ePad TSSOP/MSOP/SOIC/SSOP Data Sheet

Data Sheet
LEADFRAME
ExposedPad
TSSOP/MSOP/SOIC/SSOP
Thermal Performance
Forced Convection, Single-layer PCB
ExposedPad Thin Shrink Small
Outline Package, Micro Small Outline
Package, Small Outline IC Package,
Shrink Small Outline Package
(ePad TSSOP/MSOP/SOIC/SSOP)
ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are
leadframe based, plastic encapsulated packages that are
well suited for applications requiring optimum thermal
performance, compressed body size and tightened lead
pitch. These industry standard IC packages offer a
substantial increase in heat dissipation, yield a significant
reduction in size and provide value-added, low-cost
solutions for a wide range of applications. A green BOM is
standard, allowing devices to meet applicable Pb-free and
RoHS standards.
Features
•
•
•
•
•
Cu wire interconnect for low cost
Standard JEDEC package outlines
Multi-die production capability
Turnkey test services, including strip test options
ExposedPad configuration for increased thermal
efficiency
• Up to 60% improvement in Theta JA (compared to
standard TSSOP or SOIC)
• Green materials are standard – Pb-free and RoHS
compliant
New Developments
• Stealth dicing (narrow saw streets)
• Larger/higher density leadframe strips
• Leadframe roughening for improved MSL capability
Services and Support
Amkor has a broad base of resources available to help
customers bring quality new products to market quickly and
at the lowest possible cost.
• Full package characterization
• Thermal, mechanical stress and electrical performance
modeling
• Turnkey assembly, test and drop ship
• World class reliability testing and failure analysis
Visit Amkor Technology online for locations and
to view the most current product information.
Pkg
Body Size
(mm)
Pad Size
(mm)
TSSOP 16 ld*
TSSOP 20 ld
TSSOP 28 ld*
TSSOP 56 ld*
MSOP 8 ld*
SOIC 8 ld
4.4 x 5.0
4.4 x 6.5
4.4 x 9.7
6.1 x 14
3.0 x 3.0
3.9 x 4.9
3.0 x 3.0
3.0 x 4.2
3.0 x 5.5
4.7 x 5.5
1.73 x 2.39
2.3 x 2.3
ΘJA (°C/W) by Velocity (LFPM)
0
200
500
37.6
32.3
30.2
37.6
32.3
29.9
37.0
32.0
29.0
33.5
30.0
28.0
38.0
33.0
31.0
58.6
52.1
49.4
* = Estimated
JEDEC Standard Test Boards
Electrical Performance
Pkg
TSSOP 16 ld*
TSSOP 20 ld
TSSOP 28 ld*
TSSOP 56 ld*
MSOP 8 ld*
Body Size
(mm)
Pad Size
(mm)
4.4 x 5.0
4.4 x 6.5
4.4 x 9.7
6.1 x 14
3.0 x 3.0
3.0 x 3.0
3.0 x 4.2
3.0 x 5.5
4.7 x 5.5
1.73 x 2.39
Center
Inductance
(nH)
1.58
1.68
1.70
1.90
1.50
Corner
Inductance
(nH)
2.28
2.45
2.65
2.85
2.20
* = Estimated
Simulated Results @ 100 MHz
Reliability Qualification
Amkor package qualification uses three independent production lots and a
minimum of 77 units per test group. All testing includes JSTD-020 moisture
preconditioning.
• Moisture Sensitivity
JEDEC Level 1, 85°C/85% RH, 168 hrs
Characterization
JEDEC Level 3, 30°C/60% RH, 192 hrs
• uHAST130°C/85% RH, No Bias, 96 hrs
• Temp Cycle
-65°C/+150°C, 500 cycles
• High Temp Storage
150°C, 1000 hours
Process Highlights
•
•
•
•
•
Pcc wire bonding standard, Ag wire available
Wafer backgrinding services available
Multiple die and die stacking capability
NiPdAu (PPF) or Matte Sn lead finish options
Laser mark on package body
DS571K
Rev Date: 3/15
Questions? Contact us: [email protected]
Data Sheet
LEADFRAME
ExposedPad
TSSOP/MSOP/SOIC/SSOP
Test Services
Cross-section ePad SOIC
• Program generation/conversion
• Wafer probe
• Burn-in capabilities
•-55°C to +165°C test available
•Strip test available
Mold Compound
Mold Compound
Wirebond
Die
Clear anti-static tube, 20 inch
Tape and reel
Dry pack
Drop ship
Wirebond
Cu Leadframe
Cu Leadframe
Shipping
•
•
•
•
Cross-section ePad TSSOP
Die Attach
Adhesive
Die
Die Attach
Adhesive
Exposed Pad
Exposed Pad
Ground Bond
Configuration Options
ePad TSSOP, ePad MSOP, ePad SOIC, ePad SSOP Nominal Package Dimensions (mm)
Package
Type
Lead
Count
Body
Width
Body
Length
Body
Thickness
Standoff
Overall
Height
Lead
Pitch
Tip-to-Tip
JEDEC
8
4.4
3.0
0.90
0.10
1.00
0.65
6.40
MO-153
14
4.4
5.0
0.90
0.10
1.00
0.65
6.40
MO-153
16
4.4
5.0
0.90
0.10
1.00
0.65
6.4 0
MO-153
20
4.4
6.5
0.90
0.10
1.00
0.65
6.40
MO-153
24
4.4
7.8
0.90
0.10
1.00
0.65
6.40
MO-153
28
4.4
9.7
0.90
0.10
1.00
0.65
6.40
MO-153
38
4.4
9.7
0.90
0.10
1.00
0.50
6.40
MO-153
48
6.1
12.5
0.90
0.10
1.00
0.50
8.10
MO-153
56
6.1
14.0
0.90
0.10
1.00
0.50
8.10
MO-153
8
3.0
3.0
0.85
0.10
0.95
0.65
5.00
MO-187
10
3.0
3.0
0.85
0.10
0.95
0.50
5.00
MO-187
ePad
SOIC
8
3.9
4.9
1.47
0.05
1.52
1.27
6.00
MS-012
16
3.9
9.9
1.47
0.05
1.52
1.27
6.00
MS-012
ePad
SSOP
36
7.6
10.3
2.28
0.05
2.45
0.50
10.40
MO-271
ePad
TSSOP
ePad
MSOP
Visit Amkor Technology online for locations and
to view the most current product information.
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not
be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s
warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name
and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2015, Amkor Technology Incorporated. All Rights Reserved.
DS571K
Rev Date: 3/15
Questions? Contact us: [email protected]
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