506AD

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN12 3.0x1.35, 0.5P
CASE 506AD−01
ISSUE J
12
1
SCALE 4:1
DATE 09 JUL 2008
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. EXPOSED PADS CONNECTED TO DIE FLAG.
USED AS TEST CONTACTS.
0.15 C
A
D
B
(A3)
E
2X
0.15 C
EXPOSED Cu
TOP VIEW
PIN ONE
REFERENCE
(A3)
0.10 C
12 X
A
0.08 C
SIDE VIEW
A1
L
1
L1
e
EXPOSED PAD
6
E2
2X
0.2 X 0.25 MM
NOTE 5
12X
K
12
7
12X
DETAIL A
OPTIONAL
CONSTRUCTION
GENERIC
MARKING DIAGRAM*
1
XX
XX
MG
G
b
0.10 C A B
0.05 C NOTE 3
BOTTOM VIEW
XXXX
M
G
SOLDERING FOOTPRINT*
0.479
0.019
= Specific Device Code
= Month Code
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.265
0.010
2.352
0.093
0.500
0.020
Pitch
0.199
0.008
L
C
D2
DETAIL A
12X
EDGE OF PACKAGE
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
3.00 BSC
2.10
2.30
1.35 BSC
0.20
0.40
0.50 BSC
0.20
−−−
0.20
0.40
0.00
0.15
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
0.351
0.014
SCALE 16:1
STYLE 1:
PIN 1. ANODE 1
2. ANODE 2
3. ANODE 3
4. ANODE 4
5. ANODE 5
6. ANODE 6
7. ANODE 7
8. ANODE 8
9. ANODE 9
10. ANODE 10
11. ANODE 11
12. ANODE 12
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON19409D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DFN12 3.0x1.35, 0.5 MM PITCH1
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON19409D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY A. TAM.
30 AUG 2004
A
CHANGED DIM D2, UPDATED SIDE VIEW OF CONTACT. ADDED STYLE 1. REQ.
BY A. TAM.
01 NOV 2004
B
CHANGED MARKING DIAGRAM. REQ. BY A. TAM.
30 DEC 2004
C
CHANGED MARKING DIAGRAM AND LOOK OF LEADS. CHANGED E2 DIM. REQ.
BY A. TAM.
11 FEB 2005
D
CHANGED MARKING DIAGRAM AND DIM L AND DIM K. REQ. BY A. TAM.
11 MAR 2005
E
CHANGED DIMS E2 AND L. REQ. BY A. TAM.
18 APR 2005
F
ADDED SOLDERING FOOTPRINT. REQ. BY A. TAM.
06 JUN 2005
G
CORRECTED DESCRIPTION TO DFN12 3 X 1.35, 0.5P. REQ. BY D. TRUHITTE.
18 JUL 2007
H
REVISED SOLDERING FOOTPRINT. REQ. BY A. TAM.
05 DEC 2007
J
REVISED SOLDERING FOOTPRINT AGAIN. REQ. BY A. TAM.
09 JUL 2008
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2008
July, 2008 − Rev. 01J
Case Outline Number:
506AD
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