Data Sheet LEADFRAME TSSOP/MSOP Thermal Performance Forced Convection, Single-layer PCB Thin Shrink Small Outline Package, Micro Small Outline Package (TSSOP/MSOP) TSSOP and MSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring less than 1 mm mounted height. These industry standard packages run in very high volume and provide a value added, low cost solution for a wide range of applications. A green BOM is standard, allowing devices to meet applicable Pb-free and RoHS standards. Features • • • • • • Cu wire interconnect for lowest cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options Available in ExposedPad configuration (Ref: DS571) Green materials are standard – Pb-free and RoHS compliant New Developments • Stealth dicing (narrow saw streets) • Larger/higher density leadframe strips • Leadframe roughening for improved MSL capability Services and Support Amkor has a broad base of resources available to help customers bring quality new products to market quickly and at the lowest possible cost. • Full package characterization • Thermal, mechanical stress and electrical performance modeling • Turnkey assembly, test and drop ship • World class reliability testing and failure analysis Visit Amkor Technology online for locations and to view the most current product information. Pkg Body Size (mm) 16 ld 20 ld 48 ld 4.4 x 5.0 4.4 x 6.5 6.1 x 12.5 ΘJA (°C/W) by Velocity (LFPM) 0 200 500 137.1 118.2 106.8 114.5 98.0 88.0 82.6 70.3 63.7 Forced Convection, Multi-layer PCB Pkg Body Size (mm) 16 ld 20 ld 48 ld 4.4 x 5.0 4.4 x 6.5 6.1 x 12.5 ΘJA (°C/W) by Velocity (LFPM) 0 200 500 89.0 81.8 78.1 73.2 66.6 63.5 58.3 52.3 49.9 JEDEC Standard Test Boards Electrical Performance Pkg Body Size (mm) Lead Inductance (nH) Capacitance (pF) Resistance (mΩ) 8 ld 4.4 x 3.0 Longest Shortest 1.470 0.725 0.224 0.177 13.7 7.5 28 ld 4.4 x 9.7 Longest Shortest 2.100 0.713 0.368 0.180 16.1 6.8 56 ld 6.1 x 14.0 Longest Shortest 4.040 1.380 0.631 0.213 36.5 16.2 Simulated Results @ 100 MHz Reliability Qualification Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD-020 moisture preconditioning. • Moisture Sensitivity JEDEC Level 1, 85°C/85% RH, 168 hrs Characterization JEDEC Level 3, 30°C/60% RH, 192 hrs • uHAST 130°C/85% RH, No Bias, 96 hrs • Temp Cycle -65°C/+150°C, 500 cycles • High Temp Storage 150°C, 1000 hours Process Highlights • • • • • Pcc wire bonding standard, Ag wire available Wafer backgrinding services available Multiple die and die stacking capability NiPdAu (PPF) or Matte Sn lead finish options Laser mark on package body DS350P Rev Date: 4/16 Questions? Contact us: [email protected] Data Sheet LEADFRAME TSSOP/MSOP Cross-section TSSOP/MSOP Test Services • • • • • Program generation/conversion Wafer probe Burn-in capabilities -55°C to +165°C test available Strip test available Shipping • • • • Clear anti-static tube, 20 inch Tape and reel Dry pack Drop ship Configuration Options TSSOP/MSOP Nominal Package Dimensions (mm) Package Type TSSOP MSOP Lead Count Body Width Body Length Body Thickness Standoff Overall Height Lead Pitch Tip-to-Tip JEDEC 8 4.4 3.0 0.90 0.10 1.00 0.65 6.4 MO-153 14 4.4 5.0 0.90 0.10 1.00 0.65 6.4 MO-153 16 4.4 5.0 0.90 0.10 1.00 0.65 6.4 MO-153 20 4.4 6.5 0.90 0.10 1.00 0.65 6.4 MO-153 24 4.4 7.8 0.90 0.10 1.00 0.65 6.4 MO-153 28 4.4 9.7 0.90 0.10 1.00 0.65 6.4 MO-153 38 4.4 9.7 0.90 0.10 1.00 0.50 6.4 MO-153 48 6.1 12.5 0.90 0.10 1.00 0.50 8.1 MO-153 56 6.1 14.0 0.90 0.10 1.00 0.50 8.1 MO-153 8 3.0 3.0 0.85 0.10 0.95 0.65 5.0 MO-187 10 3.0 3.0 0.85 0.10 0.95 0.50 5.0 MO-187 Visit Amkor Technology online for locations and to view the most current product information. With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2016, Amkor Technology Incorporated. All Rights Reserved. DS350P Rev Date: 4/16 Questions? Contact us: [email protected]