PANASONIC 2SB0779

Transistors
2SB0779 (2SB779)
Silicon PNP epitaxial planar type
Unit: mm
For low-frequency output amplification
0.40+0.10
–0.05
0.16+0.10
–0.06
0.4±0.2
5˚
1.50+0.25
–0.05
2
1
(0.95) (0.95)
1.9±0.1
(0.65)
• Low collector-emitter saturation voltage VCE(sat)
• Satisfactory linearity of forward current transfer ratio hFE at the
low collector voltage
• Mini type package, allowing downsizing of the equipment and
automatic insertion through the tape packing and the magazine
packing.
2.8+0.2
–0.3
3
■ Features
2.90+0.20
–0.05
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
−25
V
Collector-emitter voltage (Base open)
VCEO
−20
V
Emitter-base voltage (Collector open)
VEBO
−7
V
Collector current
IC
−500
mA
Peak collector current
ICP
−1
A
Collector power dissipation
PC
200
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
0 to 0.1
Parameter
1.1+0.2
–0.1
■ Absolute Maximum Ratings Ta = 25°C
1.1+0.3
–0.1
10˚
1: Base
2: Emitter
3: Collector
EIAJ: SC-59
Mini3-G1 Package
Marking Symbol: 1A
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Collector-base voltage (Emitter open)
VCBO
IC = −10 µA, IE = 0
−25
V
Collector-emitter voltage (Base open)
VCEO
IC = −1 mA, IB = 0
−20
V
Emitter-base voltage (Collector open)
VEBO
IE = −10 µA, IC = 0
−7
Collector-base cutoff current (Emitter open)
ICBO
VCB = −25 V, IE = 0
ICEO
VCE = −20 V, IB = 0
Collector-emitter cutoff current (Base open)
VCE = −2 V, IC = −500 mA
90
VCE = −2 V, IC = −1 A
25
Forward current transfer ratio *1
hFE1 *2
Collector-emitter saturation voltage *1
VCE(sat)
IC = −500 mA, IB = −50 mA
VBE(sat)
IC = −500 mA, IB = −50 mA
hFE2
Base-emitter saturation voltage
*1
Transition frequency
fT
Collector output capacitance
(Common-emitter reverse transfer)
Cob
V
−100
nA
−1
µA
220


− 0.2
− 0.4
−1.2
V
V
VCB = −10 V, IE = 50 mA, f = 200 MHz
150
MHz
VCB = −10 V, IE = 0, f = 1 MHz
15
pF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *1: Pulse measurement
*2: Rank classification
Rank
Q
R
hFE1
90 to 155
130 to 220
Note) The part number in the parenthesis shows conventional part number.
Publication date: March 2003
SJC00054BED
1
2SB0779
VCE(sat)  IC
−100
Collector-emitter saturation voltage VCE(sat) (V)
160
120
80
IC / IB = 10
−10
−1
Ta = 75°C
25°C
− 0.1
40
0
0
40
80
120
160
− 0.01
− 0.01
Ambient temperature Ta (°C)
− 0.1
Transition frequency fT (MHz)
Forward current transfer ratio hFE
400
300 Ta = 75°C
25°C
−25°C
100
− 0.1
−1
Collector current IC (A)
2
−1
−10
−10
75°C
− 0.01
− 0.01
VCB = −10 V
Ta = 25°C
240
160
80
1
− 0.1
−1
−10
Collector current IC (A)
320
0
0.1
Ta = −25°C
Cob  VCB
400
VCE = −2 V
0
− 0.01
25°C
−1
fT  I E
500
200
−10
Collector current IC (A)
hFE  IC
600
IC / IB = 10
− 0.1
−25°C
10
Emitter current IE (mA)
SJC00054BED
100
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
Collector power dissipation PC (mW)
200
VBE(sat)  IC
−100
Base-emitter saturation voltage VBE(sat) (V)
PC  Ta
240
60
IE = 0
f = 1 MHz
Ta = 25°C
50
40
30
20
10
0
−1
−10
−100
Collector-base voltage VCB (V)
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and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
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product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
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2002 JUL