NXP power MOSFETs in SOT883 The World’s smallest MOSFET For portable applications, board real estate is a critical factor and drives the development of products with ever smaller footprints. However as packages get smaller, the proportion of footprint area occupied by leads becomes more significant. NXP’s latest power MOSFETs in the SOT883 package help you reclaim more board space by eliminating leads altogether and at the same time enhancing thermal performance. Key benefits } Ultra small where space is a premium } Better performance than existing small footprints - higher power dissipation and lower R DSon, with higher current density - reduced heat dissipation can eliminate need for cooling fan or bulky heat sink } Occupies only 1.17 mm2, only 30% of SC-75 or SC-89 Key features } 2.5W power dissipation } Highly efficient packing } Environmentally friendly } Compatible with JEITA standard, SC-101 } Size: 1.0 x 0.6 x 0.5 mm (lwh) Key applications } Load switch - mobile phones - notebook PCs - PDAs - MP3 players - digital still cameras } External pass device - buck converters - boost converters Portable products are fuelling the race towards more sophisticated functionality in smaller form-factors, making improvements in power density and power dissipation key design elements. For today’s space-constrained and power hungry applications, our MOSFETs in SOT883 offer the perfect solution, delivering superior thermal performance combined with the ultimate in miniaturization. Product table Product Maximum values Typical values Vds Vgs V V 25º Id (A) 100º W Qg Q gd C iss 4.5V 2.5V 1.8V nC nC pF PMZ250UN 20 8 2.28 1.44 PMZ270XN 20 12 2.15 1.36 1.25 250 320 420 0.89 0.18 45 1.25 270 440 0.72 0.18 PMZ350XN 30 12 1.87 34 1.18 1.25 350 520 0.65 0.18 37 PMZ390UN 30 8 PMZ760SN 60 20 1.78 1.13 1.25 390 460 0.89 0.20 43 1.22 0.77 1.25 1.05 0.22 23 L Pd RDSon (m0) 10V 760 550 1100 L1 2 b 3 e b1 1 e1 A A1 E D 0 0.5 1 mm scale DIMENSIONS (mm are the original dimensions) UNIT A (1) mm 0.50 0.46 A1 max. b b1 D E 0.03 0.20 0.12 0.55 0.47 0.62 0.55 1.02 0.95 e 0.35 e1 L L1 0.65 0.30 0.22 0.30 0.22 Note 1. Including plating thickness www.nxp.com ©2008 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The Date of release: February 2008 information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable Document order number: 9397 750 16258 and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication Printed in the Netherlands thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.