403AA

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SMA−FL
CASE 403AA−01
ISSUE O
DATE 02 MAR 2011
SCALE 2:1
E
E1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
D
DIM
A
b
c
D
E
E1
L
TOP VIEW
A
c
2X
C
SIDE VIEW
MILLIMETERS
MIN
MAX
0.90
1.10
1.25
1.65
0.15
0.30
2.40
2.80
4.80
5.40
4.00
4.60
0.70
1.10
SEATING
PLANE
b
2X
L
BOTTOM VIEW
RECOMMENDED
SOLDER FOOTPRINT*
5.56
1.76
1.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON55210E
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
SMA−FL
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON55210E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY D TRUHITTE
DATE
02 MAR 2011
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2011
March, 2011 − Rev. 01O
Case Outline Number:
403AA