MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN12 3.0x1.35, 0.5P CASE 506AD−01 ISSUE J 12 1 SCALE 4:1 DATE 09 JUL 2008 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. EXPOSED PADS CONNECTED TO DIE FLAG. USED AS TEST CONTACTS. 0.15 C A D B (A3) E 2X 0.15 C EXPOSED Cu TOP VIEW PIN ONE REFERENCE (A3) 0.10 C 12 X A 0.08 C SIDE VIEW A1 L 1 L1 e EXPOSED PAD 6 E2 2X 0.2 X 0.25 MM NOTE 5 12X K 12 7 12X DETAIL A OPTIONAL CONSTRUCTION GENERIC MARKING DIAGRAM* 1 XX XX MG G b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW XXXX M G SOLDERING FOOTPRINT* 0.479 0.019 = Specific Device Code = Month Code = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 0.265 0.010 2.352 0.093 0.500 0.020 Pitch 0.199 0.008 L C D2 DETAIL A 12X EDGE OF PACKAGE SEATING PLANE MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.18 0.30 3.00 BSC 2.10 2.30 1.35 BSC 0.20 0.40 0.50 BSC 0.20 −−− 0.20 0.40 0.00 0.15 DIM A A1 A3 b D D2 E E2 e K L L1 0.351 0.014 SCALE 16:1 STYLE 1: PIN 1. ANODE 1 2. ANODE 2 3. ANODE 3 4. ANODE 4 5. ANODE 5 6. ANODE 6 7. ANODE 7 8. ANODE 8 9. ANODE 9 10. ANODE 10 11. ANODE 11 12. ANODE 12 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: 98AON19409D Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped “CONTROLLED COPY” in red. NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com DFN12 3.0x1.35, 0.5 MM PITCH1 DESCRIPTION: October, 2002 − Rev. 0 PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON19409D PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY A. TAM. 30 AUG 2004 A CHANGED DIM D2, UPDATED SIDE VIEW OF CONTACT. ADDED STYLE 1. REQ. BY A. TAM. 01 NOV 2004 B CHANGED MARKING DIAGRAM. REQ. BY A. TAM. 30 DEC 2004 C CHANGED MARKING DIAGRAM AND LOOK OF LEADS. CHANGED E2 DIM. REQ. BY A. TAM. 11 FEB 2005 D CHANGED MARKING DIAGRAM AND DIM L AND DIM K. REQ. BY A. TAM. 11 MAR 2005 E CHANGED DIMS E2 AND L. REQ. BY A. TAM. 18 APR 2005 F ADDED SOLDERING FOOTPRINT. REQ. BY A. TAM. 06 JUN 2005 G CORRECTED DESCRIPTION TO DFN12 3 X 1.35, 0.5P. REQ. BY D. TRUHITTE. 18 JUL 2007 H REVISED SOLDERING FOOTPRINT. REQ. BY A. TAM. 05 DEC 2007 J REVISED SOLDERING FOOTPRINT AGAIN. REQ. BY A. TAM. 09 JUL 2008 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2008 July, 2008 − Rev. 01J Case Outline Number: 506AD