567MR

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP8, 1.888x0.888
CASE 567MR
ISSUE A
SCALE 4:1
DATE 27 OCT 2015
E
PIN A1
REFERENCE
A
ÈÈ
ÈÈ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
D
DIM
A
A1
b
D
E
e
TOP VIEW
GENERIC
MARKING DIAGRAM*
A
0.05 C
A1
SIDE VIEW
NOTE 3
8X
b
A
= Assembly Location
Y
= Year
WW = Work Week
e
e/2
D
XXXX
AYWW
SEATING
PLANE
e/2
0.15 C A B
0.03 C
C
MILLIMETERS
MIN
MAX
−−−
0.50
0.15
0.19
0.21
0.25
1.858
1.918
0.858
0.918
0.50 BSC
e
C
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
B
RECOMMENDED
SOLDERING FOOTPRINT*
A
1
2
A1
BOTTOM VIEW
0.50
PITCH
PACKAGE
OUTLINE
8X
0.50
PITCH
0.20
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON06071G
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP8, 1.888X0.888
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON06071G
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY A. SARWARI.
15 OCT 2015
A
REMOVED PB−FREE DOT FROM MARKING DIAGRAM. REQ. BY A. SARWARI.
27 OCT 2015
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
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© Semiconductor Components Industries, LLC, 2015
October, 2015 − Rev. A
Case Outline Number:
567MR
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