506AS

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WDFN6 1.2x1.0, 0.4P
CASE 506AS
ISSUE D
DATE 27 AUG 2013
SCALE 4:1
D
L
A
B
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L1
ÍÍÍ
ÍÍÍ
ÍÍÍ
DETAIL A
E
PIN ONE
REFERENCE
0.10 C
2X
2X
ALTERNATE TERMINAL
CONSTRUCTIONS
ÉÉ
ÉÉ
EXPOSED Cu
0.10 C
ÉÉ
ÉÉ
ÇÇ
A1
ALTERNATE
CONSTRUCTIONS
A3
0.08 C
XM
A1
C
SEATING
PLANE
X
M
4X
DETAIL A
e
5X
= Specific Device Code
= Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
L
3
1
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.30
0.40
0.00
0.15
0.40
0.50
GENERIC
MARKING DIAGRAM*
A
7X
A3
DETAIL B
DETAIL B
0.10 C
MOLD CMPD
DIM
A
A1
A3
b
D
E
e
L
L1
L2
L2
MOUNTING FOOTPRINT*
6X
6
4
BOTTOM VIEW
b
0.22
6X
0.10 C A
0.05 C
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
6X
0.42
B
NOTE 3
DRAIN
DRAIN
GATE
SOURCE
DRAIN
DRAIN
0.40
PITCH
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
98AON21223D
ON SEMICONDUCTOR STANDARD
http://onsemi.com
WDFN6, 1.2 X 1.0, 0.4 P
1
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON21223D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY E. SOTO.
20 OCT 2005
A
MODIFIED SOLDERING FOOTPRINT. REQ. BY E. SOTO.
19 JAN 2006
B
MODIFIED BOTTOM VIEW DRAWING. REQ. BY E. SOTO.
05 MAR 2007
C
ADDED TERMINAL OPTIONS DETAILS A AND B. REQ. BY A. CARMONA.
30 JUN 2008
D
REMOVED PB−FREE MICRODOT FROM MARKING DIAGRAM. REQ. BY R.
AVILA.
27 AUG 2013
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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© Semiconductor Components Industries, LLC, 2013
Agusut, 2013 − Rev. D
Case Outline Number:
506AS
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