477AC

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOD−323FL
CASE 477AC
ISSUE B
SCALE 2:1
DATE 12 JAN 2016
A1
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS INCLUDES LEAD FINISH.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
E
TOP VIEW
DIM
A
A1
b
c
D
E
HE
L
END VIEW
c
A
MILLIMETERS
MIN
MAX
0.90
1.08
−−−
0.10
0.50
0.70
0.10
0.25
2.00
2.20
1.30
1.60
2.40
2.80
0.35
0.65
GENERIC
MARKING DIAGRAM*
SIDE VIEW
HE
XX M
b
XX
M
= Specific Device Code
Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
L
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
3.00
0.80
0.80
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON03742G
© Semiconductor Components
Industries,ON
LLC,SEMICONDUCTOR
2002
STATUS:
STANDARD
1
May, 2002 − Rev. 01O
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
SOD−323FL
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
Outline
Number:
versions are uncontrolled exceptCase
when
stamped
502
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON03742G
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
04 AUG 2015
A
REVERSED VALUES FOR DIMENSIONS D & E IN TABLE. REQ. BY D. TRUHITTE.
01 SEP 2015
B
UPDATED DIMENSION L FROM 0.40−0.60 TO 0.35−0.65. REQ. BY D. TRUHITTE.
12 JAN 2016
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2016
January, 2016 − Rev. B
Case Outline Number:
477AC
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