TSON8-FL Data Sheet

Data Sheet
POWER PRODUCTS
TSON8-FL
Process Highlights
Introduction
TSON8-FL (Flat Lead) is a smaller package (3.3 x 3.3 mm)
with thermally enhanced that gives a 64% reduction in
footprint area compared with standard SOIC 8 ld package,
yet an equivalent maximum permissible power dissipation
capability.
This package may also be know as:
•TSON-Adv
•PowerFLAT™ 3.3 x 3.3
•TSDSON
•miniHVSON
•PowerPAK® 1212-8
• JEDEC: MO240 BA
Application
TSON8-FL is suitable for medium-power applications,
designed for low on-resistance and high-speed-switching
MOSFETs:
• Battery protection circuits
• Notebook PCs
• Portable electronic devices
• DC-DC converters
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•
•
•
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Bare copper leadframe with no plating
Die attach: 55 um thin die pick up capability
Interconnect: Cu clips technology for better electrical and thermal
performance. Also available on Al strap + wire option.
Plating: 100% matte Sn
Marking: Pen type laser
Standard Materials
• Leadframe: Bare copper
• Die attach: Solder paste*
• Interconnect: 3 options,
–Dual Cu clips
–Al strap + Cu wire
–Multiple Cu wires
• Mold compound: Halogen free
*Apply to option dual Cu clips.
Reliability Qualification
Amkor devices are assembled with proven reliable semiconductor materials.
• All test include pre-condition of: Ta = 85°C/Rh = 85%, 72 hrs with IR reflow
Ta = 265°C, 2X
• High Temperature Storage, Ta = 150°C, 1000 hrs
• Pressure Cooker, Ta = 121°C/Rh = 100%/P = 2 atm, 96 hrs
• Temperature Cycle, -65~150°C, 300 cycles
Test Service
• Small and thermally enhanced package with the same
power dissipation but 64% less footprint area than
SOIC 8 ld
• Dual Cu Clip interconnect for better heat dissipation
efficiency
• Al strap + wire option is also available
• Turnkey with test and packing services
• Green materials: Pb-free plating & halogen free mold
compound
Amkor offers full turnkey business for all power discrete products. We have
the capability to test various type of power devices including MOSFETs,
bipolar transistors, IGBTs, diodes, regulator ICs/intelligent power devices, etc.
• Amkor power discrete test capability:
–Static test (DC)
–Dynamic test (AC, Switching/Trr, Capacitance/Rg)
–Destruction test (Inductive load/VSUS, I Latch, Surge, Isolation/VIL)
–Thermal Resistance (ΔVDS, ΔmV, etc.)
• Program generation/conversion
• Failure analysis
• Available test/handling technology
• Integrated marking, vision inspection and tape & reel services
New Developments
Shipping
Features
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•
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Dual exposed pad for better thermal performance
Thin wafer dicing with narrow saw streets
Larger/higher density leadframe strips
Environmentally friendly Pb-free solder paste
Visit Amkor Technology online for locations and
to view the most current product information.
• Tape and reel packing
–3000 pcs or 5000 pcs per reel
–Tape width 12 mm
–Reel Ф = 330 mm
• Barcode packing label
• Drop ship
DS612B
Rev Date: 2/16
Questions? Contact us: [email protected]
Data Sheet
POWER PRODUCTS
TSON8-FL
Package Outline Drawing TSON8-FL
Cross-section – Option 1: Dual Cu Clip
Cross-section – Option 2: Al Strap + Wire
Cross-section – Option 3: Multiple Cu Wires
Visit Amkor Technology online for locations and
to view the most current product information.
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not
be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s
warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name
and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2016, Amkor Technology Incorporated. All Rights Reserved.
DS612B
Rev Date: 2/16
Questions? Contact us: [email protected]