This document is a declaration of the substances within the manufacturer listed item. Note: if the item is an assembly with lower level parts, the declaration encompasses all lower level materials for which the manufacturer has © Copyright 2005. IPC, Bannockburn, Illinois. All rights reserved under engineering responsibility. both international and Pan-American copyright conventions. Adobe Reader version 7.0.5 is required to complete this declaration. Material Composition Declaration 1752-2 IPC Web Site for Information on IPC-1752 Standard http://www.ipc.org/IPC-175x 1.1 Form Type * Distribute Declaration Class * Class 6 - RoHS Yes/No, Homogeneous Materials and Mfg Informat Supplier Information Company Name * Company Unique ID Unique ID Authority Response Date * STMicroelectronics Contact Name * Title - Contact Phone - Contact * Email - Contact * Authorized Representative * Title - Representative Phone - Representative * Email - Representative * Carole DEL PUPPO Requester Item Number Response Document ID Duplicate Supplier Comments or URL for Additional Information HED Packaging Engineering +33 4-76-58-66-78 [email protected] Mfr Item Number Mfr Item Name Effective Date Version Manufacturing Site STA339BWS-5HUF A2EH*UA94AA5 2009-12-07 A MU1A Alternate Recommendation PowerSSO36 Contact -> Authorized Representative Weight * UOM Unit Type 482 mg Each Ecopack 2 compliant, BSA CD00240623 3.0 Alternate Item Comments Manufacturing Process Information Terminal Plating / Grid Array Material Matte Tin (Sn) - annealed Terminal Base Alloy CU Alloy J-STD-020 MSL Rating 3 Peak Process Body Temperature Max Time at Peak Temperature Number of Reflow Cycles 260 C 30 seconds 3 Comments Disclaimer: While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and * Required Field CAS Registry Number(R) is a Registered Trademark of the American Chemical Society Form enabled by Adobe Save the fields in this form to a file Export Data Import fields from a file into this form Import Data Clear all of the fields on this form Reset Form Lock the fields on this form to prevent changes RoHS Material Composition Declaration Declaration Type * Lock Supplier Fields Simplified RoHS Directive RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), 2002/95/EC Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material for Cadmium Supplier certifies that it gathered the information it provides in this form concerning RoHS restrictive substances using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part, and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part,the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form. Supplier Acceptance * Accepted RoHS Declaration * 4 - Item(s) does not contain RoHS restricted substances per the definition above except for selected exemptions Exemptions: If the declared item does not contain RoHS restricted substances per the definition above except for defined RoHS exemptions, then select the corresponding response in the RoHS Declaration above and choose all applicable exemptions. Exemption List Version + - EL-2006/690/EC 7a. Lead in high melting temperature type solders (i.e. lead based solder alloys containing 85% by weight or more lead). Declaration Signature Instructions: Complete all of the required fields on all pages of this form. Select the "Accepted" on the Supplier Acceptance drop-down. This will display the signature area. Digitally sign the declaration (if required by the Requester) and click on Submit Form to have the form returned to the Requester. Supplier Digital Signature Carole Del Puppo * Required Field Digitally signed by Carole Del Puppo DN: cn=Carole Del Puppo, o=HED operations, ou=HED Packaging engineering, [email protected], c=FR Date: 2009.12.07 15:55:41 +01'00' CAS Registry Number(R) is a Registered Trademark of the American Chemical Society Form enabled by Adobe Homogeneous Material Composition Declaration for Electronic Products SubItem Instructions: The presence of any JIG Level A or B substances must be declared. [1] indicate the subpart in which the substance is located, [2] provide a description of the homogeneous material [3], enter the weight of the homogeneous material. Substance Instructions: [A] select the Level (JIG A, JIG B, Requester or Supplier) [B] select the substance category (JIG or Requester) or enter a value (Supplier). [C] select the substance (JIG) or enter the substance and CAS (Other). [D] select a RoHS exemption, if applicable [E] enter the weight of the substance or the PPM concentration [F] Optionally enter the positive (+) and negative (-) tolerance in percent (Note: percent tolerance values are expected to cover a 3 sigma range of distribution unless otherwise noted). Line Functions: +I Inserts a New Item /SubItem +M Inserts a new Material Item/SubItem Name +I -I device Homogeneous Material Weight +M -M Integrated circuit9.5 +M -M Leadframe Unit of Measure mg 138.63 mg Level +C Inserts a new Substance Category Substance Category +S Inserts a new Substance Substance CAS - Deletes the element line Exempt Weight Unit of Tolerance PPM Measure + +C -C Supplier Silicon die +S -S Silicon (Si) 7440-21-3 9.482 mg 998,10 +C -C Supplier die metallization +S -S Aluminium (Al) 7429-90-5 0.002 mg 211 +C -C Supplier die metallization +S -S Copper (Cu) 7440-50-8 0.006 mg 632 +C -C Supplier die metallization +S -S Titanium (Ti) 7440-32-6 0.003 mg 316 +C -C Supplier die metallization +S -S Chromium (Cr) 7440-47-3 0.001 mg 105 +C -C Supplier die metallization +S -S Gold (Au) 7440-57-5 0.001 mg 105 +C -C Supplier die metallization +S -S Nickel (Ni) 7440-02-0 0.005 mg 526 +C -C supplier alloy +S -S Copper (Cu) 7440-50-8 135.096 mg 974,50 +C -C supplier alloy +S -S Iron (Fe) 7439-89-6 3.252 mg 23,458 +C -C supplier alloy +S -S Zinc (Zn) 7440-66-6 0.166 mg 1,197 +C -C supplier alloy +S -S Iron Phosphide (FeP) 26508-33-8 0.116 mg 837 1.912 mg 1,000,0 mg 975,01 +M -M Leadframe coatin1.912 mg +C -C supplier coating +S -S Silver (Ag) 7440-22-4 +M -M Die Attach mg +C -C A glue or soft solder +S -S Lead (Pb) 7439-92-1 +C -C supplier glue or soft solder +S -S Silver (Ag) 7440-22-4 0.062 mg 15,038 +C -C supplier glue or soft solder +S -S Tin (Sn) 7440-31-5 0.041 mg 9,944 +S -S Copper (Cu) 7440-50-8 1.438 mg 1,000,0 12.726 mg 40,000 4.123 7a. Lead 4.02 +M -M Bonding wire 1.438 mg +C -C Supplier Bonding wire +M -M Encapsulation 318.152 mg +C -C supplier Moulding Compound +S -S Phenol Resin +C -C supplier Moulding Compound +S -S Biphenyl epoxy resin 85954-11-6 9.545 mg 30,001 +C -C supplier Moulding Compound +S -S epoxy resin na 9.545 mg 30,001 +C -C supplier Moulding Compound +S -S carbon black 1333-86-4 0.636 mg 1,999 +C -C supplier Moulding Compound +S -S Silica, vitreous 60676-86-0 285.7 mg 897,99 +C -C supplier connection coating 7440-31-5 8.228 mg 1,000,0 +M -M Finishing * Required Field 8.228 mg +S -S Tin (Sn) CAS Registry Number(R) is a Registered Trademark of the American Chemical Society Form enabled by Adobe