Data Sheet LEADFRAME SSOP/QSOP Thermal Performance Forced Convection, Single-layer PCB Body Size (mm) Pkg Shrink Small Outline, Quarter-Size Small-Outline Packages (SSOP/QSOP) SSOP and QSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring optimum performance in IC packaging with compressed body size and tightened lead pitch. These industry standard IC packages yield a significant reduction in size while running in high volume and provide value added low cost solutions for a wide range of applications. A green BOM is standard, allowing devices to meet applicable Pb-free and RoHS standards. Features • • • • • Cu wire interconnect for low cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options Green materials are standard – Pb-free and RoHS compliant Pad Size (mm) ΘJA (°C/W) by Velocity (LFPM) 20 ld 3.9 x 8.7 2.4 x 3.6 0 80.8 28 ld 5.3 x 10.2 3.84 x 8.10 49.0 200 73.2 500 69.2 36.0 30.0 JEDEC Standard Test Boards Electrical Performance Pkg Body Size (mm) Pad Size (mm) 20 ld 5.3 x 7.2 3.9 x 5.4 28 ld 3.9 x 9.9 2.4 x 4.8 28 ld 5.3 x 10.2 3.9 x 5.1 Self Bulk Self Inductance Capacitance Resistance (nH) (pF) (mF) Longest 2.260 0.395 19.0 Shortest 0.958 0.209 9.10 Longest 1.590 0.376 14.1 Shortest 0.757 0.198 7.53 Longest 2.510 0.463 21.5 Shortest 0.928 0.206 9.57 Lead Simulated Results @ 100 MHz Reliability Qualification • Stealth dicing (narrow saw streets) • Larger/higher density leadframe strips • Leadframe roughening for improved MSL capability Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD-020 moisture preconditioning. • Moisture Sensitivity JEDEC Level 1, 85°C/85% RH, 168 hrs Characterization JEDEC Level 3, 30°C/60% RH, 192 hrs • uHAST130°C/85% RH, No Bias, 96 hrs • Temp Cycle -65°C/+150°C, 500 cycles • High Temp Storage 150°C, 1000 hours Services and Support Process Highlights New Developments Amkor has a broad base of resources available to help customers bring quality new products to market quickly and at the lowest possible cost. • Full package characterization • Thermal, mechanical stress and electrical performance modeling • Turnkey assembly, test and drop ship • World class reliability testing and failure analysis Visit Amkor Technology online for locations and to view the most current product information. • • • • • Pcc wire bonding standard, Ag wire available Wafer backgrinding services available Multiple die and die stacking capability NiPdAu (PPF) or Matte Sn lead finish options Laser mark on package body DS360N Rev Date: 7/15 Questions? Contact us: [email protected] Data Sheet LEADFRAME SSOP/QSOP Cross-section SSOP/QSOP Test Services • • • • • Program generation/conversion Wafer probe Burn-in capabilities -55°C to +165°C test available Strip test available Shipping • • • • Clear anti-static tube, 20 inch Tape and reel Dry pack Drop ship Configuration Options SSOP/QSOP Nominal Package Dimensions (inches – unless otherwise specified) Package Type SSOP QSOP Lead Count Body Width Body Length Body Thickness Standoff Overall Height Lead Pitch Tip-to-Tip JEDEC Factory Package Outline Drawing # 14/16 5.3 mm (209 mil) 6.2 mm 1.73 mm 0.13 mm 1.86 mm 0.65 mm 7.80 mm MO-150 P1 32289 20 5.3 mm (209 mil) 7.2 mm 1.73 mm 0.13 mm 1.86 mm 0.65 mm 7.80 mm MO-150 P1 32289 24 5.3 mm (209 mil) 8.2 mm 1.73 mm 0.13 mm 1.86 mm 0.65 mm 7.80 mm MO-150 P1 32289 28 5.3 mm (209 mil) 10.2 mm 1.73 mm 0.13 mm 1.86 mm 0.65 mm 7.80 mm MO-150 P1 32289 16 0.150 0.194 0.058 0.006 0.064 0.0250 0.236 MO-137 P1 32864 20 0.150 0.342 0.058 0.006 0.064 0.0250 0.236 MO-137 P1 32864 24 0.150 0.342 0.058 0.006 0.064 0.0250 0.236 MO-137 P1 32864 28 0.150 0.391 0.058 0.006 0.064 0.0250 0.236 MO-137 P1 32864 Visit Amkor Technology online for locations and to view the most current product information. With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2015, Amkor Technology Incorporated. All Rights Reserved. DS360N Rev Date: 7/15 Questions? Contact us: [email protected]