mm for the thermal vias are filled during Cu galvanic deposition to avoid solder reflow.They can be placed under the drain for the most effective heat exchange. Thin-via-concept (small drill holes) Infineon recommends, when allowed by the process capability of PCB supplier, the small drill holes concept for optimum power dissipation. The concept was tested successfully on several reference designs and allowed to reach up to 1.2 kW output power utilizing RC-D devices in DPAK package. Below an example of small drill holes vias design and related heatsink mounting with isolation foil: Application Note 12 Revision 1.1, 2015-08-12 RC-Drives IGBT for consumer and automotive applications In-circuit application test on 200 W motor drive board Figure 13 Example of thermal vias and heatsink mounting for RC-D and RC-DF test boards Application Note 13 Revision 1.1, 2015-08-12 RC-Drives IGBT for consumer and automotive applications In-circuit application test on 200 W motor drive board Revision history Major changes since the last revision Page or reference Application Note Description of change 14 Revision 1.1, 2015-08-12 Trademarks of Infineon Technologies AG AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolGaN™, CoolMOS™, CoolSET™, CoolSiC™, CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, DrBLADE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, IsoPACK™, iWafer™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OPTIGA™, OptiMOS™, ORIGA™, POWERCODE™, PRIMARION™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, ReverSave™, SatRIC™, SIEGET™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, SPOC™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. ANSI™ of American National Standards Institute. AUTOSAR™ of AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CATiq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. HYPERTERMINAL™ of Hilgraeve Incorporated. MCS™ of Intel Corp. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ of Openwave Systems Inc. RED HAT™ of Red Hat, Inc. RFMD™ of RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2014-07-17 www.infineon.com Edition 2015-08-12 Published by Infineon Technologies AG 81726 Munich, Germany © 2015 Infineon Technologies AG. All Rights Reserved. Do you have a question about any aspect of this document? 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